Xilinx says Alveo U55C is its most powerful accelerator card 

Purpose-built for high performance computing (HPC) and big data workloads, the Aleveo U55C was unveiled by Xilinx at SC21. 

The data centre accelerator card was launched alongside a new standards-based, API-driven clustering for deploying FPGAs at massive scale. 

The Alveo U55C accelerator is the company’s most powerful Alveo accelerator card to date and offers the highest compute density and HBM capacity in the Alveo accelerator portfolio. Used with Xilinx RoCE v2-based clustering, customers with large-scale compute workloads can now implement powerful FPGA-based HPC clustering using an existing data centre infrastructure and network, says Xilinx. 

“Scaling out Alveo compute capabilities to target HPC workloads is now easier, more efficient and more powerful than ever,” said Salil Raje, executive vice president and general manager, Data Center Group at Xilinx. “Architecturally, FPGA-based accelerators like Alveo cards provide the highest performance at the lowest cost for many compute-intensive workloads. By introducing a standards-based methodology that enables the creation of Alveo HPC clusters using a customer’s existing infrastructure and network, we’re delivering those key advantages at massive scale to any data centre,” he said.  

The Alveo U55C card delivers more parallelism of data pipelines, superior memory management, optimised data movement throughout the pipeline, and the highest performance-per-watt in the Alveo portfolio. 

The single-slot full height, half length (FHHL) form factor card has a low 150W (max) power. It doubles the HBM2 to 16Gbyte compared to its predecessor, the dual-slot Alveo U280 card. The U55C therefore provides more compute in a smaller form factor to create dense Alveo accelerator-based clusters. Target applications are high-density streaming data, high I/O math and big compute tasks like big data analytics and AI applications.

Leveraging RoCE v2 and data centre bridging, coupled with 200Gbits per second bandwidth, the API-driven clustering enables an Alveo network that competes with InfiniBand networks in performance and latency, with no vendor lock-in, says Xilinx. MPI integration allows for HPC developers to scale out Alveo data pipelining from the Vitis unified software platform. Using existing open standards and frameworks, it is now possible to scale out across hundreds of Alveo cards regardless of the server platforms and network infrastructure and with shared workloads and memory, Xilinx advises.

Software developers and data scientists can unlock the benefits of Alveo and adaptive computing through high-level programmability of both the application and cluster using the Vitis platform​. Vitis supports AI frameworks, like Pytorch and Tensorflow as well as high-level programming languages like C, C++ and Python, allowing developers to build domain solutions using specific APIs and libraries. Alternatively Xilinx software development kits can be used to accelerate targeted HPC workloads within an existing data centre. 

The Alveo U55C card is currently available via the company’s website and through authorised distributors. It is also available for evaluation via public cloud-based FPGA-as-a-service providers, as well as select co-location data centres for private previews. Clustering is available now for private previews, with general availability expected in Q2 2022. 

http://www.xilinx.com

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IAR Embedded Workbench for Arm supports NXP’s S32K3 MCUs

The complete development toolchain IAR Embedded Workbench for Arm now supports NXP Semiconductors’ latest automotive microcontroller (MCU) family, the S32K3.

The announcement extends the list of MCUs supported by the embedded tool suite. NXP’s S32K3 MCUs are designed for automotive body electronics, battery management and zone and domain controllers. The extended MCU support will help developers maximise application performance, maintain a high level of code quality and achieve functional safety compliance in automotive designs, says IAR.

The introduction is intended to meet the growing complexity in automotive embedded systems with development tools that help companies maximise the capabilities of the chosen MCU without compromising on workflow efficiency. IAR Embedded Workbench for Arm delivers optimisations, comprehensive debugging features and integrated code analysis tools. In addition, the toolchain is available in a functional safety edition certified by TÜV SÜD in accordance with 10 standards, such as the international umbrella standard for functional safety, IEC 61508, and the automotive standard ISO 26262

The S32K3 MCUs are based on single, dual and lockstep-configured Arm Cortex-M7 cores and support ASIL B/D safety applications. They include a hardware security engine with NXP firmware, support for firmware over-the-air (FOTA) updates and ISO 26262 compliant real-time drivers software for AutoSAR and non-AutoSAR with IAR Embedded Workbench support.

IAR Systems supplies future-proof software tools and services for embedded development, enabling companies worldwide to create the products of today and the innovations of tomorrow. 

The company was established in 1983 and is headquartered in Uppsala, Sweden. It has sales and support offices all over the world. 

