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Design flows are based on the Integrity 3D-IC platform

Thu, May 04, 2023

Design flows based on the Integrity 3D-IC platform have been announced by Cadence Design Systems to support the TSMC 3Dblox standard for 3D front end design partitioning in complex systems.

Cadence flows are optimised for all of TSMC’s latest 3DFabric offerings, including integrated fan-out (InFO), Chip-on-Wafer-on-Substrate (CoWoS) and System-on-Integrated-Chips (TSMC-SoIC) technologies. By using these design flows, customers can accelerate the development of advanced multi-die package designs for emerging 5G, AI, mobile, hyperscale computing and IoT applications, said Cadence.

The Cadence Integrity 3D-IC platform combines system planning, packaging, and system level analysis and is certified for use with the TSMC 3DFabric and the 3Dblox 1.5 specification. The flows based on this platform incorporate new features like 3D routability-driven bump assignment and hierarchical bump resource planning. 3Dblox, which is inherently supported by the Integrity 3D-IC platform, provides a seamless interface for Cadence system analysis tools for early power delivery network (PDN) and thermal analysis via the Cadence Voltus IC Power Integrity Solution and Celsius Thermal Solver system analysis tools; extraction and static timing analysis via the Cadence Quantus Extraction Solution and Tempus Timing Signoff and system level layout versus schematic (LVS) checks via the Cadence Pegasus Verification system.

“3D-IC technology is key to meeting the performance, physical size, and power consumption requirements to enable next-generation HPC and mobile applications,” said Dan Kochpatcharin, head of the design infrastructure management division at TSMC. “By continuing our collaboration with Cadence, we’re enabling customers to leverage our comprehensive 3DFabric technologies and the Cadence flows that support our 3Dblox standard, so they can significantly improve 3D-IC design productivity and speed time to market,” he added.

“The Cadence flows based on the Integrity 3D-IC platform incorporate everything a customer needs to quickly design a leading-edge 3D-IC using TSMC’s latest 3DFabric technologies,” added Dr. Chin-Chi Teng, senior vice president and general manager in the digital and signoff group at Cadence.

The Cadence Integrity 3D-IC platform, including Allegro X packaging technologies, is part of the company’s broader 3D-IC offering and aligns with the Cadence Intelligent System Design™ strategy, enabling SoC design excellence. The Cadence reference flows and tutorials are available on TSMC Online now.

http://www.cadence.com

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Simplicity Studio supports Mikroe’s mikroSDK 2.0 Click board driver

Wed, May 03, 2023

Silicon Labs is the first IC vendor to integrate MikroElektronika (Mikroe)’s mikroSDK Click Board drivers to its software environment.

Support for the mikroSDK 2.0 Click drivers was achieved by adding a hardware driver extension (plugin) into Mikroe’s Gecko SDK (software development kit), which is now available within Silicon Labs’ Simplicity Studio IDE (integrated development environment). This integration means embedded engineers can use the Mikroe peripheral Click boards to develop both the hardware and software for an embedded system based on Silicon Labs’ controllers.

Nebojsa Matic, Mikroe’s CEO, said: “Many IC vendors now include the mikroBUS socket standard on their development boards. This enables developers to try out thousands of different peripheral Click boards, saving hardware cost and design time”. The addition of the mikroBUS socket in Silicon Labs’ Explorer Kits, has added hardware driver extension support for the mikroSDK 2.0 Click drivers into the silicon company’s IDE, Simplicity Studio GSDK which will allow designers using Silicon Labs SoCs or microcontrollers to easily include Click board libraries into their code. According to Matic, this means that engineers will save time and money by using the Click boards hardware, but they will have also seamlessly addressed the software task too. “It’s a real validation of our approach,” he added.

Anders Pettesson, director of mass market marketing at Silicon Labs, added: “After partnering with Mikroe on Click board projects and seeing the possibilities of the ecosystem, we decided to bring that flexibility and ease of use to the Silicon Labs environment. By creating the mikroSDK 2.0 Click driver extension, we’ve now made it easy for embedded engineers to add thousands of peripherals to Silicon Labs software projects.”

MikroElektronika (Mikroe) invented the mikroBUS development socket standard and the compact Click boards for peripherals that use the standard to dramatically cut development time. Since its introduction in 2011, the company now offers 1350+ Click boards – 10 times more than competitors. The mikroBUS standard is included by leading microcontroller companies on their development boards.

SiBrain is Mikroe’s standard for microcontroller development add-on boards and sockets and the company’s DISCON standard enables uses to choose between a wide variety of supported LCDs and touchscreen options. Mikroe also offers the NECTO IDE and a wide range of compilers, development boards, programmers and debuggers.

http://www.mikroe.com

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Basler integrates 18Mpixel image sensor in ace 2 camera series

Tue, May 02, 2023

Integrating Gpixel’s 18Mpixel GMAX2518 CMOS global shutter sensor in the ace 2 camera series, Basler said it is supporting the trend toward higher resolutions in smaller sensor formats.

The sensor has 4508 x 4096 pixels resolution and a pixel size of 2.5 x 2.5 micron in a one inch sensor format, enabling the ace 2 cameras to deliver good image quality, especially when combined with the matching Basler C11 lenses, said the company. The series joins the earlier ace 2 Gpixel models which have 5Mpixel GMAX2505 and 9Mpixel GMAX2509 sensors. The 18 Mpixel models are available with USB 3.0 and GigE interfaces in both mono and colour versions. The ace 2 Pro product line has a range of matched and tested vision products, as well as vTools for image processing functions within the pylon camera software suite.

With the help of powerful small pixels, ever higher resolutions can be achieved on smaller sensor formats. Basler expands the Basler ace 2 camera family with this latest series to offer a total of 110 models. The portfolio includes sensors from Gpixel and Sony, with resolutions from 2.3 to 24Mpixels and frame rates up to 160 frames per second.

Basler offers a broad, co-ordinated portfolio of vision hardware and software. In addition, it enables customers to solve vision application issues by developing customer-specific products or solutions.

Founded in 1988, the Basler Group employs more than 1,000 people at its headquarters in Ahrensburg, Germany, as well as other sales and development locations throughout Europe, Asia, and North America. The company invests in the development of innovative, reliable products and a sales and service organisation, as well as co-operation with renowned partners.

http://www.baslerweb.com

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Pre-assembled connectors plug in to automation trends

Tue, May 02, 2023

Mobile machinery in agriculture and construction challenges automation specialists, said binder. The increasing degree of automation, agricultural and construction machinery is becoming a more and more important field of application for advanced sensors and actuators. They are used for inclination, position, or level detection, but also for actuators or valve controls.

Furthermore, displays, lighting, operating devices, and diagnostics modules have to be connected within the mobile machines, such as tractors and their attachments to combine harvesters and crop choppers to excavators, cranes, or dump trucks. The safe and fast connection of automation components is becoming immensely important, said binder.

Proven technologies, such as Deutsch DT or AMP Superseal, meet automation components and binder provides industrial circular connectors that are ready to connector for the Deutsch DT, AMP Superseal and AMP CPC model series. These, in combination with connectors from the binder portfolio are part of its Plug&Play product selection, together with connectors pre-assembled with cables also available if required.

Cable switches with wiring options tailored to different applications enable connector systems of different designs to be combined in order to customise connectivity for mobile machines. For customers, this range can reduce the cabling effort and ensure a tamper-proof design, said binder.
Connector types such as the Deutsch DT, and the Superseal and CPC series from the manufacturer AMP have become established in such agricultural applications. The international standard for agricultural technology, ISOBUS according to ISO 11783, also defines certain interfaces in this market sector.

Integrating advanced sensor/actuator technology with the industry-proven connection technologies is a key challenge for machine engineers.

In order to ease this task for system integrators, binder offers both Deutsch-DT, and AMP Superseal and CPC connectors as part of its Plug&Play portfolio, in addition to its own series. This provides the user with the ability to combine a wide variety of connector types as needed. The products for agricultural and construction machinery meet IP67 protection degree requirements when mated. They are equipped with a process-safe cable overmould to relieve the wires from tension forces. The connectors are suitable for use on moving assemblies, with designs which feature cables suitable for power track chains.

To meet individual designs, tailored to the respective field of application, binder’s Plug&Play portfolio allows various connector systems – in overmoulded form – to be combined to create customised solutions. This already applies to quantities as low as one. Since splitter cables are often in demand in addition to simple patch cables, the range also includes cable switches with a wide variety of wiring options.

The binder Plug&Play portfolio offers the possibility to realise overmoulded Y distributions with ratios of 1:2, 1:4, 1:6 and 2:6. Users can choose the connector types. The variability of connection provides them with a wide range of options. The maximum possible pin counts vary, depending on the distribution ratio, between eight and 18. Cable diameters range from 3.5 to 10mm and the largest possible wire gauge is either 0.5mm² (1:2) or 1.0mm².

http://www.binder-connector.de

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Design flows are based on the Integrity 3D-IC platform

Simplicity Studio supports Mikroe’s mikroSDK 2.0 Click board driver

Basler integrates 18Mpixel image sensor in ace 2 camera series

Pre-assembled connectors plug in to automation trends

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