Omnivision launches newest generation of the World’s smallest shutter image sensor

Omnivision has announced the new OG0TC BSI global shutter (GS) image sensor for eye and face tracking in AR/VR/MR consumer headsets and glasses. For the first time ever, Omnivision is bringing its patented DCG high dynamic range (HDR) technology to the AR/VR/MR market in the 2.2-micron (µm) pixel OG0TC GS image sensor.

With a package size of just 1.64mm x 1.64mm, the OG0TC is an ultra-small and low-power image sensor for optimizing primarily inward-facing tracking cameras. This small form factor is key to industrial designs as multiple cameras are required for tracking all aspects of the face (eyes, brows, lips, etc.). The OG0TC is pin-to-pin compatible with Omnivision’s previous-generation BSI GS image sensor for easy upgrades.

“Ultra-low power consumption is critical for AR/VR battery-powered devices, and our OG0TC BSI GS image sensor reduces power by more than 40% over our previous-generation OG0TB sensor, which is already an extremely low-power device,” says Devang Patel, marketing director – IoT/Emerging, Omnivision. “Pin-to-pin compatibility makes the upgrade to the OG0TC easy for our customers, so they do not need to make any change to their design to save power and enjoy new features like DCG™ technology.”

Key features of the OG0TC image sensor include:
● The sensor is built on Omnivision’s PureCel Plus-S stacked-die technology.
● It features Omnivision’s patented DCG HDR technology and offers 400×400 resolution with a 2.2µm pixel in a 1/14.46-inch optical format.
● Nyxel technology enables the best quantum efficiency at the 940nm near-infrared (NIR) wavelength for sharp, accurate images of moving objects.
● It consumes less than 40% of the power at 30 frames per second (fps) compared with the previous-generation sensor.
● The sensor’s high modulation transfer function enables sharper images with greater contrast and more detail.
● It supports a flexible interface, including MIPI with multi-drop, CPHY, etc.

Patel adds, “We are excited to introduce our single-exposure DCG HDR technology for ghost-free image capture to the AR/VR market. It already has proven to be extremely successful in the security, mobile and automotive industries.”

https://www.ovt.com

 

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Polarised power relay from Panasonic for smart lighting and IoT applications

The DW-YL is Panasonic Industry’s latest addition to the DW range of Polarised Power Relays. Providing an up-to-20A of latching relay functionality, the DW-YL series is specifically designed for demanding applications with high inrush currents. They can handle up to 320A for 1.2ms, making them ideal for capacitive loads and other scenarios where robust inrush current handling is required.

Its compact PCB footprint of just 10mm wide ensures minimal space usage, allowing for more efficient design layouts The one or two coil latching design minimises power consumption nearly to zero, making these relays energy-efficient for applications and devices that are designed to fulfil modern sustainability requirements.

With a TV8 rating, the DW-YL relays offer high performance and durability, capable of handling up to 320A inrush current. Additionally, their low profile of just 15.8mm makes them suitable for applications where space is at a premium. These relays are also UL/C-UL and VDE certified, ensuring compliance with international standards.

The DW-YL series is particularly suitable for a variety of applications in lighting, IoT devices, and power distribution units (PDUs). In lighting, these relays can be used in electrical ballasts, smart lighting systems, and LED drivers where high inrush currents are common. For IoT applications, DW-YL relays are ideal for smart plugs and smart switches, providing reliable performance in compact devices. In PDUs, these relays can be used in multi-outlet power strips to ensure safe and efficient power distribution.

https://industry.panasonic.eu

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Farnell now stocks Murata’s UWB and LoRa modules

Farnell is now offering Murata’s latest UWB and LoRa connectivity modules for convenient wireless integration. These modules are designed to simplify wireless development and certification, making it easier to incorporate wireless capabilities into a wide range of applications.

Murata’s UWB modules provide high-accuracy location functionality with UWB tag and anchor functions in compact packages. These modules feature integrated RF front ends, simplifying the implementation process and reducing the need for extensive RF expertise. This allows developers to seamlessly incorporate advanced location capabilities into their applications..

