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iWave bases SoM on NXP’s i.MX 93 SoC

Tue, Mar 21, 2023

The iW-RainboW-G50M is a solderable system on module (SoM) which has been developed by iWave. The solderable SoM exploits the powerful i.MX 93 applications processor and is built on the OSM v1.1 solderable SoM standard. According to iWave, it provides extensive interfaces in a rugged and compact form factor.

The i.MX 93 SoC is claimed to be the first in the industry to integrate the Arm Ethos-U65 microNPU and the first in the i.MX family to integrate the scalable Arm Cortex-A55 core featuring the latest Armv8-A architecture extensions with dedicated instructions to accelerate machine learning (ML).

In addition to two Cortex-A55 and one Cortex-M33, the iW-RainboW-G50M has a neural processing unit (NPU) operating at up to 0.5 TOPS. It also has 2Gbyte LPDDR4X RAM and 8Gbyte eMMC flash memory. The SoM also includes a two-lane MIPI-CSI and a four-lane MIPI-DSI, together with two RGMII, two CAN-FD and one LVDS interface. There is also Wi-Fi 6 and Bluetooth 5.2 connectivity.

The module is a 45 x 45mm size-L form factor in a scalable LGA package with 662 contacts which conforms to the OSM v1.1 Standard. The provision of 662 contacts means that the SoM offers the highest pin-to-area ratio across SoM standards, said iWave. The SoM can be directly soldered onto the carrier card for robust operation and for products prone to vibrations.

The SoM supports the MIPI-CSI camera interface to leverage the integrated NPU while supporting a four-lane MIPI-DSI with 1080p60 resolution for 2D graphics processing through a high-efficiency pixel pipeline. The availability of high speed interfaces such as USB 2.0, Gbit Ethernet, and CAN-FD makes the SoM suitable for industrial and automotive market segments.

Building on the ML capabilities of NXP’s i.MX 93 applications processor, the SoM can be adopted as a building block for machine vision, AIoT, smart city, industrial automation, and other ML-related applications, advised iWave.

The i.MX 93-based SoM is also integrated on a carrier board, which is positioned as a single board computer (SBC) and also doubles up as an evaluation kit. The production-ready SBC is built on a Pico-ITX form factor and can be integrated into AI and ML applications.

The SoM and SBC are available now with all documentation, necessary software drivers and board support packages available for customers. iWave maintains a product longevity program and ensures the availability of the modules for 10+ years.

Evaluation kits of the SoM will be ready to purchase in March 2023.

http://www.iwavesystems.com

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NFC tag controller integrates sensing and energy-harvesting

Mon, Mar 20, 2023

NFC-based sensing controller, the NGC1081, has energy-harvesting capabilities and is the latest addition to Infineon Technologies portfolio of NFC tag-side controllers.

The NGC1081 IC is a single chip designed to enable the IoT industry to develop low-cost, miniaturised, smart edge computing/sensing devices which can be controlled and powered by mobile phones. Potential applications range from medical patches and disposable point-of-case testers to data loggers, smart thermostats, and sensor inlays.

The tag-side controller supports a dual power supply function, allowing it to operate in a passive mode (battery-free) based on energy harvesting, or in a battery-powered mode in which it operates as a self-contained sensing node via a 3.0 to 3.3V external power supply.

In passive mode, the entire sensing system, including the IC and its connected sensors, can draw power via energy harvesting from the NFC field of a mobile phone. The IC also has a naturally galvanically isolated sensing interface.

The NFC tag-side controller is based on a low-power Arm Cortex-M0 microcontroller and integrates an NFC front end which is compliant with the ISO14443 type-A standard. There is also a motor control driver that employs an H-bridge circuit with a current drive capability of up to 250mA. NGC1081 also features a sensing unit based on a 12-bit SAR ADC with four analogue inputs and a 10-bit DAC with one analogue output. The sensing unit also comprises an I2V converter and an integrated temperature sensor that provides an accuracy of ±0.3 degrees C over the temperature range of 0 to 45 degrees C and ±0.4 degrees C from -20 to 0 degrees C and 45 to 85 degrees C.

This integrated single-chip enables customers to implement smart sensing devices with miniaturised product design and reduced system bill of material costs, advised Infineon. The IC architecture and the hardware/software partitioning allow customers to create flexible software-defined functions.

Seamless connectivity to mobile phones allows developers to use a cloud-based business model, supported by a lean and scalable mailbox concept that ensures robust access management to maintain data integrity and security. Application-specific commands and messages from an open protocol interface can extend the protocol layer, added Infineon.

The NGC1081 NFC tag-side controller is available in a VQFN-32 package.

http://www.infineon.com

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Renesas adds two Arm Cortex-M33 core MCUs to 32-bit RA family

Fri, Mar 17, 2023

The RA4E2 and RA6E2 MCUs deliver up to 200MHz in compact packages and offer rich peripheral options for sensing, gaming, wearables and appliances, said Renesas.