Since 2018, Secure Thingz, which specialises in device security, embedded systems, and lifecycle management, has been part of IAR Systems Group.

http://www.iar.com

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5G beamformer IC family includes dual-polarisation mmWave devices

Third-generation beamformer ICs by Renesas Electronics include two dual-polarisation mmWave devices optimized for 2×2 antenna architecture for 5G and broadband wireless applications. They are claimed to have best-in-class performance at n257, n258, and 261 bands. The integrated F5288 and F5268 transmitter / receiver (8T8R) chipsets are in a 5.1 x 5.1mm BGA package and are claimed to have the industry’s highest Tx output power capability in silicon, delivering more than 15.5dBm linear output power per channel. They are intended for cost-efficient radio design with extended signal reach for wireless infrastructure applications including wide area, small cell and macro basestations, as well as CPE (customer premises equipment) and fixed wireless access (FWA) access points. Communications customers can reduce design times by repurposing antenna array designs across different applications, advises Renesas. 

The F5288 and F5268 ICs feature a Dynamic Array Power (DAP) technology that enables high-efficiency operation at linear output power levels programmable from 10 to 16dBm. 

“Adequate signal range – or lack thereof – remains the biggest challenge as the industry shifts to 5G mmWave technologies for both urban and suburban mobile and fixed wireless networks,” said Naveen Yanduru, vice president of RF communications product division at Renesas.

The third-generation mmWave beamformer ICs’ dual-polarisation eight-channel architecture provides a symmetric and low loss antenna routing network to improve overall antenna efficiency, says Renesas. The exposed die package allows for efficient thermal management at the board with improved heat dissipation through the back of the IC. According to Renesas, temperature compensation techniques minimise RF performance degradation with varying temperatures The package pinmap is designed to simplify board design and reduce design risks. 

In addition to Dynamic Array Power technology for scaling output power, the F5288 and F5268 ICs feature ArraySense technology which allows users to monitor IC performance in array operation and apply critical corrections real-time. They also include RapidBeam advanced digital control technology to enable simultaneous synchronous and asynchronous control of several beamformer ICs to achieve extremely fast beamsteering operations. 

The F5288 operates at 26.5 to 29.5GHz and the F5268 operates at 24.25 to 27.5GHz. They also have phase and gain control which includes 360 degree phase control with true six-bit resolution and up to 31.5dB gain control in 0.5dB steps. There are improved Rx linearity modes and Rx noise figures as low as ~4.5dB at room temperature and under 5.5dB at temperatures up to 95 degrees C.

The F5288 and F5268 beamformer ICs and evaluation systems are available now. 

http://www.renesas.com 

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Rohde & Schwarz and MediaTek deliver Wi-Fi 6E production test

Rohde & Schwarz has integrated its CMP180 radio communication test platform into MediaTek’s ATE tool to offer one of the first production test solutions for Wi-Fi 6E devices. 

The R&S CMP180 radio communication test platform is designed to manage multiple parallel signals for both multiple devices and MIMO transmission methods, providing maximum measurement speed at frequencies up to 8GHz. The analyser / generator single box tester covers wireless standards including Wi-Fi 6E, Wi-Fi 7 and 5G NR at FR1 frequencies, with a wide range of legacy technologies.

Wi-Fi 6E devices can now take advantage of the 6GHz band to the full power of Wi-Fi 6 by making use of 160MHz channels in a widely uncongested band. They are able to deliver multi-gigabit connection speed, and low latency for applications like working, schooling, gaming and streaming.

In January 2021, MediaTek announced its Wi-Fi 6E platforms for access points and client-side devices have been selected for the Wi-Fi Alliance Wi-Fi 6E Certification Program. The company offers both MT7915-AP-AX (access point) and MT7915-STA-AX (client-side) as testbed devices. 

As a result of the co-operation, the R&S CMP180 is now qualified for Wi-Fi production testing with MediaTek’s automatic production test tool (Meta and Multi ATE). MediaTek’s customers using the latest MediaTek mobile platforms with wireless technologies can now integrate the R&S CMP180 in production lines.

According to Dr Yenchi Lee, deputy general manager of MediaTek’s wireless communications business unit at MediaTek explained that the collaboration has enabled customers to speed up development and verification of products using the R&S CMP180 alongside devices under test (DUT) provided by MediaTek.

The Rohde & Schwarz technology group has products for test and measurement, technology systems and networks and cybersecurity. Founded more than 85 years ago, the group is headquartered in Munich, Germany.

http://www.press.rohde-schwarz.com

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