NXP targets advanced edge applications with the i.MX 95 family

Part of NXP’s SafeAssure portfolio, the i.MX 95 applications processor family uses an advanced heterogeneous domain design. This not only powers safety-enabled platforms but also integrates a real time safety domain.

The i.MX 95 family combines high performance compute, immersive Arm Mali-powered 3D graphics, a new NXP accelerator for machine learning and high speed data processing. The technology is suitable for automotive, industrial, networking, connectivity and advanced human machine interface (HMI), says NXP. The i.MX 95 family also delivers high performance safety and security features, developed in compliance with automotive ASIL-B and industrial SIL-2 functional safety standards and including an integrated EdgeLock secure enclave.

A critical requirement for the next wave of edge applications is advanced processing and machine learning capabilities, with high-speed connectivity, to analyse the environment and make intelligent decisions locally, explained NXP. The i.MX 95 family is the first i.MX applications processor family to integrate NXP’s eIQ Neutron neural processing unit (NPU). It also includes a new image signal processor (ISP), developed by NXP.

“The i.MX 95 family brings unparalleled features and performance to markets like automotive and industrial where security and safety are key,” stated Rafael Sotomayor, executive vice president and general manager of Secure Connected Edge at NXP. He believed that the combination of processing and graphics, integrated heterogeneous safety domain and networking capabilities, will support “ a new generation of safe and secure edge platforms”.

The i.MX 95 family integrates a secure enclave to simplify implementation of security critical functions in edge applications, such as secure boot, cryptography, trust provisioning, and run-time attestation. Combined with NXP’s EdgeLock 2 GO key management services, manufacturers can securely provision i.MX 95 SoC-based products for secure remote management of devices deployed in the field, including secure over the air updates (OTA), said NXP. 

The i.MX 95’s integrated eIQ Neutron NPU is part of a vision processing pipeline for use with multiple camera sensors or network-attached smart cameras. The SoC integrates an NXP ISP supporting a wide array of imaging sensors to enable vision-capable industrial, robotics, medical and automotive applications, all backed by comprehensive NXP developer support. The Arm Mali GPU enables scaling from multi-display automotive infotainment centres to industrial and IoT HMI-based applications.

The multi-core application domain, with up to six Arm Cortex-A55 cores, is complemented by an independent safety domain consisting of Arm Cortex-M7 and Arm Cortex-M33 CPUs for low power, real time and high performance processing. The i.MX 95 family is designed to enable ISO 26262 ASIL-B and SIL-2 IEC 61508 compliant platforms. Its functional safety domain serves as a critical capability for many automotive and industrial applications. The i.MX 95 can be used in automotiv safety critical actions, for example voice warnings, instrumentation and cameras. In industrial factory automation, the functional safety domain helps to ensure that an industrial control system will always return to a pre-determined state, even when rest of the system fails.

The 10GbE and two 1GbE ports will contribute to industry 4.0, automotive connectivity domain controllers and IoT smart home gateways, said NXP. In addition to time sensitive networking (TSN) capabilities, wireless connectivity (Wi-Fi, Bluetooth Low Energy, satellite radio, or 5G) can be added via two independent PCIe ports, a USB 3 port and integrated BSP-level drivers, said NXP.

Other features include NXP’s Energy Flex architecture that enables fine-grained independent power management of Cortex-A applications domain and real time Cortex-M safety domain. This allows developers to run the real-time safety domain at all times for sensor data monitoring. It also allows the powering up of the applications domain only when necessary to minimise system-level energy consumption.

There is also support for LPDDR5 and LPDDR4X DRAM and multiple options, within the family to scale performance and features to suit power, performance, and application requirements.

The i.MX 95 applications processors are expected to begin sampling for lead customers in 2H 2023.

http://www.nxp.com

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Automotive SoC excels in LED flicker mitigation for cameras

Omnivision has released its most advanced automotive SoC for surround view systems (SVS) and rear view cameras (RVC). The OX01E20 is pin to pin compatible with 1.3Mpixel designs and brings LED flicker mitigation (LFM) and 140db high dynamic range (HDR) capabilities to the company’s portfolio of automotive single chip image sensor and signal processors. 

The OX01E20 is claimed to provides the industry’s best imaging performance for SVS and RVC across a range of challenging lighting conditions. It also has the most compact form factor and lowest power consumption, said Omnivision. In a single 1/4-inch optical format package, the OX01E20 features a three micron image sensor, an advanced image signal processor (ISP) and full-featured distortion correction / perspective correction (DC / PC) and on-screen display (OSD). Designers can achieve a small form factor with “excellent low light performance, ultra-low power, and reduced cost, while also improving reliability by using only one PCB,” said Omnivision. 

The HDR and LFM performance applies over the automotive temperature range, added Omnivision.

The OX01E20 is built on Omnivision’s PureCel Plus architecture, which is renowned for its low light sensitivity and provides the industry’s best SNR (signal to noise ratio) performance, claimed the company. 

The OX01E20 is ASIL-B safety-compliant. It is sampling now and will be in mass production in June 2023. 

