Smart mobility computing operates in automotive temperature range

Vehicle computing technology for smart mobility has been introduced by congatec, at Intertraffic Amsterdam (29 March – 01 April).

The rugged vehicle computing platforms are designed to simplify and accelerate digitisation and autonomous driving in harsh environments such as transportation, logistics, construction, and agriculture. The computing platforms target the next generation of real-time 5G connected, unmanned, functionally safe vehicles and systems designed for digitising the mobility kinematics of existing fleets. The goal is to provide accurate orientation data to improve situational awareness and to optimise the movement and operation of autonomous vehicles, said congatec.

Mobility OEMs and their Tier 1 suppliers must tackle a variety of tasks when designing the next generation of smart autonomous mobility controllers, advised congatec. The first is to integrate vision and other sensors for gathering situational raw data, and to implement data pre-processing and AI to improve data analytics. They also need to design controller logic for autonomous vehicle movement and operation. In addition, the systems need 5G network sliced device connectivity for vehicle-to-vehicle (V2V) and vehicle-to-everything (V2X) communication. An added complication is that all of this needs to be implemented with real-time capabilities and functional safety. 

One focus for congatec at Intertraffic Amsterdam, will be the Intel Xeon D processor-based COM-HPC server modules for edge servers in autonomous railway applications and 5G wayside equipment. Another is the 12th Gen Intel Core processor-based COM‑HPC client and COM Express modules for smart vehicle gateways and vehicle network controllers. There is also an application-ready, Intel Atom processor-based, real time kinematic platform by congatec’s partner Etteplan.

This is based on congatec Computer-on-Modules and features an RTK-enabled GNSS unit with accelerometer, gyroscope and magnetometer. It is designed for automotive voltage ranges up to 36V. It supports a wide operating temperature range of -40 to +85 degreesC and provides IP65 / IP67 protection. 

For vehicle communication network connectivity, it offers extensions for real-time Ethernet (TSN), RS232, RS485 and CAN. Further edge connectivity options include Wi-Fi and Bluetooth as well as LTE/5G. There are also ambient pressure, humidity and temperature sensors.

The platform is available as a prototype that can be ordered immediately for engineering purposes. For larger quantities, customisation is possible on a project basis. The standard system platform is scheduled to go into series production in the second half of 2022.

http://www.congatec.com 

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Reverberation chamber combines LTE, WLAN and Bluetooth compatibility

Over the air (OTA) test system developer, Emite, has collaborated with Anritsu for testing the compatibility of different connection technologies such as LTE, WLAN and Bluetooth wireless technology. 

The Anritsu wireless connectivity test set MT8862A, radio communication analyser MT8821C and Bluetooth test set MT8852B have been integrated with the Emite E600 reverberation chamber. The combination allows the testing of OTA / TRP (total radiated power) / TIS (total isotropic sensitivity) / TPUT (throughput) performance in a repeatable environment. With integral communications protocols and optimised performance for testing, the reverberation chamber and Anritsu platforms can reliably characterise the different co-existence scenarios of the latest devices.

In tests of co-existence scenarios of WLAN with LTE and Bluetooth technology, and LTE with WLAN and Bluetooth technology, the integration has been able to measure TRP, TIS and physical TPUT OTA performance indicators in commercially available devices. 

“New features have been implemented based on market needs and working closely with our customers. Some of the leading companies in the telecommunication sector worldwide have shown interest in this solution for their OTA platforms,” said Javier Paredes, CSO of Emite.

Shinji Hoshino, Director, IoT Test Solutions Div., Anritsu Corporation, said, “IoT use cases combining several technologies are increasing, and the market requires an efficient test platform. . .  . Anritsu’s long experience in bringing test solutions to the communications market will bring these benefits to the IoT test market too.”

Emite Ingeniería is a spin‐out company from the Technical University of Cartagena in Spain. It  designs, develops, manufactures and commercialises OTA test systems for performance, compliance and pre‐compliance testing of any 2G to 5G standards and pre‐standards worldwide, including 5G, LTE‐A and Wi-Fi (up to 6E). 

Headquartered at the Fuente Álamo High Tech Park in the Region of Murcia, Spain, it has distributors in 25 countries, test house show rooms in America, Asia and Europe. Emite OTA test systems are used by carriers, OEMs, test labs, regulatory authorities and others around the wireless ecosystem. Its MIMO OTA test systems were selected by 3GPP and CTIA as candidate methodology for the study and work items through standardisation of LTE MIMO OTA test methods. 

Anritsu provides communications test and measurement products to develop wireless, optical, microwave / RF and digital solutions for R&D, manufacturing, installation, and maintenance applications, as well as multi-dimensional service assurance solutions for network monitoring and optimisation. 

Anritsu also provides precision microwave / RF components, optical devices, and high-speed electrical devices for communication products and systems. The company develops solutions for 5G, M2M, IoT, as well as other emerging and legacy wireline and wireless communication markets. 

http://www.emite-ing.com

http://www.anritsu.com

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Kioxia samples universal flash storage for automotive designs

Automotive universal flash storage (UFS) version 3.1 embedded flash memory devices have been introduced by Kioxia Europe. The UFS has a serial interface allowing it to support full duplexing, which enables both concurrent reading and writing between the host processor and UFS device.

The UFS memory devices are based on the company’s BiCS Flash 3D flash memory and are available in a range of capacities from 64 to 512Gbyte. They are, says the company, designed to support the requirements of evolving automotive applications for driver experiences.

Storage requirements for automotive applications continue to increase as infotainment systems and advanced driver assistance systems (ADAS) become more sophisticated, explained Axel Störmann, vice president Memory Marketing & Engineering, Kioxia Europe.

The latest UFS memories support a wide temperature range of -40 to +105 degrees C and meet AEC-Q100 Grade 2 requirements.

Both the sequential read and sequential write performance of the Automotive UFS Version 3.1 device are improved by approximately 2.2x and 6x, respectively, compared with the previous generation devices. These performance gains contribute to faster system start-up and OTA (over the air) updates, added Kioxia.

Sample shipments of the 256, 128 and 64Gbyte devices will start today, with the 512Gbyte devices to ship in April. 

Read and write speeds are the best values obtained in a specific test environment at Kioxia. Read and write speeds may vary depending on the device used and file size read or written, cautioned the company.

Kioxia Europe (formerly Toshiba Memory Europe) is the European-based subsidiary of Kioxia, a supplier of flash memory and solid-state drives (SSDs). Kioxia can trace its expertise from the invention of flash memory to today’s breakthrough BiCS Flash. The company’s innovative 3D flash memory technology, BiCS Flash, is shaping the future of storage in high-density applications, including advanced smartphones, PCs, SSDs, automotive and data centres. 

http://www.kioxia.com 

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Compact microwave rotary joint from Link Microtek has three X-band channels

Designed and manufactured at Link Microtek’s UK facility, the AMCORJD-3 is a three-channel rotary joint for X-band radar systems. It joins the company’s existing range of microwave rotary joints. One of the three X-band channels is used for transmit and the others for receive signals in radar systems for coastal/border surveillance or critical infrastructure protection. 

The AMCORJD-3 enables microwave signals to be fed to or from a compact radar antenna rotating continuously at speeds in excess of 60rpm and typically exposed to harsh environmental conditions such as wind, rain and salt spray. It was also designed to fit in the same space as the company’s earlier, two-channel version.

Both channels cover the frequency range 8.5 to 9.5GHz and can handle average microwave power in excess of 50W and peak powers of over 200W. In terms of microwave performance, maximum insertion loss is only 1.2dB, maximum VSWR (voltage standing wave ratio) is 1.5:1 and isolation is 80dB.

To satisfy requirements for long life and continuous operation, the robust rotary joint uses a non-contacting design, so the only parts subject to wear are the bearings. The AMCORJD-3 is fabricated from lightweight aluminium with a Surtec finish and incorporates IP65 sealing to protect it from the ingress of moisture and dust. There are N-type connectors on the rotating side and SMA connectors on the fixed side. The rotary joint has overall dimensions of 84 x 150mm, excluding the connectors and bulkhead mounting flange. Other rotary-joint configurations and sizes can be supplied on request and customised to suit specific radar antenna requirements.

Visit Link Microtek at European Microwave Week (EuMW) at the 

ExCeL London Exhibition & Conference Centre from 04 to 06 April 2022. Stand 119

http://www.linkmicrotek.com 

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