ADXpress redefines vehicle connectivity, says Inova Semiconductors

Architecture to enable data transmission in vehicles to a completely new dimension has been presented by Inova Semiconductors. The ADXpress, Automotive Data Express, transmits all raw sensor data via sensor-specific, virtual data paths with deterministic latency to one or more evaluation units. The sensors can be connected to an ADXpress node via PCI Express, Ethernet or SPI, whereby the data transfers are currently carried out electrically with 30Gbits per second or with optical media, with 4 x 24Gbits per second. The data rate is essentially only limited by the physical layer medium and the capability of the technology node.

ADXpress replaces the familiar point-to-point or point-to-repeater concepts with more integrable and flexible topologies, said Inova Semiconductors. This also opens up new possibilities in all aspects of sensor data fusion for advanced driver assistance systems (ADAS) and autonomous driving (AD). The number of displays that can be controlled and maximum resolutions will continue to increase significantly,” said Roland Neumann, CTO of Inova Semiconductor.

The ADXpress technology bundles different data paths on a serial 30Gbits per second data link (already used in APIX, the Automotive Pixel Link from Inova Semiconductors). ADXpress is a universal mass data transport system that electrically transmits any type of data – whether pixel, Ethernet or sensor data from camera, lidar and radar. This opens up new possibilities for network architecture and topologies including new approaches to the implementation of video interfaces, for example via PCI Express.

ADXpress technology is based on virtual data paths, which are realised by transmitting data cells of constant size. All cells take the same path through the network. Unlike IP (Internet Protocol), where a packet can reach its destination via a different path than previous and subsequent packets, ADXpress latency and jitter are constant on a virtual path. Virtual data paths based on data cells have the great advantage that multiplexing, repeating and duplicating can take place on the layer processing the data cells independently of the service. Particularly with multiplexing, it is possible to control or steer the bandwidth allocation and the latency of the individual data paths. The 128 virtual data paths of ADXpress only consume bandwidth when user data is being transmitted

Generic application adaptation units for burst and stream data implemented in hardware enable software-free packaging and de-packaging of continuous (radar, lidar, video) or burst-oriented data (PCI Express, Ethernet, SPI) into a uniform cell format with ADXpress. This allows burst and stream data to be combined with particularly low latency, explained Inova Semiconductors. This, in turn, enables simultaneous bundling of a large number of interfaces across multiple functional units due to the bi-directional structure of ADXpress – in any direction and with any input and output points. These features enable universal network topologies that can be adapted to any conceivable interface.

Inova Semiconductors will present the ADXpress concept at electronica 2022 in Munich (15 to 18 November) at the Inova Semiconductors stand in Hall B4-301.

https://inova-semiconductors.de/main.html

> Read More

RISC brings data density to wearable devices

Two RISC-V processors from SiFive bring flexibility and balance of performance and efficiency for wearables and smart consumer devices, said SiFive. The Performance P670 and P470 RISC-V processors address the need for high performance and efficiency in a small size in high volume applications like wearables, smart home, industrial automation, AR/VR, and other consumer devices, said the company. 

The SiFive Performance P670 and P470 RISC-V processors are specifically designed for, and capable of handling the most demanding workloads for wearables and other advanced consumer applications, said SiFive. They “offer powerful performance and compute density for companies looking to upgrade from legacy ISAs,” said Chris Jones, vice president of product at SiFive. “We have optimised these new RISC-V Vector enabled products to deliver the performance and efficiency improvements the industry has long been asking for, and we are in evaluations with a number of top-tier customers,” he said.

Qualcomm is looking into the possibilities of integrating SiFive’s latest products into Snapdragon platforms,” revealed Ziad Asghar, vice president, product management at Snapdragon Technologies and Roadmap at Qualcomm.

Samsung’s System LSI Business is also looking to evaluate how the latest RISC-V innovations from SiFive can enhance its offerings, confirmed Jinpyo Park, vice president of the Innovative AP development team, at Samsung Electronics System LSI Business.

The SiFive Performance P470 and P670 products offer a combination of compute-density, power efficiency and robust feature sets. They offer support for virtualisation, including a separate IOMMU for accelerating virtualised device IO. It has full, out-of-order, RISC-V vector implementation, based on the ratified RISC-V Vector v1.0 specification.

It has enhanced scalability with fully coherent multi-core, multi-cluster, with support for up to 16 cores.

The P670 is suitable for applications such as premium wearables, networking, robotics, and mobile, said SiFive. The P650, which excludes the vector unit, is already shipping to lead customers and is being used in applications where space is constrained.

