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Renesas concentrates on communications for RA6 series microcontroller additions

Thu, Apr 01, 2021

The RA6M5 group of microcontrollers completes Renesas Electronics’ RA6 series Arm Cortex M33-based devices. The company has added 20 microcontrollers to complete the RA6 series. The RA6M5 group of microcontrollers offer communications options, generous on-chip memory, and what Renesas claims to be best-in-class security features.

Communications interface options include CAN FD, Ethernet MAC with DMA, USB full speed and high speed, and multiple serial interfaces. Renesas claims that designers of IoT systems will have “unmatched flexibility” in sharing critical data using the RA6M5 Group.

The new microcontrollers integrate up to 2Mbyte of on-chip flash and 512kbyte on-chip RAM. They also provide an OctaSPI which enables designers to extend the on-chip flash and RAM. The microcontrollers also support error correction code (ECC) in the RAM.

The memory block swap feature and intrinsic security in the RA devices are claimed to make the RA6M5 group particularly suitable for in-field firmware update applications. After new firmware is written to the flash using background operation, a selectable amount of 32kbyte flash blocks can be swapped to the new firmware.

The RA6M5 microcontrollers have an Arm Cortex-M33 core based on Armv8-M architecture. They feature Arm TrustZone technology and Renesas’ secure crypto engine. The engine incorporates multiple symmetric and asymmetric cryptography accelerators, advanced key management, security lifecycle management, power analysis resistance, and tamper detection.

They are also characterised by very Low power consumption of 107 microA/MHz in active mode (running the CoreMark algorithm from flash at 200MHz) and 30 microseconds wake up time.

The microcontrollers are scalable from 100- to 176-pin LQFP packages and also available in 176-ball BGAs.

The RA6M5 group is supported by the Flexible Software Package (FSP), which includes a best-in-class HAL driver, says Renesas. The FSP uses a graphical user interface (GUI) to simplify and accelerate the development process, while also making it easy for customers to transition from an original 8/16-bit microcontroller design. Designers using the RA6M5 microcontrollers also have access to the extensive Arm partner ecosystem, offering a wide range of tools that help speed time-to-market.

The RA6M5 microcontrollers and the EK-RA6M5 evaluation kit (RTK7EKA6M5S00001BE) are available now from Renesas and its worldwide distributors.

http://www.renesas.com

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Anritsu and MediaTek achieve FR1+FR2 dual connectivity for 5G rollout

Thu, Apr 01, 2021

Achieving what is claimed to be an industry first, Anritsu announces that its radio communication test station MT8000A has achieved a downlink throughput over 7Gbits per second using FR1+FR2 dual connectivity and 256QAM in 5G standalone mode in conjunction with MediaTek’s M80 5G modem. This increased data throughput is cited as a key factor in facilitating mobile services and new services for 5G.

FR1+FR2 DC combines FR1 and FR2 technologies to improve data throughput per user by grouping cell base stations with different frequency ranges to transmit data. The 256QAM technology uses RF and signal processing technologies to support faster communications by sending 8-bits of data in a single symbol.

The combination of FR1+FR2 DC technology with 256QAM supporting downlink throughput speeds greater than 7Gbits per second represents an important milestone in future growth of 5G services, says Anritsu.

The radio communication test station MT8000A supports RF and protocol testing, functional and application operation testing and beam characteristics testing. In addition to supporting both NSA and SA-mode base station simulation functions required for development of 5G chipsets and terminals, it also covers FR1 frequency bands, including 600MHz, 2.5, 3.5, 4.5 and 6.0GHz unlicensed bands, as well as the FR2 24, 28, 39 and 43GHz mmWave bands, to support all the main bands used by 5G services.

It also supports the functions required for high-speed communications, such as 4 x 4 MIMO in FR1, 8CC and 256QAM in FR2 and the latest 3GPP Release 16 features. The MT8000A can be configured using a simple user interface and software to test device performance.

MediaTek is a global fabless semiconductor company that enables nearly 2bn connected devices a year. It develops SoCs for mobile device, home entertainment, connectivity and IoT products for mobile technologies, automotive solutions and a broad range of advanced multimedia products such as smartphones, tablets, digital televisions, 5G, voice assistant devices (VAD) and wearables.

Anritsu provides communications test and measurement products and engages customers to help develop wireless, optical, microwave/RF, and digital solutions for R&D, manufacturing, installation, and maintenance applications, as well as multi-dimensional service assurance solutions for network monitoring and optimisation. Anritsu also provides precision microwave/RF components, optical devices, and high-speed electrical devices for communication products and systems. The company develops advanced solutions for 5G, M2M, IoT, as well as other emerging and legacy wireline and wireless communication markets.

http://www.anritsu.com

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Renesas combines pre-regulator and PMIC for ADAS camera systems

Wed, Mar 31, 2021

A 42V synchronous buck pre-regulator is combines with a seven-channel power management IC (PMIC) in a power and functional safety solution for systems based on the R-Car V3H SoC for advanced driver assistance systems (ADAS) automotive front cameras and driver monitor cameras.

