Reference IP accelerates creation of signal and data processing SoCs

Power signal and data processing SoCs can be created faster and for lower costs, says Sondrel, using its latest reference IP platform.

The SFA 300 reference IP is the latest addition to the. It is a semi-custom SoC design to which a customer’s IP can be added to create a bespoke solution for high performance data processing.

Each SFA 300 reference design has four CPU clusters. Several SFA 300s can be ganged together and synchronised via the PCIe interface to scale the processing performance. There is also the option to integrate accelerators and/or custom logic to further increase performance and minimise power requirements. Developers can use the SFA 300 to tailor designs for processing-intense applications such as 8K video, artificial intelligence (AI), facial recognition for surveillance, smart factories, blockchain servers and medical data analysis.

An ASIC with four CPU clusters is complex to design,” explained Rowan Naylor, a principal engineering consultant at Sondrel. “Moving data around the chip without bottlenecks needs a network on chip, a multi-width data path, internal RAM, scaled and distributed across the design for optimal performance, and data conflict arbitration”. He also went on to explain that data security aspects are required in the Arm-based security sub-system, such as activity/intrusion detection. These function are in the SFA 300 IP platform, which allows engineers to reduce the design time and costs by up to 30 per cent, declared Naylor.

The SFA 300 framework design enables it to be scaled to suit the application as well as be the basis for different solutions of varied processing power capabilities. The four CPUs can be chosen to suit the processing power need by each of the four channels of the chip because the interconnects on and off the CPUs are standardised. This standardisation of interconnects on the boundaries of IP blocks and the rest of chip enables most other IP blocks such as memory to be also exchanged as required.

If the processing power required is greater than can be achieved by upgrading the processors, then several chips can be ganged together to form a cluster to achieve the processing power required with the limiting factor being the speed of inter-chip communications dropping as more chips are ganged together.

According to Sondrel, this is an inexpensive means of achieving a high-performance solution as it requires just one chip repeated several times rather than a more expensive, single chip solution. Typical performance figures are 4 tera operations per second (TOPS) for each channel for AI and 400 giga operations per second for each channel for DSP.

The SFA 300 can be used for image and video analysis, for example. For a static image, it could find a face or count the number of blood cells on a sample slide and a neural net could provide more sophisticated recognition for data analysis, explained the company. Treating a video as a series of images, it could deduce the direction and speed of an object of interest.

Another use case could be heavy duty number crunching such as for block chains and cryptocurrency mining.

The SPA 300 has low power consumption, making it suitable for battery powered applications, such as a drone. The powerful image processing capabilities and AI enable it to be used as an autonomous drone controller to fly the drone.

The SPA 300 is the third in the company’s Architecting the future IP platforms.

Sondrel offers a full turnkey service that turns designs into fully tested, shipping silicon.

http://www.sondrel.com

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Impulse Embedded supports AI processing with Nvidia Jetson TX2 NX SBC

Offering more than twice the AI processing performance of the Jetson Nano, Nvidia’s Jetson TX2 NX single board computer (SBC) is designed for mass-market articial intelligence (AI) platforms. The SBC is now available from Impulse Embedded. According to the industrial computing systems and solutions provider, the Jetson TX2 NX delivers the next step in AI performance for entry-level embedded and edge products.

It has the same form factor and is pin compatible with the Jetson Nano, but offers more than twice the AI processing performance at 1.33tera floating operations per second (TFlops) compared to 487GFlops.

The Nvidia Jetson TX2 NX SBC combines a dual-core Nvidia Denver 2 64-bit CPU, a quad-core Arm Cortex-A57 MPCore processor and a 256-core Pascal GPU that can operate at up to 1.3GHz. It also has 4Gbyte of 128-bit LPDDR4 memory and 16Gbyte of eMMC 5.1 flash storage. There is also PCI Express expansion, Gigabit Ethernet, a USB3.1 Gen 1 port and video output via HDMI or DisplayPort. The SBC is fully capable of encoding one 4K stream at 60frames per second in HEVC/H.265 or as many as 14 streams in 1080p at 30frames per second in HEVC/H.264.

The TX2 NX, like all Jetson modules and developers’ kits are supported by Nvidia’s JetPack software stack for deployment anywhere on any Jetson device.