The P670 achieves a maximum frequency exceeding 3.4GHz in 5nm, and has performance of greater than 12 SpecINT2k6/GHz, offering optimised performance in a constrained area and power envelope. It also offers higher single threaded performance and twice the compute density compared to legacy solutions, claimed SiFive. 

The SiFive Performance P470 is SiFive’s first efficiency-focused out-of-order, area optimised, vector processor, for wearables, consumer and smart home devices. Expanding on the P500-series, the P470 is significantly smaller than competing devices, claimed SiFive and optimised to what is claimed to have best-in-class performance efficiency and area density. The P470 was designed to also serve as a companion to the P670 processor for demanding applications that require a sharing of compute resources while optimising power consumption.

The P470 offers an upgrade to legacy efficiency cores, achieving a maximum frequency exceeding 3.4GHz in 5nm, and greater than 8 SpecINT2k6/GHz, within a minimal area and power envelope.

It also has a 4x compute density in comparison to the leading competitor, said SiFive and includes a 128-bit RISC-V Vector ALU compliant with the ratified RISC-V Vector v1.0 specification.

SiFive will also release the P450 – an area-optimized version of the P470 that excludes the vector unit.

http://www.SiFive.com

> Read More

Infineon’s PSoC 4100S Max family supports Capsense touch sensors

The PSoC 4100S Max family features expanded flash memory and general purpose I/O (GPIO) for human machine interface (HMI) applications to support the fifth-generation Capsense touch sensors. 

Available in 7.0 x 7.0, 10 x 10 and 14 x 14mm² packages, PSoC 4100S Max with Capsense technology is for use in industrial control, automotive HMI, home automation and large home appliances including robotics, inductive sensors, washing machines, refrigerators, air conditioners, smart thermostats, and printers.

The Infineon PSoC 4100S Max includes up to 384k flash memory. It is the largest PSoC 4 flash memory in its class with up to 84 GPIOs, CAN-FD, high speed, long range wired communication and I²S master for fully embedded audio. New features also include dual fifth-generation Capsense blocks, which deliver differentiated HMI and touch sensing. The Infineon PSoC devices also include a cryptographic accelerator for a more secure interface.

Steven Tateosian, vice president, IoT, Compute and Wireless business unit of Infineon, said: “This next-generation product provides the industry’s best touch sensing with scalability, while reducing the overall bill of materials for designers’ boards. Additionally, this family delivers industry-leading signal-to-noise ratio under some of the most severe touch sensing environments.”

The PSoC is compatible with Infineon’s ModusToolbox 3.0 development platform to develop a variety of use cases including consumer IoT, automotive HMI, industrial, smart home, wearable and other applications. 

Infineon’s PSoC 4100S Max with fifth-generation Capsense technology can be ordered now. Start of production for the AEC Q-100 automotive-qualified version is planned for Q2 2023. 

The PSoC 4100S Max will be showcased at electronica 2022 Hall C3-502.

http://www.infineon.com

> Read More

Compact shielded transformers for ultrasonic use are AEC-Q200-qualified

Compact transformers by Epcos, the B78302A series, have innovative E5 cores for ultrasonic applications. There are three types available with transformation ratios between 1:1:10.8 and 1:1:15.3. Depending on the type, the surface mount transformers offer inductance values between 2.0 and 4.0mH. They are suitable for frequencies from 50 to 300kHz. 

The compact AEC-Q200 qualified components have dimensions of only 8.1 x 7.0 x 7.0 mm and are shielded by a counter-winding for better interference suppression. The permissible temperature range is between -40 and +125 degrees C. 

The transformers are used in ultrasonic applications for impedance matching between the driver IC and the ultrasonic transmitter or receiver. Typical applications are parking aids, industrial robots, drones and logistics robots, automated guided vehicles (AGV) and systems for level measurement. 

TDK is based in Tokyo, Japan. It was established in 1935 to commercialise ferrite, a key material in electronic and magnetic products. TDK’s portfolio features passive components such as ceramic, aluminium electrolytic and film capacitors, as well as magnetics, high-frequency and piezo and protection devices. The product spectrum also includes sensors and sensor systems such as temperature and pressure, magnetic and MEMS sensors. In addition, TDK provides power supplies and energy devices and magnetic heads. 

These products are marketed under the product brands TDK, EPCOS, InvenSense, Micronas, Tronics and TDK-Lambda. TDK focuses on demanding markets in automotive, industrial and consumer electronics, and information and communication technology. The company has a network of design and manufacturing locations and sales offices in Asia, Europe, and in North and South America. 

http://www.tdk-electronics.tdk.com 

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration