LTE-M and NB-IoT module

Industrial IoT, connected or smart agriculture, logistics and smart metering applications can use the Adrastea-I module by Würth Elektronik. The  low power, multi-band LTE-M and NB-IoT module measures just 13.4 x 14.6 x 1.85mm but integrates GNSS, an Arm Cortex M4 and 1Mbyte flash memory which is reserved for user application development. 

The module is based on the Sony Altair ALT1250 chipset. Certified by Deutsche Telekom, the Adrastea-I module can be quickly integrated into end products without additional labels, industry-specific certifications (GCF) and operator approvals whenever a Deutsche Telekom IoT connectivity (SIM card) is used.

The Adrastea-I module has multi-band support and can be operated through one of two cellular communication technologies (LTE-M and NB-IoT). This enables the support for international, multi-regional coverage. For example, wherever LTE-M does not have coverage, the Adrastea-I can be configured to use NB-IoT instead, and vice versa. The module is 3GPP Release-13-compliant, upgradable to Release-14. Adrastea-I module is optimised for low power consumption and enhanced coverage. Its small dimensions make it suitable for size-constrained applications such as wearables.

The Adrastea-I module has integrated GNSS, supporting both GPS and GLONASS satellite systems. Integrated GNSS make it suitable for asset tracking applications where infrequent position updates are required.

The Adrastea-I module’s integrated Arm Cortex M4 microcontroller, 1Mbyte flash and 256Kbyte RAM are available exclusively for customer application development.

Sony Altair provides a software development kit (SDK), sample code examples, documentation and tools to accelerate innovation and product development on the integrated Arm Cortex M4 microcontroller.

Deutsche Telekom has certified the Adrastea-I module for multiple European LTE-M and NB-IoT networks. Würth Elektronik eiSos maintains a partnership with Deutsche Telekom IoT for Connectivity (IoT SIM card). The certification confirms that end-products using the Adrastea-I module will interoperate properly on Deutsche Telekom’s various networks.

The Adrastea-I module and its evaluation kit are available in stock now, confirmed Ravindra Singh, product manager, at Würth Elektronik eiSos.

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Trust Shield protects against evolving security threats, says Microchip

Designers cannot assume the equipment they are using is trustworthy and must look to new technology to secure systems, warned Microchip Technology. It has released the configurable microcontroller-based CEC1736 Trust Shield family goes beyond NIST 800-193 Platform Firmware Resiliency guidelines, with runtime firmware protection that anchors the secure boot process while establishing an entire chain of trust for the system platform.

The CEC1736 configurable real-time platform root of trust enables runtime firmware protection in the SPI flash and I2C/SMBus filtering against run time attacks. 

The attestation feature provides trustworthy evidence to ensure that critical devices in the platform are authentic. Lifecycle management and ownership transfer features protect secrets throughout the end product lifecycle and during the transfer of product ownership, allowing different operators to use the system platform securely without compromising information.

“The presumption of equipment trustworthiness is no longer acceptable, and it is imperative to both expect and guard against unauthorised firmware components while also distrusting peripheral components until proven trustworthy,” said Ian Harris, vice president of Microchip’s Computing Product business unit. “Our CEC1736 Trust Shield family . . . . provides a complete solution to these challenges that simplifies development and provisioning of keys and other secrets while speeding time to market and providing the flexibility to stay ahead of threats,” he added. 

The CEC1736 Trust Shield family’s hardware crypto cipher suite is equipped with AES-256, SHA-512, RSA-4096, ECC with key size up to 571 bits and Elliptic Curve Digital Signature Algorithm (ECDSA) with a 384-bit key length. 

The 384-bit hardware physically unclonable function (PUF) enables a unique root key and symmetric secret and private key generation and protection. The root of trust and security meets the NIST 800-193 and OCP (Open Compute Project) security guidelines to allow for a quick adoption of the latest security advances and standards, Microchip added. 

Microchip’s CEC1736 Trust Shield family consists of silicon, software, tools, a development board and provisioning capabilities for firmware protection. 

Microchip’s development tools for the CEC1736 Trust Shield family are the Trust Platform Design Suite (TPDS) and a graphical user interface (GUI) configurator for exploring capabilities, defining the security configuration and provisioning secrets for prototyping and production. Microchip’s MPLAB Harmony is an integrated embedded software development framework, designed to simplify device set up, library selection and application development. There is also the CEC1736 development board and Microchip’s Soteria-G3 firmware.

