Smart Cities

Based on AMD’s EPYC 7003 processor, Tynan Transport CX data centre servers raise efficiency and performance enhancements in hardware, security and memory density for modern data centres, says MiTac Computing Technology.

“Tynan’s . . . server platforms powered by 3rd Gen AMD EPYC processors enable businesses to make more accurate decisions with higher precision,” said Danny Hsu, vice president of MiTac Computing Technology.

The EPYC 7003 series processors provide the performance needed in the heart of the enterprise to help IT professionals drive faster time to results, comments Ram Peddibhotla, corporate vice president, EPYC product management, at AMD.

The high memory capacity, multi-node and data cache servers power the cloud servers. The Transport CX GC79-B8252 and Transport CX GC79A-B8252 are 1U dual-socket server platforms for high-density data centre deployment with a variety of memory-based computing applications.

Two systems feature 32 DDR4 DIMM slots, two standard PCIe Gen 4 x16 expansion slots, and an OCP 3.0 LAN mezzanine slot. The GC79-B8252 platform provides four 3.5-inch SATA drive bays and four 2.5-inch NVMe drive bays with tool-less carriers, while the GC79A-B8252 platform offers 12 2.5-inch drive bays with up to 12 NVMe U.2 support.

The Transport CX GC68-B8036-LE and Transport CX GC68A-B8036are cost-optimised single-socket cache server platforms featuring 16 DDR4 DIMMs, a pair of PCIe Gen.4 x16 expansion and an OCP 2.0 LAN mezzanine slot in 1U. The GC68-B8036-LE supports four 3.5-inch SATA and four 2.5-inch tool-less NVMe drive bays for large storage capacity while the GC68A-B8036 accommodates 12 2.5-inch tool-less drive bays with support for up to 12 NVMe U.2 devices for applications with high storage performance requirements.

Also included in the announcement is the Transport CX TN73-B8037-X4S. This a 2U multi-node server platform with four front-serviced compute nodes. Each node supports one AMD EPYC 7003 Series processor, four 2.5-inch tool-less NVMe/SATA drive bays, eight DDR4 DIMM slots, three internal cooling fans, two standard PCIe Gen.4 x16 expansion slots, two internal NVMe M.2 slots and one OCP 2.0 LAN mezzanine slot. The platform is suited for high-density data centre deployments and targets scale-out applications with large numbers of nodes.

For accelerate computational workloads in high performance computing (HPC), artificial intelligence (AI) and deep learning, there is the Transport HX range. The

Transport HX TN83-B8251 is a 2U four-GPU server with two CPUs, two PCIe 4.0 x16 high-speed networking cards, and eight 3.5-inch hot-swap SATA or NVMe U.2 tool-less drive bays. The platform supports up to four double-width GPU cards that can be used to scale up the number of GPUs to improve HPC and deep learning performance, advises MiTac.

The Transport HX TS75-B8252 and Transport HX TS75A-B8252 are 2U dual-socket server platforms with support for 32 DIMM slots and up to nine PCIe 4.0 slots. The HX TS75-B8252 accommodates 12 hot-swap, tool-less 3.5-inch drive bays with up to four NVMe U.2 support; TS75A-B8252 accommodates 26 hot-swap, tool-less 2.5-inch drive bays with up to eight NVMe U.2.

Hybrid software-defined storage servers in the Transport SX range deliver large I/O and memory bandwidth for storage applications. The Transport SX TS65-B8253 is a 2U hybrid software storage server for various data centre and enterprise deployment supporting the dual-socket AMD EPYC 7003 series processor, 16 DDR4 DIMM slots and seven standard PCIe 4.0 slots. The platform is equipped with up to two 10GbE and two GbE onboard network connections, 12 front 3.5-inch tool-less SATA drive bays, up to four NVMe U.2 devices, and two rear 2.5-inch tool-less SATA drive bays for boot drive deployment.

There is also drop-in AMD EPYC 7003 series processor support for existing EPYC 7002 series processor-optimised servers via a BIOS update.

http://www.tyan.com

For 5G phones and other data-intensive mobile applications, Kioxia believes it offers the world’s thinnest embedded flash memory. The 1Tbyte universal flash storage (UFS) version 3.1 embedded flash memory is housed in a 1.1mm-high package.

Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. JEDEC is a registered trademark of JEDEC Solid State Technology Association.

The memory uses Kioxia’s BiCS Flash 3D flash memory. It achieves sequential read speed of up to 2,050Mbytes per second and sequential write speed of up to 1,200Mbytes per second.

5G networks will be characterised by faster downloads and reduced lag time for high performance and low power consumption. 5G also makes it easier and faster for users to store more on mobile devices. The 1Tbyte UFS integrates the BiCS FLASH 3D flash memory and a controller, which performs error correction, wear levelling, logical-to-physical address translation and bad-block management for simplified system development.

The UFS 1Tbyte memory includes WriteBooster which enables significantly faster write speeds, the Host Performance Booster (HPB) Ver. 2.0 which improves random read performance by using the host side memory to store logical to physical translation tables. HPB 1.0 enables 4kbyte chunk size access and Version 2.0 enables wider access which can further boost random read performance.

Universal Flash Storage (UFS) is a product category for a class of embedded memory products built to the JEDEC UFS standard specification. JEDEC is a registered trademark of JEDEC Solid State Technology Association.

Kioxia Europe (formerly Toshiba Memory Europe) is the European-based subsidiary of Kioxia, a supplier of flash memory and solid-state drives (SSDs). The company invented flash memory and BiCS Flash, the 3D flash memory technology, which is shaping the future of storage in high density applications, including advanced smartphones, PCs, SSDs, automotive and data centres.

http://www.kioxia.com