Impulse Embedded’s sales director, Robert Plant, acknowledged that developing industrial AI computing can be “difficult, costly and time-consuming”. The company has embedded systems capabilities to help customers create reliable, repeatable and robust systems to meet budget and time constraints. “With our team of in-house engineers and specialists, all with decades of experience, we can offer fully deployable embedded edge AI computing solutions straight out of the box,” he said.

http://www.impulse-embedded.co.uk

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STi2GAN is STMicroelectronics’ automotive family

Meeting the needs of on-board chargers, lidar for autonomous driving, bi-directional DC/DC converters, Class-D amplifiers, and power conversion systems, STi2GaN is a family of GaN devices from STMicroelectronics.

According to ST, the family combines power and intelligence in compact, high-performance solutions required by the automotive industry as it transitions to electrified platforms.

The family combines a monolithic power stage along with drivers and protection in GaN technology as well as system-in-package (SiP) models for application-specific ICs with additional processing and control circuitry. The STi2GaN devices use ST’s novel bond-wire-free packaging technology to provide high robustness, reliability, and performance.

“STi2GaN continues ST’s long success story in compound materials and smart power product innovation, targeting mainly automotive applications and the needs of high-density, high-reliability and high-power, commented Alfio Russo, group vice president and general manager for low voltage and STI2GaN solutions, macro division, STMicroelectronics. “The new product family aims to leverage the high-power density and efficiency of GaN to offer an industry-unique range of devices in 100V and 650V clusters that ensure scalability, compactness, and outstanding performance,” he added.

STMicroelectronics develops semiconductor technologies and is an independent device manufacturer. It works with over 100,000 customers and thousands of partners to design and build products, solutions, and ecosystems, with technologies for smarter mobility, more efficient power and energy management, and the wide-scale deployment of the IoT and 5G technology.

http://www.st.com

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OmniVision introduces ASIC ISP to support autonomous driving cameras

At AutoSens Detroit 2021, OmniVision will demonstrate its OAX4000 ASIC. This companion image signal processor (ISP) can be used for next-generation automotive single- and multicamera architectures, enabling OEMs to future-proof designs, says the company.

It can be used for automotive applications such as surround-view systems, e-mirrors, interior and autonomous driving cameras. The ASIC is capable of processing data streams from up to four cameras at 3MP or one at 8MP. It supports multiple colour filter array (CFA) patterns and provides the option to output stream for both machine vision and human viewing pipelines independently. The imaging pipeline has been upgraded to provide superior image quality, including a tone-mapping algorithm.

The OAX4000 ISP is compact to fit into a variety of camera architectures and has the processing capacity for a wide variety of camera use cases, said Andy Hanvey, director of automotive marketing at OmniVision.

“The mid- and long-term automotive vision processing market is expected to grow at double digits well into the next decade, however the market for vision processing in automotive is not a one-size-fits all,” observed Tom Hackenberg, principal analyst for Computing and Software in the Semiconductor, Memory and Computing division at Yole Développement (Yole). “The strategies for developing vision processing for advanced driver assistance serving the mass consumer market, shipping and transit, mobility-as-a-service or tomorrow’s autonomous vehicles are all on diverse paths. It can range from smart camera modules to a multitude of basic cameras attached to a single domain controller. It may require integrating other sensors to imaging. What is clear is that there are many paths to vision processing and image processing will need to be rich in features and adaptable to all of these scenarios.”

The OAX4000 is a companion ISP for the OmniVision HDR sensors, designed to provide a complete multi-camera viewing application with fully processed YUV output. It is capable of processing up to four camera modules with 140dB HDR, and is claimed to have leading LED flicker mitigation (LFM) performance as well as high 8Mpixel resolution. It supports multiple CFA patterns, including Bayer, RCCB, RGB-IR and RYYCy. Power consumption is 30 per cent lower than the previous generation.

The OAX4000 reduces the number of electronic control modules required from two to one, reducing design complexity and space, and improving overall reliability.

The OAX4000 complies with ASIL B advanced safety standards. It is available now for sampling and mass production.

OmniVision will present the OAX4000 ISP at AutoSens Detroit, a virtual conference (12 to 13 May, 2021).

OmniVision Technologies develops digital imaging solutions. Its award-winning CMOS imaging technology is used in many of today’s consumer and commercial applications, including mobile phones, security and surveillance, automotive, tablets, notebooks, webcams and entertainment devices, medical and AR, VR, drones and robotics imaging systems.

http://www.ovt.com

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