New automotive cameras from Tier IV bring advanced imaging to autonomous vehicles

TIER IV’s C1 and C2 cameras are designed to deliver exceptional image quality for autonomous vehicles, even in challenging lighting conditions. Featuring a high dynamic range of 120 dB and anti-reflective coatings, the cameras ensure reliable imaging data acquisition in any environment.

The C1 is a 2.5 MP high dynamic range camera and is equipped with LED flicker mitigation, it manages varying light conditions from traffic signals, signs, headlights, and taillights, enhancing operational efficiency. GMSL2 output interface ensures excellent image quality with high bandwidth and low latency. The C2 maintains the performance of the C1 while boosting resolution to 5.4 MP, enabling object recognition at greater distances and with a wider field of vision.

Both cameras are compatible with Autoware, TIER IV’s open-source autonomous driving operating system. Camera driver, ROS driver and multiple applications are available as open source software, streamlining their integration into the vehicle architecture.
Optimised for reliability and performance in diverse and challenging environmental conditions, the cameras offer high-precision imaging, robust sensor fusion capabilities and real-time data processing.

TIER IV’s automotive-grade cameras are being distributed in Europe exclusively by Digiflec, a UK supplier of autonomous imaging technologies, 3D Lidar sensors and digital services.

For more information on TIER IV cameras available through Digiflec, please visit: https://digiflec.com/tier-iv

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DigiKey debuts city digital season 4 video series focused on AI

DigiKey, has announced the release of Season 4 of the City Digital video series, “AI in the Smart World,” sponsored by Molex and STMicroelectronics. The new season of the three-episode series will explore different aspects of artificial intelligence (AI) integration, from infrastructure and transportation to environmental monitoring and public services.

DigiKey launched Season 4 of its City Digital video series centred on AI in smart cities.
Season 4 also highlights AI and the transformative role it plays in shaping modern cities. Today’s hardware and software innovations will power the integration of AI into tomorrow’s urban fabric, with an aim to enhance efficiency, sustainability and quality of life.
“The use cases of AI in smart cities are just starting to scratch the surface and will play a crucial role in creating smarter, more sustainable and liveable cities,” said Josh Mickolio, technology business development manager for DigiKey. “Our partnership with suppliers like Molex and STMicroelectronics provides engineers and designers with access to the newest technologies and components to build the devices and systems that will propel smart cities into the future.”

The first of three videos in the series, “The Intelligent Backbone,” examines the crucial role of AI in modernising urban infrastructure. From smart buildings equipped with AI-driven energy systems to the deployment of intelligent traffic control and the use of AI in monitoring critical infrastructure, this episode reveals how AI is becoming the backbone of efficient and sustainable urban living.

The second video, “On the Move,” will explore how AI is revolutionising the way people and goods move through their environments. Advancements in autonomous vehicles, smart traffic management systems and AI-powered public transit demonstrate how these technologies can make transportation safer, faster and more environmentally friendly.

The third and final video, “The Responsive City,” will explore AI’s role in enhancing public services and environmental monitoring. It covers AI’s potential influence on waste management, predictive maintenance of public utilities, and the ability to monitor and respond to environmental changes. The episode also highlights how AI will help in creating more responsive and adaptive urban environments.

https://www.digikey.com

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dSPACE works with AWS to drive innovation in autonomous driving with generative AI

dSPACE, and an Amazon Web Service (AWS) Automotive Competency Partner, is developing an advanced scenario generation solution by leveraging generative AI technologies from Amazon Web Services (AWS).

The new scenario generation feature, which dSPACE is developing with support from the AWS Generative AI Innovation Centre, will be integrated into the dSPACE portfolio for SIL/HIL testing and data-driven development. It is based on a large language model (LLM) available on Amazon Bedrock and retrieval-augmented generation (RAG) architecture, which leverages scenario data provided by dSPACE. As a result, users will be able to easily create a vast number of complex and realistic scenarios, including edge cases according to the ASAM OpenSCENARIO standard, simply by entering a textual scenario description. This allows automotive manufacturers and suppliers to simulate and validate their autonomous driving systems more comprehensively and efficiently, reducing the time and cost associated with physical prototyping and testing.

dSPACE’s collaboration with AWS and the integration of generative AI technologies into dSPACE products pave the way for more comprehensive and efficient validation pipelines, ultimately contributing to safer autonomous vehicles.

http://www.dspace.de

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Infineon extends its AIROC Wi-Fi 6/6E portfolio

Infineon has announced the company’s new AIROC CYW5591x connected microcontroller (MCU) product family. The new family integrates robust, long-range Wi-Fi 6/6E and Bluetooth Low Energy 5.4 along with a secured and versatile MCU to allow customers to build cost-optimised, power-efficient, small form-factor products for smart home, industrial, wearables, and other IoT applications. The flexible platform accelerates customers’ time-to-market with ModusToolbox software, RTOS and Linux host drivers, a fully validated Bluetooth stack and multiple sample code examples, Matter software enablement, and support for Infineon’s worldwide partner network.

This flexible device family can be used as the main processor in an IoT device or as a subsystem in more complex designs to fully offload connectivity for IoT applications. The product family is available in three versions: CYW55913 for tri-band (2.4/5/6 GHz), CYW55912 for dual-band (2.4/5 GHz), and CYW55911 for single-band (2.4GHz) support.
Key features
• An Arm Cortex M33 192MHz MCU with TrustZone CC312 with 768 KB SRAM
• Quad-SPI with XIP with on-the-fly encryption/decryption for FLASH and PSRAM
• 1×1 Tri-Band (2.4/5/6 GHz) 20MHz Wi-Fi 6/6E (802.11ax)
• Up to +24 dBm transmit power for Wi-Fi for best-in-class range
• Supports 6 GHz (Wi-Fi 6E) greenfield spectrum for lower congestion and reduced latency
• Matter-over-Wi-Fi support
• Bluetooth Low Energy 5.4 supports Bluetooth low energy 2 Mbps, LE Long Range, Advertising Extensions, and Advertising code selection for LE Long Range
• Bluetooth Low Energy range and power are also optizized with up to +19 dBm transmit power
• Best-in-class LE Longe Range sensitivity of -111.5 dBm
• Extensive peripherals and GPIO support: 3xSCB(I2C/SPI/UART), TCPWM, 7 channel 12-bit ADC, Digital Microphone support, TCM (I2S/PCM), and up to 47 GPIOs
• Hardware support for AES, RSA, ECC, ECDHA, ECDSA, Root-of-Trust
• Multi-layer security supporting lifecycle management, secured boot with firmware authentication and encryption, anti-rollback, crypto key establishment, and management
• PSA Level 2 Certifiable

https://infineon.com

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