Neural network detects faces in 12milliseconds

Faces can be detected in video and still images at 12 milliseconds per inference in the Detectum neural network created by Xailient. The IoT face detection system uses Maxim Integrated’s MAX78000 AI microcontroller.

Xailient’s neural network draws 250 times  lower power (at just 280 microJoules) than conventional embedded solutions, and at 12 milliseconds per inference, the network performs in real time and is faster than the most efficient face-detection system available for the edge, claims Maxim.

Battery-powered AI systems that require face detection, such as home cameras, industrial grade smart security cameras and retail solutions, require a low power operation to provide the longest possible time between charges. In addition to supporting standalone applications, Maxim Integrated’s microcontroller paired with Xailient’s neural network improves overall power efficiency and battery life of hybrid edge / cloud applications that use a low power ‘listening’ mode which wakes up the more complex systems when a face is detected.

Xailient’s Detectum neural network includes focus, zoom and visual wake word technologies to detect and localise faces in video and images at 76 times faster rates than conventional software, at similar or better accuracy, says Maxim. The ability to localise a face means that it can be used for advanced applications which determine where a face is in the image’s field of view. Examples include person, vehicle and object counting, presence or obstruction detection, as well as path mapping and footfall heatmaps.

The network can be extended to other applications such as livestock inventory and monitoring, parking spot occupancy and retail or warehouse inventory levels.

Xailient’s neural network combined with the computational efficiency and low power sleep modes of the MAX78000 microcontroller extend the operating time of coin cell battery-powered, hybrid edge/cloud applications for many years, says Maxim.

“AI is on track to be the second largest carbon emitting industry,” said Dr. Shivy Yohanandan, Xailient chief technology office (CTO) and inventor of Xailient’s Detectum neural network technology. “Replacing 14 legacy internet protocol cameras that use traditional cloud AI with edge-based cameras equipped with the Maxim Integrated MAX78000 paired with Xailient’s neural network has the equivalent carbon impact of taking one gasoline powered car off the road,” he said.

The MAX78000 is available now and Maxim also offers the MAX78000EVKIT# evaluation kit.

The Detectum neural network, series models, tools, services as well as focus, zoom and visual wake word technologies are available directly from Xailient.

http://www.maximintegrated.com

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Eight-channel ReDriver has PCIe 4.0 interfaces

Extending its linear ReDriver ICs, Diodes has added the PI3UPI1608 with internal coupling capacitors. The IC can “significantly” extend PCB trace lengths while minimising power consumption and associated bill of materials costs, says the company.

It supports speeds of up to 20Gbits per second and is UPI 2.0 and PCIe 4.0- compliant with eight differential channels. Integral coupling capacitors save board area by reducing the number of external components required. can be avoided.

Key applications include AI servers, data storage equipment, 5G networking infrastructure and high-performance PCs as well as CPU-to-CPU and CPU-to-storage interconnects.

The PI3UPI1608 ReDriver compensates for channel losses at the transmitter and improves signal integrity at the receiver. It is also optimised for high-performance systems operating at elevated frequencies.

The programmable linear equalisation, output swing, and flat gain capabilities enable the PI3UPI1608 to reduce bit error rates (BERs) and lower intersymbol interference. Programmability can be carried out via the pin strap and I2C interface.

The PI3UPI1608 ReDriver IC runs off a 3.3V supply and has an operating temperature range of -40 to +85 degrees C. It is supplied in a 116-pin QFN package which measures 13 x 7.0mm.

Diodes delivers semiconductor products to companies in the consumer electronics, computing, communications, industrial, and automotive markets. Its product portfolio includes discrete, analogue and mixed-signal products and packaging technology to meet customers’ needs. There are 31 sites around the world, including engineering, testing, manufacturing, and customer service.

http://www.Diodes.com

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MEASURING THE IMPACT OF 5G

How Electronic Test and Measurement (ETM) Manufacturers Can Prepare for and Benefit from 5G

5G Is Coming

For many, that short statement is both a beacon of hope and a source of trepidation. This is especially true for test equipment manufacturers. While 5G offers the opportunity for healthy growth, there are several factors that will make reaping benefits from this generation of wireless broadband technology more challenging than it was for its predecessors.

Let’s start with the current situation for electronic test and measurement (ETM) manufacturers. What generates growth in the wireless ETM business is the combination of new handset models, an increasing volume of annual handset shipments, and wireless technology advancements that drive new infrastructure equipment. We have seen a reduction in the growth rate of handset shipments, as annual shipment volumes have started to exceed 1 billion units. At the same time, mergers and acquisitions in the wireless infrastructure industry have reduced the number of customers in that segment. Finally, ETM manufacturers have also been coping with delays in the deployment of LTE-advanced carrier aggregation in major markets. The result is a slowing market for LTE R&D and production test equipment, as the industry awaits the technology shift to 5G.

A slowing market for LTE test equipment has manufacturers eagerly awaiting the acceleration of 5G.

5G Is Coming—with Challenges

As wireless broadband technology has evolved from generation to generation—and especially from feature to feature—ETM manufacturers have often been able to rely on software upgrades to adapt to changes. The move to 5G, however, is seen as a giant stride forward that will require new and far more complex solutions.

Behind the faster speed, reduced latency, increased capacity, and improved reliability of 5G are new and less familiar technologies, such as millimeter wave, massive MIMO, and adaptive beamforming—all of which will demand significantly more advanced base stations and customer devices. The most substantial change to the 5G physical layer is the option for millimeter wave transmission coupled with adaptive beamforming requiring a large number of antenna elements. While millimeter wave transmission is a familiar technology for point-to-point, line-of-sight wireless backhaul, using those frequencies in a cellular topology, where each cell serves hundreds or thousands of mobile users, and where many antennas will be integrated into advanced device packaging, is challenging and uncharted territory. In order to research, develop, and test the new technologies behind 5G, ETM equipment will have to deliver far more advanced capabilities than previous generations of equipment. The ETM challenge is made more difficult by the fact that the 5G standards have not yet been finalized. And, like previous generations of wireless technology, there is the very strong desire by operators to be first with deployed networks, intensifying the need for ETM equipment early in the technology lifecycle.

Normally, this list of challenges would excite and energize an R&D group. However, the slackening growth in LTE ETM equipment has left some manufacturers with far fewer resources to devote to 5G innovation and development.

A Peek Behind the Curtain

If you want to go fast, go alone. If you want to go far, go together. While 5G introduces significant hurdles, they’re not insurmountable, especially if you subscribe to the wisdom of the African proverb above. New levels of cooperation can be seen throughout the wireless industry. Instrumentation, wireless infrastructure, semiconductor, and software organizations are working together with standards bodies, research organizations, and government regulators worldwide to ensure that 5G is a unified standard addressing the many challenging performance goals, including unprecedented speed, connection density, and ubiquity. Association with important wireless industry organizations such as ITU and 3GPP, and collaboration with any of the multitude of important research organizations, such as NIST and any of the numerous 5G research alliances, is a first step toward greater understanding of the 5G technology trajectory. In addition, ETM manufacturers appear to be gaining a better foothold in the 5G market by forming partnerships and alliances with suppliers.

Moving supplier relationships from highly transactional to being more collaborative can bring greater effectiveness to ETM manufacturers. Knowledge sharing and close collaboration with private companies, including operators and suppliers, is essential to timely delivery of new test products with features that are best aligned with early market needs. Nondisclosure agreements and other proprietary arrangements are giving manufacturers early access to new ideas and emerging technologies that are further enabling the technological breakthroughs required to deliver 5G test capabilities.

