Gen 4 PCIe switches for automotives are first in market, says Microchip

Able to deliver low latency and low power for autonomous driving ecosystems, the Switchtec PFX, PSX and PAX Gen 4 PCIe switches are the first in the market, says Microchip. High speed, low latency connectivity for distributed, heterogenous compute systems are a fundamental element in next-generation autonomous driving applications, said the company. 

The Switchtec PFX, PSX, and PAX switches provide compute interconnect capabilities for advanced driver assistance systems (ADAS). 

“Our automotive-qualified portfolio of Switchtec Gen 4 switches provides the lowest latency and high bandwidth required to link the CPU and accelerator building blocks used in ADAS applications,” said Krishna Mallampati, associate director of marketing and applications for Microchip’s data centre business unit.  

Switchtec Gen 4 PCIe switches provide the high speed interconnect that supports distributed, real time, safety critical data processing in ADAS architectures. As is the case for PCIe’s adoption in the data centre market, it is emerging as the preferred compute interconnect for the automotive industry where it provides low latency and low power bandwidth scalability to CPUs and specialised accelerator devices.

The GPU and computing giant, Nvidia is using the switches in its Drive platform. “The qualification of Microchip’s solutions to meet the stringent needs of the automotive market is a significant milestone, and one Nvidia closely collaborated on,” said Michael Truog, senior director of Automotive Platform Architecture at Nvidia. “Microchip’s automotive PCIe switches deliver flexibility and advanced programmability, enabling high speed SoC and GPU connectivity within our Nvidia Drive platform,” he added. 

The Switchtec automotive-qualified Gen 4 PCIe switches are available in production. Microchip’s ChipLink diagnostic graphical user interface (GUI) provides debug, diagnostics, configuration and forensics tools for rapid deployment.

Microchip Technology provides smart, connected and secure embedded control solutions. development tools and comprehensive product portfolio enable customers to create optimal designs which reduce risk while lowering total system cost and time to market. The company’s products serve customers across the industrial, automotive, consumer, aerospace and defence, communications and computing markets. 

http://www.microchip.com

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PC-based simulation is blended with 5G network emulator at MWC

Anritsu and dSpace will jointly demonstrate the integration of PC-based simulation systems with sensor-realistic simulation in a 5G network emulator at the Mobile World Congress 2022 (MWC). 

Showcased on the Anritsu stand at the event in Barcelona (28 February to 03 March) the system will demonstrate how to avoid collisions between vehicles and objects or people in intersections with limited visibility. The example application used will be the advanced intersection collision warning (AICW). For this, sensor-based information is exchanged between the vehicles and the infrastructure in the intersection area through the use of 5G communication technology. In the demonstration, V2X data and video data collected by camera sensors is provided and analysed to warn the driver of objects or people (including vulnerable road users) located in blind spots, commonly found at intersections. The demonstration will use 5G network slicing technology to establish a separate URLLC (ultra reliable low latency communications) link to provide V2X hazard warning data and an eMBB (enhanced mobile broadband) link to share high definition (HD) video.

Gregor Hordys, responsible for connectivity topics at dSpace, explained that adding a sensor-realistic and vehicle simulation to the radio communication test system enables testing of advanced applications for connected and co-operative automated driving, based on 5G and edge computing in the lab.

“This joint integration and the power of such a solution is a significant step forward for 5G V2X testing and emulation,” said Jonathan Borrill, Anritsu’s head of global market technology. The demonstration is an example of the development of 5G V2X applications, he added.

To provide a 5G network slicing test environment for automotive V2X use cases, an Anritsu MT8000A radio communication test station and dSpace VEOS (a PC-based simulation platform) will be combined with the dSpace Aurelion for sensor-realistic simulation. 

The Anritsu booth is in Hall 5, D41 at the Mobile World Congress 2022 and at Anritsu’s Virtual MWC22—Wireless Technology Showroom to be launched on February 28. (Registration is required).

http://www.anritsu.com

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Server increases node density for 5G, IoT and edge applications

Short depth, multi-node servers have been designed and optimised by Supermicro for 5G, IoT, and edge applications. The SuperEdge server is suitable for environments where high-density compute and I/O are required in a small form factor, for example, on-site in retail or branch offices, or field locations such as at the base of cell towers or high traffic areas. 

The SuperEdge uses a third generation Intel Xeon Scalable processor in each node to deliver data centre processing power at the edge to accelerate analysis and real-time application functionality. The server increases node density by 50 per cent over previous application-optimised servers for 5G, IoT, and Edge workloads, said Supermicro. Customers can start with a single server and add additional ones as demand increases.

“The SuperEdge server increases the compute and I/O densities for edge applications and enables operators to increase system workloads and data processing performed at the edge, reducing network traffic back to data centres,” said Charles Liang, president, and CEO, Supermicro. “Designing application-tuned servers for both the edge and the cloud optimises the deployment of network computing, as we move to the metaverse,” he added.

The Supermicro SuperEdge server is designed to fit in small data centres or environments where server depth is critical. It has a depth of just 430mm and GPUs (graphics processing units) may also be installed, giving the Supermicro SuperEdge the ability to perform AI calculations at the edge of the network, increasing decision-making capabilities and reducing response times.

The nodes and I/O connections are accessible from the front, allowing quick maintenance when needed. The server will operate across a temperature range of -5 to +55 degrees C and is suitable for a range of humidity and other environmental conditions. It can therefore be installed where there is no climate controlled setting without increasing opex (operating expenditure). Redundant power supplies and cooling fans enable the SuperEdge server to operate in harsh conditions outside of a traditional data centre.

Each of the three hot-swappable nodes can accommodate three PCIe 4.0 slots, which enable a range of add-on cards that accelerate applications designed for edge computing. The server’s I/O density allows for multiple acceleration cards, including networking, FPGA, DPU, eASIC and TimeSync options. Each node can accommodate up to 2Tbyte of DDR4 DRAM. This allows more extensive and more complex applications to be installed and executed than previously available, added the company.

http://www.supermicro.com

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STMicroelectronics integrates AI to MEMS sensors

Signal processing and AI algorithms have been combined in MEMS (micro electromechanical systems) sensors by STMicroelectronics. The Intelligent Sensor Processing Unit (ISPU) injects local decision-making while substantially saving space and power, says the company.

The ISPU combines a digital signal processor (DSP) able to run AI algorithms and a MEMS sensor on the same silicon. In addition to a reduction in size, compared to system-in-package devices, the ISPU is also claimed to cut power by up to 80 per cent. Merging sensor and AI puts electronic decision-making at the edge, said ST, where products enabled by smart sensors are able to sense, process, and take actions, in what has been called the Onlife Era, fusing technology and the physical world.

The Onlife Era acknowledges living with continuous assistance from connected technologies, enjoying natural, transparent interactions, and seamless transitions, with no discernible distinction between online and offline, ST explained. The ISPU allows the migration of intelligent processing into sensors that support the fabric of life, or as ST puts it: no longer at the edge but in the edge. 

The proprietary low power DSP can be programmed in C, a language familiar to many engineers. It also allows quantised AI sensors to support full- to single-bit-precision neural networks. This ensures superior accuracy and efficiency in tasks such as activity recognition and anomaly detection by analysing inertial data, said ST.

“While technically challenging, integrating ST’s sensors on the same piece of silicon with our ISPU does improve sensor-based systems from an online experience to an Onlife one,” said Andrea Onetti, executive vice president, MEMS Sub-Group, at STMicroelectronics.

“It advances the sensor’s features to speed decision-making by reducing data transfers, enhancing privacy by keeping data local, while reducing size and power consumption, which cuts costs,” he added.

“Moreover, the ISPU is easily programmable with commercial AI models and can ultimately operate with all of the leading AI tools.” 

ST’s proprietary, C-language-programmable DSP is an enhanced 32-bit RISC (reduced instruction set computing) machine. It is extensible (in the chip-design phase) for dedicated instructions and hardware components. The processor offers a full precision floating point unit, uses a fast four-stage pipeline, operates from 16-bit variable-length instructions, and includes a single-cycle 16-bit multiplier. Interrupt response is four cycles. 

ST’s sensors with ISPUs will be packaged in standard 3.0 x 2.5 x 0.83mm packages and will be pin compatible with earlier models available from the company, for ease of upgrades.

ST also claims that combining the sensor and ISPU save five to six time power saving compared with system-in-package approaches in sensor-fusion applications. They also show a two to three times saving in Run mode. 

http://www.st.com

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