Renesas has combined the RAA271050 42V synchronous buck pre-regulator that accepts the vehicle’s 12V supply and steps it down to an intermediate supply voltage of 3.3 or 5.0V. The seven channel power RAA271000 PMIC takes the RAA271050’s output and steps it down further to the various supply voltages needed by R-Car V3H and its peripherals such as LPDDR4 memory.

Both devices were developed per the ISO-26262 standard, and can support system safety requirements up to ASIL D. The solution satisfies all the power and functional safety requirements for the R-Car V3H, says Renesas. It provides supply voltages with the current capability to meet all power specifications, including sequence, voltage accuracy, and load step response. It also provides all the necessary power and digital monitoring functions.

According to Renesas the combination provides best-in-class efficiency, with power loss reductions of up to 33 per cent compared to competitive PMICs under comparable operating conditions. Lower power loss enables operation at higher temperatures, reduces cooling costs and improves reliability. The RAA271050 and RAA271000 were designed to match R-Car requirements with no unnecessary overhead, reducing both component cost and PCB area. Reference hardware includes the new components, speeding design time and reducing testing requirements for customers.

The R-CAR V solution includes programmable output voltage, sequencing, I/O configuration and safety configuration. The integrated 12-bit SAR ADC has up to 16 external inputs monitors internal and external signals, eliminating the need for an added system ADC.

Dynamic voltage frequency scaling (DVFS) adjusts output voltage to minimise power consumption and there is optional spread spectrum clocking which mitigates EMI. Support for R-Car V3H SoC activation streamlines the SoC self-test procedures, adds Renesas.

The RAA271050 and RAA271000 are included in an ADAS front camera solution featuring the EagleCam camera module from Lupa-Electronics and Renesas’ R-Car V3H and R-Car V3M SoCs.

The RAA271050 is offered in a 22-lead, 4.0 x 4.0mm QFN package. The RAA271000 is packaged in a 60-ball FCBGA with 0.8mm pitch. Both devices are sampling today and are expected to be fully available in July 2021.

http://www.renesas.com

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5G NR module has C-V2X for autonomous driving

Wed, Mar 31, 2021

Obstacles to overcome in automotive communication systems that make use of V2X (vehicle to everything) systems and 5G technology are raising communication functionality to meet V2X’s complex processing that can lead to modules overheating. Modules also tend to get bigger with increased functionality, creating a need to optimise module design for mounting to customer circuits. This complex task is a major barrier to commercialisation, says Alps Alpine.

The UMNZ1 Series 5G NR module for automotive use with C-V2X features complies with 3GPP Release 15. Suppressing heat generation and employing an original structure for greater dissipation of heat inside systems after mounting is claimed to maximise performance. The module is flat, for stability in mounting the device, says the company and it is compatible with frequencies used by specifications worldwide. The UMNZ1 Series module also have optional compatibility with dual SIM dual active (DSDA) devices.

Principal applications are telematics control units (TCUs), V2X on-board units (OBUs) and V2X road-side units (RSUs).

Samples are shipping now for customers to implement in communication solutions based on V2X systems and 5G.

Alps Alpine specialises in Bluetooth and Wi-Fi technology for automotive product development and developing technology for the C-V2X domain, particularly in China, which leads the world in C-V2X deployment. Teaming up with a Chinese C-V2X chip supplier under a mutually complementary production and development partnership agreement, Alps Alpine developed an All In One communication module with a built-in V2X protocol stack and has been involved in interoperability testing in China, as well as ongoing demonstration testing within Wuxi’s designated C-V2X zone.

On January 1, 2019, Alps Electric and Alpine Electronics integrated their businesses and became Alps Alpine. The new company serves the automotive market, mobile devices and consumer electronics, as well as new sectors such as energy, healthcare and industry.

Since 2013 the European head office has been located in Munich and as such co-ordinates the sales, marketing and product engineering activities of offices in Dusseldorf, Stuttgart, Wolfsburg, Paris, Milton Keynes, Coventry, Gothenburg, Frolunda and Milan, as well as the production activities of our manufacturing site in Dortmund.

http://www.alpsalpine.com

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Renesas concentrates on communications for RA6 series microcontroller additions

Anritsu and MediaTek achieve FR1+FR2 dual connectivity for 5G rollout

Renesas combines pre-regulator and PMIC for ADAS camera systems

5G NR module has C-V2X for autonomous driving

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