Component suppliers are providing information to optimize the performance of existing products beyond published data or are going a step further, such as creating part derivatives to meet specific needs. The right partnerships can bolster an ETM organization’s strengths with early access to advanced technology. Further, by transferring design work to experienced suppliers, an ETM manufacturer can free up scarce engineering resources—allowing them to focus on their strength of delivering value-added product features.

Combined, the partnering activities outlined above are helping ETM manufacturers get the solutions they need, accelerating their own schedules, and helping them and their customers succeed.

The Challenge to Develop Ahead of Standards

With the desire to reduce time to market and meet the demands of 5G, ETM manufacturers need to develop equipment prior to standards being finalized. Because 5G standards will remain in flux for the foreseeable future, working with the right supplier is giving manufacturers access to high performance solutions across the entire signal chain, from millimeter wave to bits. In that way, even as the 5G standard changes, there will be no need to scrap the original hardware design.

Integration

ETM manufacturers will face increased demands for greater capabilities and lower costs. As a result, test products for 5G will be far more complex than those of generations before. Looking beyond individual components to chipsets and system solutions is helping manufacturers squeeze more performance out of limited space and lower cost targets—something especially demanded of modular instrumentation. At the same time, this high level of integration, as well as the increased signal chain count required for MIMO and beamforming, is putting even greater demands on power. By working with suppliers, especially those with the broadest portfolio of products, it’s becoming possible to improve engineer components into complete signal chain solutions to meet the demanding performance, power, space, and time-to-market requirements of tomorrow’s instrumentation.

Ready or Not

5G is an evolutionary leap rather than a simple generational step up. While questions still remain about what 5G will be when it arrives, there is no doubt that it’s on the way. Whether 5G becomes an opportunity for ETM manufacturers will depend heavily on whether they are ready when this new technology arrives. Embracing partnerships and alliances with key suppliers will significantly help ETM manufacturers thrive in the coming 5G market.

 

By Randy Oltman, Systems Applications Manager, Analog Devices

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Dead reckoning module provides navigation in all environments

Automotive-grade positioning modules that operate up to 105 degrees C has been released by u-blox. The NEO-M9L modules and the M9140-KA-DR chip are built on the u-blox M9 GNSS platform and use dead reckoning techniques to provide position data when satellite signals are compromised or unavailable, says the Swiss company.

The u-blox NEO-M9L-20A and NEO-M9L-01A modules are automotive-grade, with the NEO-M9L-01A variant offering an extended operational temperature range up to 105 degrees C, making it suitable for integration on the roof, behind the windscreen, or inside electronics control units (ECUs).

The modules include six-axis inertial measurement units (IMUs) which deliver low-latency 100Hz raw data output. The modules offer a low latency 50Hz position update rate, for use in real-time applications. The automotive dead reckoning (ADR) output combines the GNSS fix with IMU data to deliver accurate positioning output. Additional GNSS-only output enables seamless integration into a variety of third-party applications. The receiver also supports wake-on-motion, which enables smart features such as theft protection and power-efficient designs.

The modules offer innovative sensor-based spoofing detection for advanced security and robustness. The chip offers protection against possible GNSS signal spoofing, which can cause navigation systems to report faulty position data or time.

“Paired with low-latency position output, attitude, and sensor data, the u-blox NEO-M9L is ready to meet current and future challenges facing the automotive market,” said Aravinthan Athmanathan, product manager, product centre positioning at u-blox.

Target applications for the NEO-M9L-20A and NEO-M9L-01A modules include integrated navigation systems such as in-vehicle infotainment (IVI) and head units, integrated telematics control units (TCU), and V2X.

All the module variants comply with AEC-Q104.

Engineering samples and evaluation kits will be available by the end of September 2021.

u‑blox specialises in positioning and wireless communication in automotive, industrial, and consumer markets. Its products and services let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. The portfolio includes chips, modules, and secure data services and connectivity, to empower its customers to develop solutions for the IoT. u-blox’s headquarters are in Thalwil, Switzerland with offices in Europe, Asia, and the USA.

http://www.ublox.com

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