Omnivision is a fabless semiconductor organisation that develops advanced digital imaging, analogue and touch and display products for multiple applications and industries, including mobile phones, security and surveillance, automotive, computing, medical, and emerging applications. 

http://www.ovt.com 

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Renesas releases Wi-Fi development kit supporting new Matter protocol

Renesas has released its first development kit that includes support for the new Matter protocol. Renesas also announced that it will offer Matter support on all future Wi-Fi, Bluetooth Low-Energy and IEEE 802.15.4 (Thread) products, including products from Dialog Semiconductor and Celeno Communications, which it recently acquired.

The Matter securely and robustly connects various smart devices with each other across ecosystems, regardless of the manufacturer to address interoperability conflicts for smart home devices. The application layer protocol abstracts the underlying connectivity technologies such as Wi-Fi, Thread and Bluetooth Low Energy. By using a common software stack, device manufacturers who build with Matter will support various smart home ecosystems and voice services. Smart home users will be able to buy any Matter-certified device regardless of their platform of choice.

Renesas is a member of the Connectivity Standards Alliance. “Connectivity is a critical part of our IoT solutions,” commented Sean McGrath, vice president of the connectivity and audio business division in Renesas’ IoT, industrial and infrastructure business unit. He believed that the company’s broad range of Bluetooth and Wi-Fi solutions, and Thread products in development, mean it is “well positioned to take advantage of the Matter standard in a variety of applications working with customers worldwide.”

Renesas has more than a decade of experience in Bluetooth LE and Wi-Fi. With more than 600 million wireless devices shipped, Renesas offers a broad range of connectivity SoCs used in IoT, wearable products and home networking.

The DA16200 Ultra-Low Power Wi-Fi Modules development kit is based on the DA16200 SoC, believed to be the world’s first Wi-Fi SoC to deliver year-plus battery life for always-connected Wi-Fi IoT devices. 

DA16200 also supports Renesas Quick Connect IoT through the Ultra Low Power Wi-Fi Pmod board. It is fully integrated into Renesas’ e2 studio for easy system development using Renesas MCU, connectivity and other devices. 

Renesas is sampling the DA16200 Development Kit with Matter support to lead customers now and expects to release it broadly by the end Q1 2023.

http://www.renesas.com

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13th Gen Intel Core mobile processor includes “world’s fastest”

The 13th Gen Intel Core mobile processor family has been introduced and includes the flagship Intel Core i9-13980HX, claimed to be the first 24-core processor for a laptop and world’s fastest mobile processor.

A total of 32 new 13th Gen Intel Core mobile processors were announced at CES 2023. The Intel Core H-, P- and U-series mobile processors power the latest thin, lightweight laptops and IoT devices.

The 13th Gen Intel Core H-series mobile processors include the first 24-core processor for a laptop. The HX processors support both DDR4 and DDR5 memory, are claimed to have best-in-class connectivity and feature PCIe Gen 5 for mobile gaming applications.

The HX family offers up to 5.6GHz turbo frequency, believed to be the highest clock speed available for the laptop market, delivering up to 11 per cent faster single-thread performance and 49 per cent faster multi-task performance over the previous generation.

It also features processors with up to 24 cores (eight Performance-cores, 16 Efficient-cores), 32 threads and enhanced Intel Thread Director. Memory support is up to 128Gbyte for DDR5 (up to 5,600MHz) and DDR4 (up to 3,200MHz).

The Intel Killer Wi-Fi 6E (Gig+) provides up to six times faster internet speeds with no legacy Wi-Fi channel interference. The processor family also features Bluetooth LE Audio and Bluetooth 5.2 supporting up to two times faster speeds and multiple device connections with lower power consumption.

Thunderbolt 4 support delivers transfer speeds up to 40Gbits per second and PC connectivity to multiple 4K monitors and accessories.

Leveraging work with discrete graphics, the processors improve the integrated graphics experience based on improved driver stack and key learnings, said Intel.

The HX and HK processors all have overclocking capabilities.

The Intel Core P-series and U-series mobile processors offer up to 14 cores (six Performance-cores, eight Efficient-cores) and enhanced Intel Thread Director.

There are new Intel Iris Xe Graphics features including endurance gaming, XeSS Super Sampling and Intel Arc Control.

  There is also broad memory support for DDR5 and DDR4 and LP variants and integrated Intel Wi-Fi 6E (Gig+) and new wireless features like Intel Connectivity Performance Suite, Intel Wi-Fi Proximity Sensing and Intel Bluetooth LE Audio.

There are up to four Thunderbolt 4 ports for the fast, simple and reliable dock, display or accessory cabling.

For the first time, select designs based on 13th Gen Intel Core processors will feature the Intel Movidius vision processing unit (VPU). AI-heavy tasks required can be offloaded to the VPU, freeing up the CPU and GPU for other workloads or multi-tasking.

Target applications are retail, education, healthcare, aerospace, industrial and smart cities, where the new processors provide better workload consolidation with more cores and threads, enabling applications to run on a single device for IoT edge computing, said Intel.

For the IoT edge, 13th Gen Intel Core processors deliver extended temperature operation and higher performing CPUs, with more graphics capabilities and AI performance, said Intel. 

http://www.intel.com

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