EPC and Analog Devices jointly develop reference design for GaN FETs

The EPC9160 reference design uses EPC’s enhancement mode GaN FET, the EPC2055, with Analog Devices’ LTC7890 two-phase analogue buck controller with integrated GaN drivers. 

The two companies collaborated in the development of the reference design which delivers up to 2MHz switching frequency for the highest density DC/DC converters using GaN FETs, claimed EPC.

The EPC9160 dual output synchronous buck converter reference design board converts an input voltage of 9.0 to 24V to a 3.3 or 5.0V output voltage and delivers up to 15A continuous current for both outputs. The high switching frequency ensures the converter size is small, with dimensions of 23 x 22mm for both outputs. The height of the inductor is 3.0mm. 

The high density and thickness of the design, together with the 2MHz switching frequency make the EPC9160 suitable for automotive console applications, where 2MHz switching frequency is preferred, advised EPC. It can also be used in computing, industrial, consumer and telecomms power systems which require a small size and a very thin profile. According to EPC, eGaN FETs  provide the fast switching, high efficiency and small size that can meet the stringent power density requirements of these leading-edge applications.

The LTC7890 100V, low Iq, dual, two-phase synchronous step-down controller is fully optimised to drive EPC eGaN FETs and integrates a half bridge driver and smart bootstrap diode. In addition, it offers optimised near-zero deadtime or programmable deadtime and programmable switching frequency up to 3MHz. The quiescent current of 5 microA (Vin = 48V, Vout = 5V, CH1 only)  enables very low standby power consumption and light load efficiency, EPC said.

The EPC2055 40V eGaN FET offers 3mOhm max RDS(on), 6.6nC QG, 0.7nC QGD, 1.3nC QOSS and zero QRR in a 2.5 x 1.5mm footprint. It can deliver up to 29A continuous current and 161A peak current. The dynamic parameters allow very small switching losses at 2MHz switching frequency, confirmed the company.

The efficiency of the EPC9160 is greater than 93 per cent for 5V output and 24V input . In addition to light load operating mode and adjustable dead time, the board offers under-voltage lock out, over-current protection and power good output.

Alex Lidow, CEO of EPC commented, “We are delighted to work with Analog Devices to combine the benefits of their advanced controllers with the performance of GaN to provide customers with the highest power density and low component count solutions that increases the efficiency, increases power density, and reduces system cost”

“The . . . LTC7890 is designed to fully exploit the high performance of EPC’s eGaN FETs for high power density solutions” said Tae Han, senior product marketing manager at Analog Devices. Commenting on the high switching frequency and optimised deadtime and lower power consumption will allow customers to “take advantage of the very fast switching of GaN for the highest power density.”

The EPC9160 demonstration board from EPC is available for immediate delivery from Digi-Key.

EPC specialises in enhancement mode gallium nitride (eGaN) -based power management. eGaN FETs and ICs provide performance many times greater than the best silicon power MOSFETs in applications such as DC/DC converters, remote sensing technology (lidar), motor drives for eMobility, robotics, and drones, and low-cost satellites, said EPC.

Analog Devices offers a suite of analogue and mixed signal, power management, radio frequency (RF), and digital and sensor technologies for industrial, communications, automotive and consumer markets.

http://www.epc-co.com

http://www.analog.com

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Sensor software library supports multiple dynamic objects

Sensor fusion specialist, Baselabs, has released the latest version of its modular, ISO 26262-certified software library for the development of data fusion systems for automated driving functions. Baselabs Create Embedded 8 supports distinct models for different types of dynamic objects in its software development kit (SDK). 

Developers of advanced driver assistance systems (ADAS) control units can obtain, for example, a constant velocity model for pedestrians and a constant curvature model for vehicles. If an object is not yet assigned to a class, for example during initialisation, multiple hypotheses with different models can be created. Multiple-model support increases the reliability of predicting movements of different object classes, claimed Baselabs. As a result, the measurement association and the overall performance of sensor fusion are significantly improved.

The Baselabs Create Embedded data fusion library provides sensor fusion algorithms for combining data from radar, camera, and lidar sensors. Developers can configure the data fusion of sensors from a range of manufacturers with graphical support and generate a consistent object list of the vehicle environment. This list serves as an input for downstream algorithms and ADAS functions. 

The library offers self-contained C code for engine control units (ECUs) such as Infineon Aurix or Arm Cortex, for example, and is safety-certified to ASIL B. 

The height models can be pre-set and there is also the option to use categorical values to better separate objects that are close to each other.

The software reduces maintenance and allows teams to focus on other design areas, said Robin Schubert, CEO of Baselabs. “By licensing the library, development teams can focus on designing differentiating features and reduce time-to-market for their applications. Maintenance efforts for in-house developed software are eliminated.”

Baselabs provides software products to make the development of sensor fusion efficient and scalable. It is partner for automotive manufacturers and suppliers worldwide. The company was founded in 2012 and is in shared ownership by its four founders and Vector Informatik and is thus strategically independent of any OEM, Tier 1, or sensor supplier in the market

https://www.baselabs.de/object-fusion/baselabs-create-embedded

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SIL3-certified software is released for RA and RX microcontrollers

Functional safety software that meets the IEC 61508 standard for Renesas Electronics’ RA and RX families of microcontrollers (MCUs) are now available. Renesas offers IEC 61508 SIL3-certified self-test software for both Arm Cortex-M23 and -M33-based MCUs. Renesas also announced the IEC 61508 SIL3 certified PROFIsafe Application Software for RX MCUs. Renesas added that it is the industry’s first semiconductor supplier to offer these hardware-software solutions.

When building a safety critical system using an MCU, it is required to provide device-level diagnostics. With Renesas’ SIL3 certified Self-Test Software, customers can leverage IEC 61508 certifications for the MCUs CPU, ROM and RAM when certifying the overall system. Renesas Self-Test Software kit currently supports Arm Cortex-M23 and -M33-based RA2, RA4, and RA6 series MCUs. 

To address the need for safe network communication in applications that use industrial Ethernet, Renesas introduced the PROFIsafe Application Software. The SIL3-certified PROFIsafe Application Software Kit realises PROFIsafe functionalities on ProfiNet slave devices and eliminates the certification step for network communications. It works with Renesas’ certified SIL3 System Software kit for RX MCUs. The PROFIsafe Application Software supports RX200, RX600 and RX700 series MCUs. Self-Test Software is already available for RX MCUs.

Both the Self-test Software for the RA Family and the PROFIsafe Application Software for the RX Family have been certified by TÜV Rheinland.

Both the IEC 61508 SIL3-certified Self-Test software kit and PROFIsafe Application Software kit are available today. In addition, Renesas offers reference documentation, an evaluation board for the RX family, and an IEC 61508 Certification Kit for RX compilers.  

Renesas Electronics delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices. It produces microcontrollers, analogue, power and SoC products, for a broad range of automotive, industrial, infrastructure and IoT applications.

http://www.renesas.com

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Rad-hard ICs are for cost-conscious satellites, says ST

Radiation-hardened (rad-hard) components by STMicroelectronics help low earth orbit (LEO) satellites expand communication and earth observation services. ST said it is simplifying the design and volume production of the new generation of reliable small, inexpensive satellites to deliver services like earth observation and broadband internet from LEOs.

The new series of rad-hard power analogue and logic ICs are supplied in inexpensive plastic packages. The initial nine devices have been released and include a data converter, a voltage regulator, an LVDS transceiver, a line driver, and five logic gates that are used throughout systems like power generation and distribution, on-board computers, telemetry star trackers, and transceivers. 

The nine parts are the LEO3910 2A adjustable low-dropout voltage regulator, the LEOAD128 eight-channel, 1Mssample per second 12-bit ADC, the LEOLVDSRD 400Mbits per second LVDS driver-receiver, LEOAC00 quad two-input NAND gate, LEOAC14 hex inverter with Schmitt-trigger input, LEOA244 octal bus buffer with tri-state outputs, LEOAC74 dual D-type flip-flop, LEOAC08 quad two-input AND gate and LEOAC32 quad two inputs OR gates. 

The LEO rad-hard plastic parts are ready to use in ‘New Space’ applications, with optimised qualification and production flows and economies of scale. They require no additional qualification or up-screening from their users, and therefore eliminate significant cost and risk, ST confirmed.

The series ensures a radiation hardness match to the LEO mission profile, with a total ionisation dose immunity up to 50krad(Si), high immunity to total non ionising dose and single event latch-up (SEL) immunity up to 62.5MeV.cm²/mg. The parts are assembled on the same production line used for ST’s AEC-Q100 automotive-qualified ICs.

The parts outgassing is characterised to ensure it stays within the commonly accepted limits of New Space. External terminations’ finishing ensures the absence of whiskers in space, while being compatible with both leaded (Pb) and pure tin mounting processes as well as REACH-compliant.

ST said it continue to grow the series adding more functions in the coming months to further expand designers’ choices.

http://www.st.com

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