Amphenol RF includes Wi-Fi 6-capable cable assemblies

The flexible cable assemblies available from Amphenol RF now include the reverse polarity RP-SMA to AMC assemblies. The miniature cable assemblies on RG-178 cable are designed on a flexible cable type that offers good thermal resistance and is suitable for tight spaces. 

The secure threaded coupling mechanism on the RP-SMA connector, along with the push-on mating of the right-angle AMC connector, make these assemblies particularly well-suited for use in antennas, WLAN, GPS and cellular applications, advised Amphenol RF.

The RP-SMA connector offers the same features and benefits as the SMA interface but the gender of the connector’s contact pin is reversed. The connectors provide additional benefits over traditional SMA, said Amphenol RF. In the event of wear, which is a typical result of screwing and unscrewing that causes signal strength to decrease, the RP-SMA connector allows for only the antenna or cable to be replaced which saves time.

These cable assemblies are typically used on Wi-Fi or WLAN devices. 

Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency, microwave, and data transmission system applications. 

Headquartered in Danbury, Connecticut, USA, Amphenol RF has global sales, marketing and manufacturing locations in North America, Asia and Europe.

Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions. 

https://www.amphenolrf.com

> Read More

AMD adds AU7P and ZU3T to UltraScale+ portfolio 

Building on the Zynq UltraScale+ MPSoCs and Artix UltraScale+ FPGAs, AMD has introduced the AU7P FPGA and ZU3T MPSoC. Both are based on the 16nm FinFET process for low power, high performance per Watt and small form factor applications. The SoCs are small, low cost, and low power entry points to the programmable logic transceiver-based UltraScale+ family, said AMD, with improved features such as high IO-to-logic density, UltraRAM and DSP.

The Artix UltraScale+ AU7P FPGA is claimed to be the lowest density, lowest power, and most cost-optimised 12.5Gbits per second transceiver-based FPGA in the Artix UltraScale+ portfolio. It offers high I/O-to-logic ratio and high memory-to-logic ratio for storing and buffering large amounts of data for processing and compute applications.

They provide up to 50 per cent lower static power, 20 per cent more I/O-to-logic ratio and twice as many 3.3V HDIO compared to the AU10P device, confirmed AMD.

The innovative InFO packaging with dimensions of 8.5 x 10.5mm means that the  AU7P is suitable for applications requiring high compute density in a small footprint. InFO packaging’s thermal and power distribution contributes to compact, power-sensitive applications such as medical imaging, machine vision, professional cameras/monitors, and automotive radar/lidar.

The ZU3T MPSoC device is the smallest device added to the Zynq UltraScale+ family with 12.5Gbits per second GTH transceivers for cost-optimised applications. The GTH transceivers are highly configurable and tightly integrated with programmable logic resources of the UltraScale+ architecture. It also has five times the transceiver bandwidth compared to the ZU3 device for critical networking applications, vision and video processing, and secured connectivity.

It also has a higher DSP slice count compared to the ZU3 for better signal processing compute, said AMD. The additional UltraRAM adds 2.5 times the embedded memory for embedded and video processing applications. 

The ZU3T contains a 64-bit processor combining real-time control with soft and hard engines for graphics processing. An Arm-based CPU sub-system is integrated for advanced analytics and there is on-chip programmable logic for task acceleration, making the MPSoC suitable for camera monitors, medical imaging and automotive infotainment systems.

The AU7P device is expected to begin shipping pre-production and production silicon in the second half of 2023.The ZU3T device is expected to begin shipping pre-production silicon to early access customers in the first half of 2023, with production silicon expected in the second half of 2023. 

Both will be available in automotive (XA) grade, qualified according to AEC-Q100 test specifications with full ISO26262 ASIL-C level certification. 

http://www.amd.com

> Read More

Temperature and humidity sensors lead the industry in accuracy, says ScioSense

Claimed to have industry-leading accuracies in temperature and humidity sensing, the ENS21x family of digital temperature and humidity sensors has been launched by ScioSense.

In addition to “industry leading accuracies”, they are claimed to have rapid response times. The sensors have low power operation with 40nA standby current and are automotive-qualified.

The family of digital humidity and temperature sensors are accurate down to 0.1 degrees C and 0.8 per cent relative humidity. 

The ENS21x family is suitable for use in home appliances, building and automotive HVAC, cold chain management, personal health and wellness monitoring, industrial automation and instrumentation.

ScioSense’s in-house support can help integrate and customise sensors to accelerate time to market.

Product samples are available on request from ScioSense and authorised distributors. 

ScioSense is headquartered in Eindhoven, The Netherlands. The company specialises in the manufacture of semiconductor-based environmental and flow sensors. Its product portfolio consists of humidity, gas / air quality, temperature, pressure and flow sensors for building automation, home appliances, IoT/wearables/mobiles, automotive and industrial applications.

https://www.sciosense.com

> Read More

Fanless DIN-rail gateway delivers cybersecurity for OT and secured edge 

Industrial computing specialist, Axiomtek has released the iNA200 DIN-rail cybersecurity gateway for operational technology (OT) network security. The iNA200 is powered by the Intel Atom x6212RE or x6414RE processor (Elkhart Lake) and has one DDR4-3200 SO-DIMM for up to 32Gbyte of system memory. 

Suitable for demanding environments, this fanless IIoT edge gateway has a wide operating temperature range of -40 to +70 degrees C and supports wide power input of 9.0 to 36V DC with dual power input. The iNA200 also has two 2.5G LAN ports, sufficient storage and can be expanded to meet various industrial application needs, said Axiomtek.

“OT cybersecurity is essential for Industry 4.0,” said Kevin Hsiao, a product manager of the network computing platform division at Axiomtek. He said the iNA200 is designed to safeguard OT assets and avoid network threats for critical infrastructure. It has an M.2 Key B slot to enable 5G connectivity for next-generation industrial use cases. “With the Trusted Platform Module 2.0 (TPM 2.0) support, this cybersecurity gateway increases security offering hardware-level protection against malware and sophisticated cyber-attacks,” he added.

The iNA200 edge gateway ensures continued operations and public safety to meet the changing demands of diverse industrial IoT applications. It has one 2.5 inch SATA 3.0 SSD and eMMC onboard (optional) for storage. It also supports one full-size PCIe Mini Card slot (USB + SATA interface) and one M.2 Key B 3042/3052 slot (PCIe + USB interface) for wireless modules. 

For the network interfaces, the iNA200 provides two GbE LAN ports with LAN bypass, two 2.5G LAN ports with LAN bypass and TSN function and two 1G SFP (Intel I210-IS) ports. Other I/O options include one HDMI, two USB 3.0 ports, one COM port (RS-232/422/485) with DB9 type, one COM port (RS-485) with three-pin terminal block, one tact switch, four antenna holes, one power input connector, and one console port (RJ-45). 

The DIN-rail cybersecurity gateway runs on Windows 10 and Linux operating systems.

Axiomtek’s iNA200 will be available in December 2022. 

http://www.axiomtek.com 

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration