Smart Cities

AcceleRate arrays support PICMG COM-HPC interconnect data rates

Mon, Jul 19, 2021

Artificial intelligence (AI) accelerators, ASIC emulators and next-gen edge computing benefit from the PICMG COM-HPC Interconnect, says Samtec, at the release of its AcceleRate HP high performance arrays. AcceleRate HP supports 112Gbits per second PAM4 extreme performance in a micro footprint.

Samtec’s AcceleRate HP high performance arrays feature an open pin field array which maximises grounding and routing flexibility. System architects can route high performance differential pairs, single ended signals and high current voltage rails via the same interconnect.

The 2.2, 2.4 and 2.2mm row pitch eases routing of differential signals. Crosstalk is improved with the increased space and with more ground vias around the differential signals.

The arrays include dense 0.635mm pitch, a low profile 5.0 and up to 10mm stack heights. Up to 400 pins are available. Samtec has also published a roadmap to develop arrays with 1,000 or more pins.

The AcceleRate HP high performance arrays are data rate compatible with PCIe 5.0 and 100 GbE. The array has a BGA termination for easy assembly and self-alignment.

Founded in 1976, Samtec is a privately held manufacturer of a broad line of electronic interconnect solutions, including high speed board-to-board, high speed cables, mid-board and panel optics, precision RF, flexible stacking and micro / rugged components and cables.

http://www.samtec.com

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Qi1.3 wireless charging reference design accelerates transmitter development

Thu, Jul 15, 2021

Following swiftly on the heels of the Wireless Power Consortium (WPC)’s Qi 1.3 specification, Microchip has released a compliant reference design. It includes everything needed to quickly develop a Qi 1.3-certified transmitter, says the company.

The Qi 1.3 specification requires authentication for improved safety when transmitting up to 15W of power between a transmitter and a receiver. To meet these requirements, Microchip’s wireless charging reference design includes the necessary tools and support for the seamless integration and certification of wireless charging systems in automotive and consumer applications.

The three-coil Qi 1.3 reference design integrates secure storage subsystem software with the wireless power microcontroller and enables custom topologies and foreign object detection (FOD) implementation.

Microchip is a regular member in the Wireless Power Consortium (WPC) and provided expertise during development of the recently released Qi 1.3 specification. Qi 1.3 mandates hardware-based authentication between transmitter and receiving devices for power transfer above 5.0W. By adhering to the new authentication standard, designers can ensure phones receiving 15W are receiving it from a Qi-certified authenticated transmitter to ensure safety.

The reference design includes a Qi controller, Qi application software, provisioned authentication controller that is a WPC-approved secure storage subsystem and crypto software libraries that execute on the Qi controller. It also includes complete schematics, bill of materials, software and design guidelines. Microchip is partnering with Avnet to make evaluation boards for the Qi reference design available to qualified customers around the world.

The reference design also incorporates MIC4605 and MCP14700 gate drivers, MCP16331 and MCP1725 regulators, an MCP6C02 current sense device, an ATA6563 CAN transceiver and an MCP9700 temperature sensor.

Microchip’s dsPIC33C family of devices run the Qi application software and the company also offers the ECC608/TA100 secure storage subsystem provisioned by Microchip as a licensed WPC Manufacturing Certificate Authority.

The Qi 1.3 wireless charging transmitter reference design is available for demonstrations and evaluations for qualified customers. The company will provide a license agreement to access the reference design software. Evaluation boards for these reference design will be available for purchase for qualified customers through Avnet in August 2021.

https://www.microchip.com   

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Mouser Electronics signs global distribution agreement with Telink Semiconductor

Thu, Jul 15, 2021

Low power radio frequency and mixed signal chips for the IoT from Telink Semiconductor are now available from Mouser Electronics, following the signing of a global distribution agreement.

Mouser will add Telink’s range of SoCs, starter kits and multi-protocol IoT products to its portfolio. Among the highlights of the range are the Telink TLSR827x series of low power, concurrent, multi-protocol IoT devices operating at the ISM 2.4GHz band. The devices support Bluetooth Low Energy 5.1, Bluetooth SIG Mesh, Zigbee, HomeKit, RF4CE, and 2.4GHz proprietary protocols. They are built on a 32-bit RISC-based microcontroller capable of running up to 48MHz and feature up to 32 general-purpose inputs/outputs (GPIOs), including a 14-bit ADC, I²C, SPI, I²S, and stereo audio output.

There is also the TLSR8278 audio RCU (remote control unit) starter kit features a button function and voice command function support and is therefore suitable for RF and IR remote control applications. The starter kit has 27 valid buttons and two-colour indicating LEDs. It also offers Google voice service.

Mouser also offer the TLSR825x series multi-protocol single-chip devices suitable for IoT and human interface device (HID) applications. The low power, concurrent devices support Bluetooth Low Energy 5.0 and up to eight antennae for indoor positioning in addition to standard Bluetooth 5.0 features. Designers can use the TLSR825X devices in a wide range of applications, including wearable devices, wireless toys, advanced remote controls, smart lighting, and smart home products.

Telink’s Kite Mesh Starter Kit is based on the TLSR8258 and features multiple PCBAs to implement Bluetooth Mesh applications. It is suitable for home automation and smart lighting, and includes multiple USB dongles for emulating gateways or mesh nodes, as well as a remote control PCBA to emulate remote controllers or wall switches. The mesh starter kit is supported by a range of PC tools and a software development kit to support rapid development of mesh applications.

https://www.mouser.com

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Analog Devices introduces first in iCoupler digital isolator family

Wed, Jul 14, 2021

The first in a series of iCoupler digital isolators by Analog Devices offers a total bandwidth of 10Gigabits per second. The ADN4624 digital isolator provides four channels at 2.5Gbits per second, allowing data to transfer seamlessly in the electrical domain. It enables new system architectures in digital health, instrumentation and smart industry, says Analog Devices.

The ADN4624 digital isolator streamlines design and integrates isolation for safety or data integrity. At 5.7kV rms isolation and 100 kV/microcsecond CMTI, the compact digital isolator meets medical standards and isolates high fidelity video and imaging links, precision analogue front ends and serial interconnects as an alternative to specialised fibre devices.

According to Analog Devices, the ADN4624 offers simplified connectivity, robust isolation and data integrity in harsh environments. The iCoupler digital isolator provides up to 10Gbits per second bandwidth in a single device. It allows for direct isolation of high-speed serial LVDS or CML at full speed and eliminates the complexity of deserialisation, adds Analog Devices. The ADN4624 enables precision timing with ultra-low jitter to deliver full ADC performance and resolution including precision ADC sampling clocks. Precision timing is less than one picosecond rms random jitter and less than 16 picoseconds skew.

The ADN4624 is available now in a 28-lead SOIC.

http://www.analog.com

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