They are both based on the Arm Cortex-M33 core with Arm TrustZone technology. The 100MHz RA4E2 Group and 200MHz RA6E2 Group of MCUs are optimised to provide power efficiency, said Renesas. They are available in 128kbyte and 256kbyte flash options and 40kbytes of SRAM. Connectivity options are on-chip CAN FD, USB, QSPI, SSI and I³C interfaces. The MCUs offer an upgrade path to other members of the RA family.

The RA4E2 and the RA6E2 offer a cost-effective option with integrated CAN FD and space saving packages as small as a 4.0 x 4.0mm 36-pin BGA or a 5.0 x 5.0mm 32-pin QFN.

All RA devices are supported by the Renesas flexible software package (FSP) that includes efficient drivers and middleware to ease the implementation of communications and improve functionality of peripherals. The FSP’s GUI simplifies and accelerates the development process, said Renesas. It enables flexible use of legacy code as well as compatibility and scalability with other RA family devices. Designers using FSP also have access to the full Arm ecosystem as well as Renesas’ extensive partner network, offering a wide range of tools that help speed time-to-market.

The RA4E2 Group includes five different options, spanning from 32-pin to 64-pin packages as small as 4.0 x 4.0mm, and 128kbyte of flash memory along with 40kbyte of SRAM. The devices use just 82 microA / MHz while executing from flash at 100MHz. They have an extended operating temperature range of -40 to +105 degrees C.

The devices in the RA4E2 Group are based on a 100MHz Arm Cortex-M33 CPU core and can reduce system costs by virtue of the internal oscillator, general purpose I/O, advanced analogue, low voltage detection and internal reset function

The RA6E2 Group MCUs deliver 200MHz performance. Based on a 200MHz Arm Cortex-M33 CPU core, they also have low power operation ( 80 microA / MHz in active mode at 200MHz). The group includes 10 different parts, spanning from 32-pin to 64-pin packages as small as 4.0 x 4.0mm, and from 128kB to 256kbyte of flash memory along with 40kbyte of SRAM. Integrated communications options including USB 2.0 full-speed device, SCI, SPI, I³C, HDMI CEC, SSI, QSPI, and CAN FD and an integrated timer.

Renesas has designed a full Add-on Voice User Interface (VUI) using the RA6E2 MCU and other compatible devices from the Renesas portfolio. It can be added to devices such as smart thermostats or appliances.

All RA4E2 and RA6E2 MCUs are available today with separate evaluation kits and fast prototyping boards available for both MCU groups.

http://www.renesas.com

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LoRa Connect LR1121 lowers power consumption and extends range

Fri, Mar 17, 2023

The LoRa Connect LR1121 transceiver for use in IoT end points is claimed to bring the best LoRa transceiver RF performance to date, combined with a multi-band versatility which allows a single, low power chip to be used anywhere in the world, said Semtech.

LoRa enables data communication over a long range while using very little power. LoRa devices and the LoRaWAN standard are flexible for everything from long distance rural to indoor use cases in a wide range of industries including smart cities, homes and buildings, communities, agriculture, metering and utilities, healthcare, environment and supply chain and logistics.

The LoRa Connect LR1121 is pin-compatible with the current LoRa Edge devices, allowing module makers such as Murata to have a single hardware design for a wide range of applications, with global connectivity, advised Semtech. Similarly, integrated passive devices such as those from Johanson Technology can be used with the LoRa Connect LR1121 to offer a smaller footprint, reduce time to market and minimise design iterations, according to Semtech.

The highly integrated LoRa Connect LR1121 transceiver provides LoRaWAN connectivity for terrestrial low power wide area networks (LPWAN) operating at 470, 868 and 915MHz. It also provides LoRa 2.4GHz and the S-band for direct connection to satellites.

“Semtech’s LoRa Connect is targeting the connectivity challenges faced by the industry today enabling widespread adoption and reinforcing LoRa’s position as the de-facto platform for IoT,” said Robert Comanescu, senior director of the IoT chips business at Semtech. He added, the company is continuing to invest and adding products “with multi-band LoRa support and LoRa Cloud services that will provide best in class, sustainable, ubiquitous and global IoT connectivity.”

New modules and reference designs, developed in partnership with Johanson and Murata, are ready at launch and offer a smaller form factor, lower assembly costs and faster time to market.

Murata’s Type 2GT module, supporting the LoRa Edge LR1110 and LR1120 products, now supports the LoRa Connect LR1121, for a pre-certified LR1121 variant that is readily available.

Johanson Technology’s integrated passive device range is also compatible with the LR1121 and replaces many RF passives, allowing a smaller form factor and lower assembly costs. A reference design is available now on the Semtech website.

https://www.semtech.com

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iWave bases SoM on NXP’s i.MX 93 SoC

NFC tag controller integrates sensing and energy-harvesting

Renesas adds two Arm Cortex-M33 core MCUs to 32-bit RA family

LoRa Connect LR1121 lowers power consumption and extends range

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