Additionally, Murata’s LoRa modules offer a compact, integrated solution with an embedded MCU. Developers have the flexibility to utilise the MCU as the Host for an End Node, providing customisation possibilities for various projects.

The technology enables location accuracy in the order of 0.1m for indoor or outdoor applications. The UWB Modules available at Farnell include:

• FiRa certified UWB module, Type 2BP is the ultra small UWB module which includes NXP’s SR150 UWB chipset, clock, filters and peripheral components. Ideally suited for general IoT devices including battery operated devices.
• UWB module with integrated BLE wireless MCU, Type 2AB is designed as ultra-small, high quality and lower power consumption module. It can be operated on the wireless MCU making this a suitable part for wearables and applications where size is critical
• UWB tag module with integrated BLE wireless MCU. Type 2DK is an all-in-one UWB + Bluetooth LE combo module which integrates NXP Trimension SR040 UWB Chipset, NXP QN9090 Bluetooth LE + MCU chipset, on board antenna and peripheral components. Ideally suited for UWB Tag/Tracker which operates by coin-cell battery, and general IoT devices.

The Murata Type 1SJ LoRa Modules are some of the smallest LoRa Modules in the line-up and include the Semtech SX1262 LoRa Connect Transceiver IC and ST Microelectronics STM32L0 MCU to provide customers with a Regulatory Certified Module that can be used as the core of a LoRa End Node product design. The LoRa modules available at Farnell include:

• LoRa OpenMCU Module, Type 1SJ-295 supplied as an OpenMCU configuration to allow custom Application to be flashed to integrated MCU, together with LoRa Stack.
• LoRaWAN Modem Module, Type 1SJ-6868 pre-flashed with modem Firmware and EUI to support LoRaWAN operation by AT Commands.
• LoRa Module Evaluation Kit to support development and verification for both OpenMCU and Modem configurations of Module.

https://uk.farnell.com

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ST BrightSense image sensor ecosystem for advanced camera performance

ST has introduced a set of plug-and-play hardware kits, evaluation camera modules and software that ease development with its ST BrightSense global-shutter image sensors. The ecosystem lets developers of mass-market industrial and consumer applications ensure superior camera performance by designing-in ST BrightSense image sensors. By sampling all pixels simultaneously, unlike a conventional rolling shutter, global-shutter sensors can capture images of fast-moving objects without distortion and significantly reduce power when coupled to a lighting system.

ST BrightSense CMOS global-shutter sensors implement advanced backside-illuminated pixel technology. Their high sensitivity enhances low-light performance and permits fast image capture, enhancing responses such as obstacle avoidance in mobile robots and face recognition in personal electronics. The sensors’ advanced 3D-stacked construction allows an extremely small die area, easing integration anywhere space is limited especially in the final optical module, while enriching the products with advanced on-chip image processing for auto-exposure, correction, and calibration. Their MIPI-CSI-2 interface makes them ideal for embedded vision and edge AI devices.

ST’s cutting-edge sensor technologies are now available in a wide variety of markets through the ST BrightSense portfolio, highlighting industrial-grade products and 10-year longevity commitment. Widespread access to these sensors now lets developers bring high-performance machine vision to applications that face strict size and power constraints and challenging operating conditions. These include factory automation, scanning, domestic and industrial robots, VR/AR equipment, traffic monitoring, and medical devices.

ST’s new mass-market offering includes evaluation camera modules that integrate image sensor, lens holder, lens, and plug-and-play flex connector to enable instant integration of the image sensors. The modules offer a selection of tiny form factors down to 5mm2, various lens options to suit different application requirements, and a plug-and-play connector that allows easy swapping. A series of hardware kits helps developers integrate the sensors with various desktop and embedded computing platforms. Complementary software tools are available for free download on ST’s website, such as a PC-based GUI and Linux drivers that assist integration with popular processing platforms including STM32MP2 microprocessors.

The ST BrightSense global-shutter family currently comprises the VD55G0, VD55G1, and VD56G3 monochrome sensors with resolution from 0.38Mpixel to 1.5Mpixel, as well as the color VD66GY with 1.5Mpixel. The sensors, along with their evaluation camera modules, and development boards are in production now.

https://www.st.com/brightsense

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