u-blox launches its first LTE Cat 1bis module with embedded eSIM

u-blox has launched the SARA-R10001DE, a LTE Cat 1bis module featuring an embedded eSIM with Wireless Logic connectivity designed to improve the robustness, reliability, and resilience of IoT applications. The integral eSIM ensures flexible connectivity management and gives customers the ability to switch to the best network in terms of coverage and cost. Offering faster deployment and reliable connectivity regardless of geography, the SARA-R10001DE offers multiple benefits in applications including asset tracking, telematics, micro-mobility, solar technology, smart homes, and cities, and point of sales.

The new u-blox SARA-R10001DE provides full LTE Cat 1bis band support and an eSIM with multi-IMSI technology and eUICC capability. The eSIM is already profiled with a series of Wireless Logic SIM profiles but can also be remotely profiled via OTA using Remote SIM Provisioning.

The multiple SIM profiles stored in the Wireless Logic eSIM allow the module to connect to the best network automatically. This gives confidence that the module will always connect to the best network and that the eSIM will maintain reliable connectivity by switching automatically to a different operator if any issues arise.

The embedded eSIM simplifies customer logistics because it minimises the time and effort involved in managing SIM procurement and eliminates the need to source companion components such as SIM holders.

Additional savings are possible because the SARA-R10001DE allows customers to simplify logistics and reduce complexity. Bundling an IoT module with flexible connectivity allows customers to use a single SKU instead of having several SKUs with different SIM cards in the warehouse, simplifying stock itineraries and reducing storage requirements.

The embedded eSIM enhances robustness for reliable operation in harsh environments. Unlike plastic SIMs that can warp and fail, the eSIM component is soldered in like a standard electronic component to guarantee permanent electric contact.

Designed to provide LTE global coverage, the SARA-R10001DE provides an easy migration path for legacy 2G and 3G devices to 4G LTE global coverage.

https://www.u-blox.com

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IO-Link actuator board from ST delivers turnkey reference design for industrial monitoring and appliances

ST has introduced an IO-Link reference design for industrial beacons and home-appliance alarms, delivered ready-to-use as a fully built board complete with protocol stack and application software.

The EVLIOL4LSV1 board leverages ST’s L6364Q dual-channel IO-Link transceiver to handle communications and the IPS4260L intelligent low-side power switch for driving the indicator lights. The board can be directly connected to signaling systems such as smart tower lights used in factory automation, funnel material alarms for quantity-remaining or urgency-level awareness, and other system warnings. It also provides a fast way to test the IPS4260L and L6364Q ICs and has a 4-pin M12 connector for an IO-LINK master and a 5-pin SWD connector for programming.

An STM32G071CB microcontroller, which hosts the ST proprietary IO-Link demo stack and the application software, handles system control and diagnostics, communicating with the transceiver and low-side switch.

The L6364Q transceiver is fully protected and supports standardised IO-Link communication speeds including 38.4kbit/s COM2 and 230.4kbit/s COM3. The transceiver can operate in single or multibyte mode, as well as in transparent mode delegating control of IO-Link communications to the microcontroller by a simple URT interface. The in-built protection ensures EMC immunity up to 2.5kVpk surge pulse/500Ω coupling without additional protection elements.

The IPS4260L low-side driver has four outputs for driving loads with one side connected to supply voltage, each individually controlled by a signal such as a digital microcontroller output. It has a wide operating-voltage range, from 8V to 50V, and the current for each output can be independently programmed from 0.5A to 3.0A. The IC integrates overload and overtemperature protection for each channel and provides open-load, overload, and overtemperature diagnostic signals to aid system management and enhance reliability. The reference design also features ST’s SMBJ30CA TVS (transient-voltage suppression) diode to withstand surge pulses with 2Ω coupling on the supply rail.

https://www.st.com

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u-blox launches tri-radio module that delivers the latest wireless technologies for IoT

u-blox has announced the launch of the MAYA-W4, a tri-radio module that delivers the latest in wireless connectivity technologies for the mass market. With support for dual-band Wi-Fi 6, Bluetooth Low Energy 5.4, and 802.15.4 (for Thread supporting Matter), the MAYA-W4 is set to redefine the landscape of IoT applications in diverse industries, enhancing device connectivity and interoperability.
Combining three of the most critical wireless technologies into a compact, power-efficient module, the versatile MAYA-W4 meets the growing demand for reliable and secure connectivity. Whether enabling low-energy mesh networks for smart homes or providing high-speed Wi-Fi 6 connectivity for industrial tools, the MAYA-W4 offers unparalleled flexibility for developers and manufacturers. Its small size and robust design make it ideal for space-constrained applications, while its comprehensive global certifications ensure seamless deployment across regions.
The MAYA-W4 addresses the market’s need for Wi-Fi 6 solutions, driven by the rapid adoption of Wi-Fi 6 in IoT segments, as highlighted by recent market data from TSR* (Techno Systems Research CO. LTD.). It alleviates network congestion, enhances power efficiency, and, with a temperature range of -40°C to +85°C, is suitable for industrial environments. With its entry-level feature set and optimised data throughput, the MAYA-W4 offers cost-efficient connectivity without compromising performance. The inclusion of 802.15.4 enables low-power IoT and mesh networking, providing a gateway for the next generation of smart, connected devices.
The new module also eases design efforts, enabling manufacturers to scale their device designs for current and future markets. Offering a selection of antenna variants, designers can choose between pin(s) out, embedded antenna, or U.FL. connector(s) configuration. By maintaining the same compact dimensions as its predecessors (10 x 14 x 1.9 mm), u-blox simplifies migration across previous generations.

https://www.u-blox.com

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Renesas introduces new AnalogPAK programmable mixed-signal ICs

Renesas has announced new AnalogPAK ICs, including lower power and automotive-qualified devices along with the industry’s first programmable 14-bit SAR ADC (Successive-Approximation Register Analog-Digital Converter).

AnalogPAK devices are part of Renesas’ GreenPAK Family of Programmable Mixed-Signal Matrix products: cost-effective, NVM programmable devices which enable innovators to integrate many system functions while minimising component count, board space, and power consumption. GreenPAK and AnalogPAK ICs deliver functional replacement of mixed-signal standard products and stand-alone discrete circuits. They also provide reliable hardware supervisory functions for SoCs and microcontrollers. GreenPAK and AnalogPAK devices provide benefits for virtually any application, including consumer electronics, computing, white goods, industrial, communications, and automotive. Using Go Configure Software Hub and the GreenPAK Development Kit, designers can create and program a custom circuit in minutes.

Renesas’ new SLG47011 AnalogPAK device delivers a new level of performance for configurable analog integrated circuits. It includes a rich set of digital and analog features including programable multichannel 14-bit SAR ADC with Programmable Gain Amplifier (PGA). The SLG47011 also has flexible, user-defined power saving modes for all macrocells that enable designers to switch off some blocks in sleep mode and therefore reduce power consumption to the µA level.

The SLG47011 can be used to extend the performance of, or to offload an MCUs. It can also be used in conjunction with an MCU to replace a complex analog front-end (AFE). Key functions supported by the SLG47011 include measurement, data processing, logic control and data output.

In addition to the SLG47011, Renesas is introducing two other AnalogPAK devices, the cost-optimised SLG47001/3, and the automotive-qualified SLG47004-A.

SLG47001/3 AnalogPAK Devices
The SLG47001 and SLG47003 enable the implementation of precise measurement systems with a low price point and a very compact package to address applications such as gas sensors, power meters, measurement equipment, servers, wearables, industrial robots, industrial and smart home sensor modules.
• Two ultra-low offset op-amps – 9 µV (max.)
• Two 10-bit digital rheostats
• Six-channel sampling comparator
• Analog switch
• Voltage reference
• 59-bytes pattern generator
• 2k/10k/25MHz oscillators
• Fully configurable blocks: LUTs, flip-flops, shift registers, timers, counters, delays

SLG47004-A AnalogPAK Device
The SLG47004-A delivers the functionality of the SLG47004 devices with the addition of automotive qualification Grade 1 for applications such as infotainment, navigation, chassis and body electronics, automotive display clusters and more. The new devices support a temperature range of -40°C to 125°C.

Device Availability
All of the new AnalogPAK devices are available today from Renesas and its authorised distributors, along with customised development kits. The SLG47011 comes in a 2.0 x 2.0 mm 16-pin STQFN package. The SLG47001 is packaged in a 2.0 mm x 3.0 mm 20-pin STQFN, while the SLG47003 comes in a 3.0 mm x 3.0 mm 24-pin STQFN. The SLG47004-A is available in a 4.0 mm x 4.0 mm 24-pin TQFN.

More information on all the new offerings is available at https://www.renesas.com/analogpak.

 

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