Jetson AGX Orin module supports AI and robotics development

To help developers bring new AI and robotics applications to market, or to support existing projects, Nvidia has released the Jetson AGX Orin 32Byte production module.

Companies in the Nvidia Partner Network are offering commercially available products powered by the new module, which provides up to a six-fold performance improvement compared with the previous generation.

Developers can build and deploy Orin-powered systems with cameras, sensors, software and connectivity for edge AI, robotics, AIoT and embedded applications, proposed Nvidia.

The company envisaged applications in manufacturing, retail and construction to agriculture, logistics, healthcare, smart cities and last-mile delivery vehicles. Production-ready systems have options for peripherals to encourage creativity.

According to Nvidia’s Jetson partner ecosystem manager, Thejas Boggaram Shivashankar, the Jetson AGX Orion allows developers and engineers to handle multiple concurrent data streams for complex application environments without strict latency requirements, energy-efficiency constraints or issues with high-bandwidth wireless connectivity. 

The Jetson AGX Orin developer kit is capable of up to 275 trillion operations per second and supports multiple concurrent AI application pipelines with an Nvidia Ampere architecture GPU, together with deep learning and vision accelerators, high-speed I/O and fast memory bandwidth.

Using Jetson AGX Orin, he continued, customers can develop solutions using the largest and most complex AI models to solve problems such as natural language understanding, 3D perception and multi-sensor fusion.

The company announced four Jetson Orin-based production modules, with the Jetson AGX Orin 32Gbyte module available to purchase now, and the 64Gbyte version available in November, with two Orin NX production modules due later this year.

The production systems are supported by the Nvidia Jetson software stack to build and deploy fully accelerated AI.

The JetPack software development kit includes the Nvidia CUDA-X accelerated stack while Jetson Orin supports multiple Nvidia platforms and frameworks such as Isaac for robotics, DeepStream for computer vision, Riva for natural language understanding and TAO Toolkit to accelerate model development with pretrained models. There is also Metropolis, an application framework, set of developer tools and partner ecosystem that brings visual data and AI together to improve operational efficiency and safety across industries.

Carrier boards and full hardware systems options are available from Aaeon, Auvidea, Connect Tech, MiiVii, Plink-AI, Realtimes and TZTEK.

Over 350 camera and sensor options are available from Allied Vision, Appropho, Basler AG, e-Con Systems, Framos, Leopard Imaging, LIPS, Robosense, Shenzhen Sensing, Stereolabs, Thundersoft, Unicorecomm and Velodyne. These can support indoor/outdoor lighting conditions, as well as capabilities like lidars for mapping, localisation and navigation in robotics and autonomous machines.

Software support like device management, operating systems (Yocto and Realtime OS), AI software and toolkits, developers are available from Allxon, Cogniteam, Concurrent Realtime, Deci AI, DriveU, Novauto, RidgeRun, and Sequitur Labs.

Connectivity options, including WiFi 6/6E, LTE and 5G are offered by Telit, Quectel, Infineon and Silex.

http://www.nvidia.com

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Rohde & Schwarz adds co-ordinated software options for 5G NR Release 17  

To address the challenges that arise from 5G NR (New Radio) Release 17 relating to system performance and which will enable expansion into new applications, Rohde & Schwarz has introduced co-ordinated software options for its vector signal generators and signal and spectrum analysers.

Software options for the R&S SMW200A vector signal generator and R&S FSW signal analysers have been upgraded to meet the latest requirements while the R&S FSVA3000 signal and spectrum analyser and R&S SMM100A vector signal generator also handle 5G NR Release 17.

5G NR is the global mobile broadband standard for a unified 5G wireless air interface. It accelerates mobile broadband experiences and extends mobile technology for new and emerging industries, explained Rohde  Schwarz.

Some key features for Release 17 include low latency communications for industrial IoT, integrated access and backhaul and radio access network slicing. In addition, 3GPP extends the frequency support to 71GHz which requires an adaptation of the physical layer, notably the addition of two new subcarrier spacings (480 and 960kHz), and the support of wider signal bandwidths up to 2.0GHz.

The enhanced dynamic front end module in the R&S FSW signal and spectrum analyser enable it to be used for evaluating communication components or systems, including 5G NR FR2 or IEEE 802.11ay/ad chipsets, amplifiers, user equipment and base stations.

