Web-based tool from ST accelerates AIoT projects with smart sensors

ST AIoT Craft, a new web-based tool from ST, simplifies developing and provisioning node-to-cloud AIoT (Artificial Intelligence of Things) projects that use the machine-learning core (MLC) of ST’s smart MEMS sensors.

The MLC is unique to the ST MEMS portfolio and enables decision-tree learning models to run directly in the sensor. Capable of operating autonomously, without host-system involvement, the MLC ensures low latency with low power consumption and efficiently handles tasks that require AI skills such as classification and pattern detection.

ST AIoT Craft also integrates all the steps needed for developing and provisioning IoT projects that leverage the MLC for in-sensor AI and offers a secure and user-friendly approach. There is robust cyber protection for data in the cloud and the web-based tool is conveniently accessed online without downloading to desktop. This saves time for users as it requires no installation, and eases collaboration between different team members such as as AI specialists and embedded software engineers.

The tool provided for creating decision-tree models includes the AutoML function, which automatically selects optimal attributes, filters, and window size for sensor datasets. This framework also trains the decision tree to run on the MLC and generates the configuration file to deploy the trained model. For beginners it is a quick and easy introduction to ST smart sensors that simplifies developing AI applications. In addition, to provision the IoT project, the gateway can be programmed with the Data Sufficiency Module (DSM) tool that intelligently filters data points for transmitting to the cloud, to optimise communication and minimise power consumption, and facilitates future retraining.

Users can find examples that show how to work with decision trees to build IoT sensor-to-cloud solutions, including fan-coil monitoring, asset tracking, human activity recognition, and head gestures. The examples are ready to flash and run for evaluation in ST reference IoT boards such as SensorTile.box Pro, STWIN and STWIN.box. Users can customise these examples to accelerate their own projects, bringing their own data or enhancing available datasets.

ST AIoT Craft is included in the ST Edge AI Suite repository. This contains all software tools, examples, and models for developing machine-learning algorithms to deploy on ST edge-AI devices such as STM32 microcontrollers (MCUs), Stellar MCUs, and MEMS sensors that contain the MLC or the intelligent sensor processing unit (ISPU).

https://www.st.com

> Read More

Omron introduces industry’s smallest 55A power relay with switching capacity

Omron has launched a new high power PCB relay which requires up to 51% less mounting space compared to similar 480VAC 55A relays. Weighing just 18g, the relay requires 488mm2, the G6QG relay can contribute towards significant space savings while delivering high voltage and current endurance. The relay is perfectly suited to high voltage energy infrastructure applications such as electric vehicles (EV) chargers and photovoltaic (PV) inverters.

Despite its small size and low height, the G6QG is capable of high-capacity switching with a contact rating of 480 VAC, 55A. A large contact gap of minimum 2 mm means that the device is compliant with Solar Power Generation Standard IEC62109, while also providing improved insulation between contacts. The G6QG is capable of 10 kV high withstand voltage between coil and contact. Its coil holding voltage, which can be applied as 35%-50% of rated coil voltage, reduces coil power consumption to approximately 12% of rated voltage. Overall power consumption is 1400mW, is also saved as 172mW in case of coil holding voltage 35%.

The profile of the relay is 33% lower than that of competitor products currently on the market and 50% lighter. For designers of energy infrastructure equipment this can contribute towards smaller and lighter boards and devices, or freeing up space for additional capacity or functionality. Examples of suitable applications include solar power generation systems, inverters for solar and energy storage, EV charging stations, industrial inverters, home appliances, and other industrial equipment.

https://www.omron.com

> Read More

Renesas brings the high performance of Arm Cortex-M85 processor to cost-sensitive applications

Renesas has introduced the RA8E1 and RA8E2 microcontroller (MCU). Introduced in 2023, the RA8 Series MCUs are the first to implement the Arm Cortex-M85 processor, enabling them to deliver market-leading 6.39 Coremark/MHz1 performance. The new RA8E1 and RA8E2 MCUs offer the same performance but with a streamlined feature set that reduces costs, making them excellent candidates for high-volume applications such as industrial and home automation, office equipment, healthcare, and consumer products.

The RA8E1 and RA8E2 MCUs deploy Arm Helium technology, Arm’s M-Profile Vector Extension that provides up to a 4X performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift enables applications in the fast-growing field of AIoT where high performance is crucial to execute AI models.

RA8 Series devices integrate low power features and multiple low power modes to improve power efficiency, even while providing industry-leading performance. A combination of low power modes, independent power domains, lower voltage range, fast wakeup time and low typical active and standby currents enables lower overall system power and allows customers to lower overall system power consumption and meet regulatory requirements. The new Arm Cortex-M85 core also performs various DSP/ML tasks at much lower power.

RA8 Series MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and TrustZone support as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of existing designs to the new RA8 Series devices.

Key Features of the RA8E1 MCUs
• Core: 360 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 544 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection), 1KB standby SRAM, 32KB I/D caches

• Peripherals: Ethernet, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, 8-bit CEU, GPT, LP-GPT, WDT, RTC
• Packages: 100/144 LQFP

Key Features of the RA8E2 MCUs
• Core: 480 MHz Arm Cortex-M85 with Helium and TrustZone
• Memory: 1MB Flash, 672 KB SRAM (including 32KB TCM w/ ECC, 512KB user SRAM with parity protection+128 KB additional user SRAM), 1KB standby SRAM, 32KB I/D caches

• Peripherals: 16-bit external memory I/F, XSPI (Octal SPI), SPI, I2C, USBFS, CAN-FD, SSI, ADC 12bit, DAC 12bit, HSCOMP, temperature sensor, GLCDC,2DRW, GPT, LP-GPT, WDT, RTC
• Packages: BGA 224

Availability
The RA8E1 and RA8E2 Group MCUs are available now, along with the FSP software. Renesas is also shipping a Fast Prototyping Board for the RA8E1 and will offer an RA8E2 Evaluation Kit including a TFT Display in early Q1 2025.

https://www.renesas.com

> Read More

Omnivision debuts industry’s smallest-footprint sensor for presence detection

Omnivision has announced the new OV0TA1B monochrome (mono)/infrared (IR) CMOS image sensor, the first and only solution that fits 3mm module Y dimension and smaller notebook computers, webcams and IoT devices. The OV0TA1B is a low-power device that is ideal for artificial intelligence (AI)-based human presence detection (HPD), facial authentication and always-on (AON) technology.

“Stand-alone 940nm IR cameras are becoming more mainstream, especially in the latest generation of ultrathin-bezel design notebooks that feature personalised AI features and require HPD and facial authentication capabilities,” said Jason Chiang, staff marketing manager computing, Omnivision. “The OV0TA1B is the newest mono/IR sensor in our computing portfolio designed to be a cost-effective, ultra-small-footprint device; it is ideal for HPD and facial authentication in 3mm module Y bezel and smaller designs. The ultra-small size of the OV0TA1B sensor also makes it useful for webcams and IoT devices, like those used for people and traffic counting.”

The OV0TA1B comes in either IR or mono, depending on the customers’ design needs (in cases where the system has another stand-alone RGB camera). It features a 2-micron (µm) pixel based on PureCel pixel technology for high-performance sensitivity and MTF (modulation transfer function), allowing it to maintain the HPD and facial authentication.

The OV0TA1B delivers 440 x 360 resolution at 30 frames per second (fps). It is a low-power 220×180 (2.58mW@3fps) image sensor in a 1/15.8-inch optical format. https://www.ovt.com

 

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration