Reverberation chamber combines LTE, WLAN and Bluetooth compatibility

Over the air (OTA) test system developer, Emite, has collaborated with Anritsu for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth wireless technology. 

The Anritsu wireless connectivity test set MT8862A, radio communication analyser MT8821C and Bluetooth test set MT8852B have been integrated with the Emite E600 reverberation chamber. The combination allows the testing of OTA / TRP (total radiated power) / TIS (total isotropic sensitivity) / TPUT (throughput) performance in a repeatable environment. With integral communications protocols and optimised performance for testing, the reverberation chamber and Anritsu platforms can reliably characterise the different co-existence scenarios of the latest devices.

In tests of co-existence scenarios of WLAN with LTE and Bluetooth technology, and LTE with WLAN and Bluetooth technology, the integration has been able to measure TRP, TIS and physical TPUT OTA performance indicators in commercially available devices. 

“New features have been implemented based on market needs and working closely with our customers. Some of the leading companies in the telecommunication sector worldwide have shown interest in this solution for their OTA platforms,” said Javier Paredes, CSO of Emite.

Shinji Hoshino, Director, IoT Test Solutions Div., Anritsu Corporation, said, “IoT use cases combining several technologies are increasing, and the market requires an efficient test platform. . .  . Anritsu’s long experience in bringing test solutions to the communications market will bring these benefits to the IoT test market too.”

Emite Ingeniería is a spin‐out company from the Technical University of Cartagena in Spain. It  designs, develops, manufactures and commercialises OTA test systems for performance, compliance and pre‐compliance testing of any 2G to 5G standards and pre‐standards worldwide, including 5G, LTE‐A and Wi-Fi (up to 6E). 

Headquartered at the Fuente Álamo High Tech Park in the Region of Murcia, Spain, it has distributors in 25 countries, test house show rooms in America, Asia and Europe. Emite OTA test systems are used by carriers, OEMs, test labs, regulatory authorities and others around the wireless ecosystem. Its MIMO OTA test systems were selected by 3GPP and CTIA as candidate methodology for the study and work items through standardisation of LTE MIMO OTA test methods. 

Anritsu provides communications test and measurement products to develop wireless, optical, microwave / RF and digital solutions for R&D, manufacturing, installation, and maintenance applications, as well as multi-dimensional service assurance solutions for network monitoring and optimisation. 

Anritsu also provides precision microwave / RF components, optical devices, and high-speed electrical devices for communication products and systems. The company develops solutions for 5G, M2M, IoT, as well as other emerging and legacy wireline and wireless communication markets. 

http://www.emite-ing.com

http://www.anritsu.com

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Kioxia samples universal flash storage for automotive designs

Automotive universal flash storage (UFS) version 3.1 embedded flash memory devices have been introduced by Kioxia Europe. The UFS has a serial interface allowing it to support full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

The UFS memory devices are based on the company’s BiCS Flash 3D flash memory and are available in a range of capacities from 64 to 512Gbyte. They are, says the company, designed to support the requirements of evolving automotive applications for driver experiences.

Storage requirements for automotive applications continue to increase as infotainment systems and advanced driver assistance systems (ADAS) become more sophisticated, explained Axel Störmann, vice president Memory Marketing & Engineering, Kioxia Europe.

The latest UFS memories support a wide temperature range of -40 to +105 degrees C and meet AEC-Q100 Grade 2 requirements.

Both the sequential read and sequential write performance of the Automotive UFS Version 3.1 device are improved by approximately 2.2x and 6x, respectively, compared with the previous generation devices. These performance gains contribute to faster system start-up and OTA (over the air) updates, added Kioxia.

Sample shipments of the 256, 128 and 64Gbyte devices will start today, with the 512Gbyte devices to ship in April. 

Read and write speeds are the best values obtained in a specific test environment at Kioxia. Read and write speeds may vary depending on the device used and file size read or written, cautioned the company.

Kioxia Europe (formerly Toshiba Memory Europe) is the European-based subsidiary of Kioxia, a supplier of flash memory and solid-state drives (SSDs). Kioxia can trace its expertise from the invention of flash memory to today’s breakthrough BiCS Flash. The company’s innovative 3D flash memory technology, BiCS Flash, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centres. 

http://www.kioxia.com 

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Compact microwave rotary joint from Link Microtek has three X-band channels

Designed and manufactured at Link Microtek’s UK facility, the AMCORJD-3 is a three-channel rotary joint for X-band radar systems. It joins the company’s existing range of microwave rotary joints. One of the three X-band channels is used for transmit and the others for receive signals in radar systems for coastal/border surveillance or critical infrastructure protection. 

The AMCORJD-3 enables microwave signals to be fed to or from a compact radar antenna rotating continuously at speeds in excess of 60rpm and typically exposed to harsh environmental conditions such as wind, rain and salt spray. It was also designed to fit in the same space as the company’s earlier, two-channel version.

Both channels cover the frequency range 8.5 to 9.5GHz and can handle average microwave power in excess of 50W and peak powers of over 200W. In terms of microwave performance, maximum insertion loss is only 1.2dB, maximum VSWR (voltage standing wave ratio) is 1.5:1 and isolation is 80dB.

To satisfy requirements for long life and continuous operation, the robust rotary joint uses a non-contacting design, so the only parts subject to wear are the bearings. The AMCORJD-3 is fabricated from lightweight aluminium with a Surtec finish and incorporates IP65 sealing to protect it from the ingress of moisture and dust. There are N-type connectors on the rotating side and SMA connectors on the fixed side. The rotary joint has overall dimensions of 84 x 150mm, excluding the connectors and bulkhead mounting flange. Other rotary-joint configurations and sizes can be supplied on request and customised to suit specific radar antenna requirements.

Visit Link Microtek at European Microwave Week (EuMW) at the 

ExCeL London Exhibition & Conference Centre from 04 to 06 April 2022. Stand 119

http://www.linkmicrotek.com 

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CUDA-X library updates address 6G, robotics and quantum computing

At GTC 2022, Nvidia announced more than 60 updates to CUDA-X libraries. The company claimed they will allow new areas to access accelerated computing capabilities. For example, they are expected to accelerate work in quantum computing and 6G research, logistics optimisation research, robotics, cybersecurity, genomics and drug discovery as well as data analytics.

The updates to CUDA-X libraries and tools “dramatically improve” the performance of the CUDA software computing platform and many are immediately available. 

“Innovation in AI and accelerated computing is driving major scientific breakthroughs and the creation of new applications and services in virtually every industry,” said Greg Estes, vice president of Developer Programs at Nvidia. 

Built on top of CUDA, the company’s platforms for AI, HPC (high performance computing) and graphics include software development kits and tools that enable higher performance and accelerated algorithms across multiple application domains. The updates make the Nvidia systems that developers already use across science, AI and data processing, even faster, said the company. 

Included in the GTC announcement is the cuQuantum, for accelerating quantum circuit simulation. It is generally available and – for the first time – available in the cuQuantum DGX Appliance, which provides HPC researchers a full quantum simulation stack optimised for deployment on the Nvidia DGX platform. cuQuantum is integrated as a back end in popular simulators from Google Quantum AI, Xanadu and Oak Ridge National Laboratory. It is also now being offered as a part of quantum application development platforms from Classiq and Zapata Computing, and is being used by QC Ware, Xanadu and others to power quantum research at scale in areas from chemistry to climate modelling. 

There is also Sionna, for 6G physical-layer research. This is a new, GPU-accelerated, open-source library, with native support for the integration of neural networks and machine learning. Sionna enables rapid prototyping of complex communication system architectures. 

The Rapids Accelerator for Apache Spark speeds processing by over three times with no code changes. 

For cybersecurity, there is Morpheus, which makes it possible to analyse up to 100 per cent of one’s data in real time, for more accurate detection and faster remediation of threats as they occur. 

Another update is Nsight Systems, for system-wide visualisation of an application’s performance. It allows developers to see how GPU- accelerated libraries use system resources, interact with the application and identify optimisation opportunities to reduce bottlenecks. 

Other library updates include Monai for medical imaging, Maxine, for communications, Riva, for speech AI, Merlin, for recommender systems and Isaac, for robotics. 

http://www.nvidia.com

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