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Infineon makes Secora Pay available in 28nm

Mon, Mar 27, 2023

Payment cards will have the capability to be offered in new, innovative designs, said Infineon, as it introduces its Secora Pay card payment technology is available on 28nm chip technology.

The Secora Pay platform allows manufacturers to efficiently produce robust dual interface cards for payment and multi-application use cases, explained Infineon Technologies.

The introduction of 28nm chip technology is believed to be the first 28nm technology card payment technology with embedded non-volatile memory. It is intended to side step the semiconductor shortages experienced in mature technology nodes.

The product family uses a security controller with certified software integrated into coil on module (CoM) chip modules. The devices use standardised inlays for easy and fast card production which are compatible with Secora Pay products on 65nm, 40nm and 28nm technology. One inlay sheet fits the existing and new Secora Pay products.

The CoM system offers maximum flexibility in card design, said Infineon. It uses inductive coupling technology with copper wired card antennas. It is therefore perfectly suited for future market trends such as environmentally friendly cards made of recycled and ocean-bound plastic or wood, as well as high-performance dual-interface metal or LED cards.

Secora Pay products support the highest throughput in card production with minimal resources for manufacturing highly robust dual-interface cards, said Infineon. New services based on Secora Pay’s NFC tag enable further use cases such as initial card activation as well as authentication for online banking and for loyalty programmes.

“In recent years, touchless payment experience with dual-interface payment cards has become a global standard, among others also driven by the Covid-19 pandemic,” said Tolgahan Yildiz, head of payment solutions at Infineon’s connected secure systems division.

The Secora Pay portfolio us engineered to enable manufacturing and issuance of high quality dual-interface payment cards for high transaction performance with reliable security for trusted seamless payments, he added.

The global dual-interface payment card market is expected to grow at a compound annual growth rate of six percent from 2022 to 2027, starting from an estimated 2.6 billion units in 2022.

The 28nm technology products offer a simple onboarding process or migration path for card manufacturers, claimed Infineon. They are backwards-compatible with existing Secora Pay products in terms of card production, antenna design, personalisation and product certification for contactless and personalised performance, enabling contactless transactions within 155 milliseconds.

Product versions supporting the latest Visa and Mastercard applications are available now with extremely long approval life time. Certified applets for American Express, Discover and others will follow later this year, confirmed Infineon.

http://www.infineon.com

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RZ/T2L industrial MPU provides real-time control with EtherCAT communication

Fri, Mar 24, 2023

The EtherCAT communication protocol is supported by the RZ / T2L microprocessor released by Renesas Electronics. It achieves high speed, real-time control for industrial systems.

The RZ/T2L MPU is based on the hardware architecture of Renesas’ RZ/T2M series. The RZ/T2L microprocessor delivers high speed, real-time processing performance required for AC servo drives, inverters, industrial robots and collaborative robots while reducing the chip size by up to 50 per cent compared to the RZ/T2M, reported Renesas. The device is suitable for factory automation and a broad range of applications such as medical equipment and building automation, both areas in which EtherCAT is increasingly becoming adopted.

The RZ/T2L is equipped with an Arm Cortex-R52 CPU with a maximum operating frequency of 800MHz and a proven EtherCAT slave controller designed by Beckhoff Automation for Ethernet communication. All internal RAM of the RZ/T2L is equipped with the ECC (error correction code) function as required by industrial applications. Additionally, the large (576kbyte) memory directly connected to the CPU reduces unpredictability in execution time that can be caused by cache memory and enables reliable, deterministic processing. The RZ/T2L also offers peripheral functions such as multi-protocol encoder interfaces for angle sensors, Sigma-delta interfaces and ADCs. These are arranged on a dedicated low latency peripheral port (LLPP) bus directly connected to the CPU to achieve fast and accurate real-time control capabilities.

The RZ/T2L uses the same architecture including the CPU, peripheral functions and internal bus, as Renesas’ high-end motor control MPU, RZ/T2M. In addition, Renesas offers the Flexible Software Package (FSP) and software development environment that are compatible with other RZ family microprocessors and RA family microcontrollers. This reduces development efforts and costs and facilitates scalable development of a wide array of products, noted Renesas.

The RZ/T2L can be used as a functional safety microprocessor and Renesas has said it will provide self-diagnostic software and SIL3 system software kits in Q4/2023, which allow customers to reduce development efforts and costs to develop functional safety system.

The RZ/T2L supports various security functions such as secure boot, secure firmware update, JTAG authentication, unique ID and cryptographic accelerator to reduce the risk of data breach and tampering of user programs. Renesas will offer the security software package as part of a security solution in May 2023.

