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Ventec introduces hydrocarbon laminate for RF and microwave applications

Wed, Dec 14, 2022

Expanding its hydrocarbon PCB laminate range, Ventec International introduces a new material for RF and microwave applications. The tec-speed 20.0 VTM1000i hydrocarbon laminate is the latest addition to the tec-speed 20.0 range of hydrocarbon-based PCB materials. It offers a level of thermal reliability and high Dk (9.8) and low Df (0.0023) that is typically seen only in PTFE materials, said the company. The new hydrocarbon laminate is a lower budget laminate for high-end RF applications, including satellite communications and 5G RF applications, said Ventec International.

Designed for antenna and communication systems, radar and aviation systems, tec-speed 20.0 VTM1000i is available in a range of dielectric thickness, from 0.38 to 3.81mm. It offers high decomposition temperature (Td) of 426 degrees C.

With regards to power integrity, the high Dk value (9.8 ± 0.0245 at 10Ghz) provides larger interplanar capacitance than other hydrocarbon laminates in this range, claimed Ventec.

Manufactured at Ventec’s state-of-the-art facilities based in Taiwan and China, tec-speed 20.0 VTM1000i is available worldwide via Ventec’s managed global supply chain, providing reliable, disruption-free delivery in Asia, Europe, and the Americas, said the company.

tec-speed 20.0 VTM1000i will debut at the IPC APEX Expo 2023 in San Diego, California, USA (24 to 26 January 2023) on booth 419.

Ventec International produces polyimide and high-reliability epoxy laminates and prepregs and is a specialist provider of thermal management and IMS solutions.

Ventec International Group supplies to the global PCB industry. It has volume manufacturing facilities in Taiwan and China and distribution locations and manufacturing sites in both the US and Europe, Ventec specialises in advanced copper-clad glass reinforced and metal-backed substrates. Ventec materials, which include enhanced FR4, high-speed / low-loss- and high-performance IMS material technology, and a range of thermal management solutions, are manufactured by Ventec using strict quality-controlled processes that are certified to AS9100 Revision D, IATF 16949:2016 and ISO 9001:2015.

http://www.venteclaminates.com

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OSFP-VLC is the first VCL-compatible connector, says Yamaichi

Wed, Dec 14, 2022

A vertical version of the octal small form factor pluggable connector, the standard for optical transceivers and fibres in communications equipment, has been developed by Yamaichi Electronics. The OSFP-VLC is compatible with the VLC (vertical line card) and will debut at DesignCon 2023 (January 31 to February 02) in Santa Clara, California, USA.

The VLC architecture allows higher transmission speed with higher density by a vertical line card which mounts vertical I/O connectors and ASIC side by side to shorten the signal trace distance within three to four inches. It is compatible with mature technology (module, board assembly process and signal transmission technology) available in the market, said Yamaichi.

Using VLC can shorten the PCB line length in comparison to the conventional horizontal line card (HLC) option, added the company, yet 112G transmission can be achieved without increasing costs. In addition, vertical line card placement will decrease the number of boards needed, as well as make room for a cooling space which leads to much lower power consumption and increased cooling efficiency.

As 5G technology, big data, AI and IoT become more prevalent, it is becoming more important to have a fast and reliable connection in order to process extremely large amount of data in the cloud. On the other hand, cost reduction is becoming crucial for data centres which have to juggle maintaining physical space, air conditioning and efficient power consumption for the system.

There have been several proposals to realise higher transmission speed and density to upgrade data centre devices from 112G to 224G but these require new technology which increases production cost.

Yamaichi Electronics has collaborated with Nubis Communications to provide a connector based on VLC architecture which places OSFP connectors vertical to the line card. As a result, existing technology (module, mounting and signal transmission) can achieve higher signal density and speed while maintaining low cost and providing an efficient cooling structure for lower power consumption. As well as increased data transmission rates, cost savings with the elimination of cables and reduction in the number of boards needed and efficient cooling to lower power consumption, VLC enables the use of other I/O interface types.

Typical applications are optical transceiver devices, supercomputers as well as server, router and switches for data centres.

http://www.yamaichi.eu

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Mouser stocks NXP’s latest EdgeReady processors for 3D facial recognition

Tue, Dec 13, 2022

Distributor, Mouser Electronics is now stocking the i.MX RT117F crossover processors from NXP Semiconductors. This is the latest of NXP’s EdgeReady portfolio. The i.MX RT117F crossover processors offer an inexpensive, embedded, secure 3D facial recognition system for smart locks and other access control systems. It can add machine learning-based secure facial recognition capabilities quickly and efficiently to smart homes and smart industrial IoT-based applications using NXP’s eIQ machine learning software.

The i.MX RT117F crossover processors feature NXP’s Arm Cortex-M7 CPU core with 2Mbytes of on-chip SRAM, running at up to 1GHz for fast, more accurate facial recognition and improved power efficiency. The i.MX RT117F has dual core processing and security features. It also provides a 2D GPU (graphics processing unit), two Gigabit Ethernet ports (and one 10/100 port), two high speed USB OTG with PHY and support for a MIPI display and camera. The i.MX RT117F crossover processor can be combined with a 3D structured light module (SLM) camera for security of 3D facial recognition at the edge. According to Mouser, it addresses privacy concerns and eliminates latency typically associated with cloud-based alternatives.

The i.MX RT117F also includes a license to run NXP’s facial biometric authentication library. In the comprehensive library there are camera drivers, image capture and pre-processing tools, face detection, tracking, alignment and recognition tools, wireless drivers and automation scripts.

Mouser is also stocking the SLN-VIZN3D-IOT development kit. This implements an onboard i.MX RT117F processor for secure facial recognition with 3D liveness detection and features integrated, turnkey software. It also includes an available remote registration capability to allow end-users to register their faces from mobile devices.

Mouser says it offers the world’s widest selection of the newest semiconductors and electronic components — in stock and ready to ship. Mouser’s website hosts an technical resources, including a Technical Resource Centre, product data sheets, supplier-specific reference designs, application notes, technical design information and engineering tools.

https://www.mouser.com

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Bluetooth AoA antenna board squeezes into commercial tracking

Fri, Dec 09, 2022

The ANT-B11 compact antenna board combines Bluetooth technology with u-blox’s positioning and wireless communication technology to deliver direction finding and 2D indoor positioning.

ANT-B11 can be integrated into commercial tracking solutions, direction-finding applications and indoor positioning in mid-sized spaces.

ANT-B11 joins ANT-B10 which was launched early 2022. Both are designed for indoor location which is currently hampered because technologies such as GNSS do not always perform effectively, said u-blox. ANT-B11 is equipped with u-blox NINA-B411 Bluetooth 5.1 module and runs the u-connectLocate software, which executes the u-blox angle calculation algorithm. Used in conjunction with an application board, ANT-B11 functions as an indoor angle-of-arrival (AoA) anchor point. The angle calculated by the antenna board does not require any additional processing which means it is ready for use at the application level.

Depending on its orientation, ANT-B11 outputs the final azimuth, or elevation angle, in fractions of a second. With this information, it is possible to track assets and plot their positions in applications aiming at 2D visualisation. (The ANT-B10 is for 3D visualisation.)

ANT-B11 is in a compact, 29.5 x 93.5mm form factor to fit into existing enclosures or casings. It can thrive in any direction-finding application, said u-blox. For example, it can be used to follow assets in indoor areas, grant building access and avoid collisions, in industrial, retail and medical environments. In addition, it can be used in indoor spaces for positioning purposes wherein showing the location of an asset in 2D may suffice.

u-blox specialises in positioning and wireless communication technology in automotive, industrial, and consumer markets. The company’s services and products let people, vehicles, and machines determine their precise position and communicate wirelessly over cellular and short range networks. It offers a broad portfolio of chips, modules and secure data services and connectivity to develop IoT solutions.

The company’s headquarters are in Thalwil, Switzerland and it has offices in Europe, Asia, and the USA.

http://www.u-blox.com

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Ventec introduces hydrocarbon laminate for RF and microwave applications

OSFP-VLC is the first VCL-compatible connector, says Yamaichi

Mouser stocks NXP’s latest EdgeReady processors for 3D facial recognition

Bluetooth AoA antenna board squeezes into commercial tracking

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