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Robotics starter kit has native ROS 2 support

The latest member of the Kria portfolio of adaptive system on modules (SoMs) is the KR260 robotics starter kit. AMD said it delivers a productivity gain nearly five times that of competing Nvidia-based GPU-based systems, together with an eight times performance/W ratio and 3.5 times lower latency.

The Kria KR260 offers a seamless path to production deployment with the existing Kria K26 adaptive SOMs. It has native support for ROS 2, the standard framework for robotics application development, and pre-built interfaces for robotics and industrial solutions. It is designed for the rapid development of hardware-accelerated applications for robotics, machine vision and industrial communication and control. 

In addition to improvements compared with competing systems, the Kria KR260 accelerates the design cycle compared to chip-down design, the Kria SoM portfolio typically offers up to a nine month saving in time to deployment, with no FPGA expertise required.

According to Chetan Khona, senior director of Industrial, Vision, Healthcare and Sciences Markets at AMD, the kit allows robotic developers to “work in their standard development environment on a platform that has all the interfaces and capabilities needed to be up and running in less than an hour. . . to accelerate robotics innovation and easily take ideas to production at scale”. 

Industry analyst Omdia forecasted the robotics components market to grow at a compound annual growth rate (CAGR) of 20.4 per cent between 2019 and 2025, with the overall world markets revenue to increase to approximately $126 billion by 

The KR260 hardware platform provides pre-built interfaces for robotics and industrial designs which can be combined with accelerated applications delivered via the AMD-Xilinx App Store. 

The central Kria Robotics Stack is an integrated set of robot libraries and utilities that use hardware to accelerate the development, maintenance and commercialisation of industrial-grade robotic designs targeting Kria SoMs. The low-latency, adaptive computing architecture of Kria SoMs implemented with KRS and ROS 2 can improve performance/watt and latency compared to competitive GPU-based solutions, confirmed AMD.  

The KR260 also includes support for the Ubuntu embedded operating system, providing compatibility with Ubuntu Linux Desktop (22.04) from Canonical and ROS 2 Humble Hawksbill.

AMD is collaborating with Open Robotics, the creators of ROS 2 and other open software and hardware platforms for robotics, to validate and ensure compliance of our ROS 2 implementation for the robotics community.

The Kria KR260 robotics starter kit is immediately available from AMD and its network of worldwide distributors. The KR260 starter kit joins the Kria KV260 Vision AI Starter Kit, providing an easy-to-use development platform for designing vision applications. 

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Low voltage 3A buck converter provides wide input range for vehicle interiors

Automotive-compliant synchronous buck converters announced by Diodes are intended for high power density automotive designs, for example in vehicle telematics, ADAS, power and infotainment systems and instrumentation clusters.

The AP61300Q and AP61302Q synchronous buck converters are 3A-rated and have a wide input voltage range of 2.4 to 5.5V. 

Incorporated into each buck converter is a 70mOhm, high side power MOSFET and a 50mOhm low side power MOSFET. Together, said Diodes, they deliver high efficiency step down DC/DC conversion. They also support fast switching speeds allowing smaller accompanying passives to be specified, reducing the overall bill of materials (BoM) and saving space, confirmed the company.

Depending on the load conditions, the AP61300Q and AP61302Q can be configured to pulse frequency modulation (PFM) or pulse width modulation (PWM) operating modes (using the enable pin). The quiescent current (IQ) of 19 microA, when in PFM mode, allows them to maintain elevated efficiencies even in light load situations. The low drop out (LDO) mode permits output voltage regulation to be maintained when the input voltage comes close to the V out voltage.

The constant on-time (COT) control functionality of both the AP61300Q and AP61302Q feature, rapid transient response, easy loop stabilisation and low output voltage ripple with only minimal external components required. Diodes explained that less PCB area is needed which contributes to a reduction in overall production costs.

The AP61300Q and AP61302Q are supplied in SOT563 packages. Both are AEC-Q100 Grade 1 qualified, PPAP-capable and manufactured in IATF 16949-certified facilities. 

Diodes supplies semiconductor products to customers in the consumer electronics, computing, communications, industrial and automotive markets. Its portfolio includes discrete, analogue and mixed-signal products together with packaging technology to meet customers’ needs. The company has a broad range of application-specific products, sales teams and operations in 31 sites around the world, including engineering, testing, manufacturing, and customer services.

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