Rohde & Schwarz has also introduced a 67GHz frequency option for the R&S SMW200A vector signal generator which allows up to 72GHz in over-range mode. This ensures support of all planned higher frequency 5G bands, as well as the 60GHz WiGig band and inter-satellite links. The generator includes flat frequency response and four hardware-based levels of phase noise performance which apply to the new frequency options.

The latest 5G options for the R&S SMW200A vector signal generator and the R&S FSW signal analyser are available now. 

https://www.rohde-schwarz.com

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Industrial Micro-ATX motherboard is for AI image processing

Equipped with AMD’s first desktop processor, the Ryzen Embedded 5000, the AIMB-522 is an industrial Micro-ATX motherboard for AI image processing in automation and surveillance applications.

According to Advantech, the Rysen Embedded 5000’s 16 Zen 3 cores are complemented with “a suite of technologies that empower high computing performance efficiency”. The board has PCIe Gen 4 expandability, four Gigabit Ethernet ports, and eight USB 3.2. The AIMB-522 is suitable for factory automation, smart logistics, and intelligent surveillance applications.

The AMD Desktop Processor Ryzen Embedded 5000 processor provides instructions per clock, 16 cores and L3 cache for latency-sensitive applications in smart manufacturing, automated visual inspection and intelligent surveillance. These performance gains are delivered with no increase in power consumption or TDP (thermal dynamic performance) said Advantech. The 7nm process enables the processor to deliver a 24 per cent improvement in energy efficiency and 2.8-fold lead compared to previous generation processors and competing architectures respectively, said Advantech.

Computer vision applications require the seamless integration of high speed digital cameras. The AIMB-522 features four Gigabit Ethernet ports and eight USB 3.2 10Gbits per second ports. The interfaces provide connectivity for high data throughput cameras with transfer bandwidths up to 350Mbyte per second and / or 60 frames per second. As a result, the AIMB-522 is capable of integrating more than 10 video cameras without additional peripherals cards. For extra connectivity, the onboard PCI-Express four slots offer the flexibility needed to support more camera devices or industrial controllers with add-on cards.

The Advantech AIMB-522 supports one PCI-Express x16 Gen4 bus standard for graphics demanding applications. Its two PCI-Express x4 slots offer the expandability needed for robotic controller card integration, while the onboard M.2 M-Key socket supports high speed SSD for real time operating system (OS) operations. 

The Advantech AIMB-522 industrial motherboard is available now. 

http://www.advantech.eu

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750V SiC FETs in D2PAK extend Qorvo’s portfolio

Seven surface mount devices in the space saving D2PAK package have been added to Qorvo’s (formerly UnitedSiC) portfolio. The 750V SiC FETs are supplied in the surface mount D2PAK-7L package and are intended for onboard chargers, soft-switched DC/DC converters, battery charging (fast DC and industrial) and IT / server power supplies. According to Qorvo, they are suitable for high power applications that require maximum efficiency, low conduction losses and excellent cost effectiveness in a thermally enhanced package.

The Gen 4 UJ4/SC FETs are claimed to have the industry’s lowest RDS(on) of 9 mOhm at 650/750V. The 750V SiC FETs that make up the Gen 4 UJ4C/SC series are rated at 9.0, 11, 18, 23, 33, 44 and 60mOhm. According to Qorvo, this selection means that engineers have the flexibility to choose the device that can enable optimum cost/efficiency balance while maintaining generous design margins and circuit robustness. 

The latest additions use the cascode SiC FET technology introduced by UnitedSiC whereby a normally-on SiC JFET is co-packaged with a Si MOSFET to produce a normally-off SiC FET for low conduction losses in a small die.

Anup Bhalla, chief engineer at Qorvo, said, “The D2PAK-7L package reduces inductance from compact internal connection loops which ─ along with the included Kelvin source connection ─ results in low switching loss, enabling higher frequency operation and improved system power density. These devices also feature silver-sinter die attach, resulting in very low thermal resistance for maximum heat extraction on standard PCBs as well as IMS [insulated metal substrates] with liquid cooling.”

The 750V Gen 4 SiC FETs are available now in the D2PAK-7L package.

Qorvo provides radio frequency (RF) products, combining technology, systems-level expertise and global manufacturing to address complex technical challenges. Qorvo serves diverse market segments, including advanced wireless devices, wired and wireless networks and defence radar and communications. It also operates in the 5G networks, cloud computing, the IoT space and other emerging applications.

http://www.qorvo.com  

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