The RZ/T2L is available today.

https://www.renesas.com

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Infineon includes Bluetooth 5.5 in Airoc SoCs

Fri, Mar 24, 2023

The newly release Bluetooth 5.4 specification is integrated in Infineon’s Airoc CYW20829 Bluetooth LE SoC. According to Infineon, with the right combination of low power and high performance, Airoc CYW20829 is designed to support the entire spectrum of Bluetooth Low Energy (LE) use cases including smart home, sensors, medical healthcare, lighting, Bluetooth Mesh networks, remote controls, human interface devices (mouse, keyboard, VR and gaming controllers), industrial automation and automotive designs.

CYW20829 is a dual-core Arm M33 device where one M33 core is reserved as the Bluetooth controller, and the second Arm Cortex-M33 is available for customer applications. The CPU subsystem provides 256k RAM, XIP interface for external flash, and a rich set of peripherals including CAN. Built-in security features include secure boot, secure execution environment, a TRNG, eFuse for custom keys and cryptography acceleration.

The recently released Bluetooth Core Specification 5.4 adds several significant capabilities to the existing specification, including PAwR (periodic advertising with response), encrypted advertisement data (EAD) and Le GATT security levels characteristic. PAwR enables energy-efficient, bi-directional communication in a large scale one-to-many or star topology. EAD provides a standardised approach to the secure broadcasting of data in advertising packets, advised Infineon.

With PAwR, thousands of Bluetooth 5.4-enabled electronic shelf labels (ESL) and sensors will have bidirectional communication with a single access point. Messages can contain commands, sensor data values or other data, as defined by the application layer. EAD enables the encrypted data over-the-star network to be authenticated and decrypted only by devices that have shared the session key previously. Additionally, LeGATT security levels characteristic enables devices to identify the security mode and level for GATT functionality. The combination of these features enable low power, efficient radio usage and secure star networks that can be deployed in large scale ESL and sensor applications.

“With Infineon’s AIROC CYW20829 Bluetooth LE SoC, our customers can achieve great RF performance, the latest Bluetooth features, built-in security, rich set of peripherals, and low power, all in one device,” said Shantanu Bhalerao, Vice President of the Bluetooth product line at Infineon.

Airoc CYW20829 has best-in-class RF link budget, claimed Infineon, with an integrated power amplifier providing 10dBm of transmit output power and receive sensitivity of -98dBm for LE 1Mbits per second and -106dBm for LE Long Range 125kbits per second.

The Airoc CYW20829 is supported by the ModusToolbox development environment which enables developers to accelerate time-to-market for Bluetooth-enabled IoT solutions.

The SoC is currently sampling to select customers.

http://www.infineon.com

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Low noise, high PSRR uModule regulator powers noise-sensitive applications

Thu, Mar 23, 2023

Patented silicon, layout and packaging contribute to the low noise, dual output DC/DC uModule regulator released by Analog Devices (ADI). The LTM8080 operates from up to 40V input.

The front-end is a high efficiency synchronous Silent Switcher step-down regulator followed by two separate low noise, low dropout (LDO) regulators. The packaging integrates an EMI barrier wall or shield, designed to further suppress switching noise, explained ADI. The company said that the result is exceptional low noise values of less than 1.0 microV RMS (10Hz to 100kHz), 2nV/√Hz (10kHz) spot noise, and 80dB PSRR (100kHz). Compared to discrete solutions without an EMI shield, the LTM8080 reduces output ripple voltage by up to 70 per cent for a simplified and quiet design.

The LTM8080 is specifically designed to power digital loads that are susceptible to switching regulator noise such as data converters, RF transmitters, FPGA I/O and clock, op amps, transceivers and medical scanners.

The LTM8080 µModule regulator’s integrated Silent Switcher architecture enables the device to pass CISPR22 Class B and CISPR25 Class 5 without an input filter. The adjustable switching frequency (200kHz to 2MHz) and selectable operation modes minimise the risk of frequency interference for very low noise instrumentation and high speed/high precision signal chain applications.

The LTM8080 has a dual 500mA or single 1.0A output current with output voltages of 0 to 8.0V. The design includes a voltage tracking function to minimise power loss and features a 100 microA set pin current with ± one per cent. Initial accuracy can be paralleled for lower noise and higher current.

Two versions are available and in full production now. The LTM8080EY#PBF and the LTM8080IY#PBF are both provided in a 9.0 x 6.25 x 3.25mm BGA.

http://www.analog.com

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Infineon makes Secora Pay available in 28nm

RZ/T2L industrial MPU provides real-time control with EtherCAT communication

Infineon includes Bluetooth 5.5 in Airoc SoCs

Low noise, high PSRR uModule regulator powers noise-sensitive applications

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