Advantech has announced the release of its EPC-R7300 Orin Nano Super, an industrial embedded AI box PC featuring the NVIDIA Jetson Orin Nano 8GB system-on-module. Leveraging the powerful NVIDIA Jetson Orin platform, the EPC-R7300 delivers up to 67 TOPS of AI performance with ultra-low power consumption (25 watts). Its ultra-compact design (152×173×50 mm) and Ubuntu OS readiness facilitate seamless AI deployment, making it ideal for next-generation applications such as small Large Language Models (LLMs), Vision-Language Models (VLMs), and Vision Transformers (ViTs).
The EPC-R7300 Orin Nano Super, coupled with Jetpack 6.2, introduces advancements in AI performance, making it an ideal platform for deploying small LLMs, VLMs, and ViTs. With enhanced GPU, CPU, and memory capabilities, the Orin Nano Super efficiently supports models with fewer than 10 billion parameters, enabling tasks such as natural language understanding and generation directly on embedded devices. This capability supports diverse embedded applications such as conversational AI in robotics, voice interfaces for IoT, real-time translation, retail analytics, and industrial data and vision processing. By supporting small-scale LLMs, VLMs, and ViTs, the Jetson Orin Nano Super provides developers with a powerful, efficient, and privacy-focused solution, enabling real-time embedded intelligence across industries.
Advantech’s EPC-R7300 industrial-grade AI Box PC is engineered to meet the diverse computing needs of developers with its versatile I/O features, including RS-485, CAN bus, and multiple Ethernet ports. Supported by NVIDIA JetPack, the EPC-R7300 ensures a seamless migration from NVIDIA’s development ecosystem and simplifies integration by automatically enabling I/Os without requiring additional driver installations or configurations. For edge AI applications such as image inferencing, which demand high-quality camera inputs, the EPC-R7300 supports both USB and IP camera interfaces, making it ideal for vision-based systems. Additionally, it offers 4K resolution displays via its HDMI 2.0 port, while ensuring reliable data connectivity with 2 x GbE LAN ports. To expand functionality, the EPC-R7300 includes 2 x USB 3.2 Gen 1 ports, 3 x M.2 slots for wireless modules and storage expansion (1 x 2230 E-Key: Supports Wi-Fi 6 and Bluetooth, 1 x 3042/52 B-Key: Enables 4G/5G connectivity, 1 x 2280 M-Key: Comes pre-installed with a 128GB NVMe SSD, with additional expansion capability). With its robust features and ease of integration, the EPC-R7300 is a powerful and flexible solution for developers building next-generation edge AI systems.
The EPC-R7300 Orin Nano Super AI Box PC is engineered for durability in harsh industrial environments, supporting a wide operating temperature range (-20 ~ 60ºC / -4 ~ 140ºF), wide power input range (9 ~ 36 VDC), and high vibration tolerance (3.0 Grms). This rugged design enables users to quickly prototype field-side applications, streamlining the development process and minimising the time and resources required for system integration, verification, and transformation into a ready-to-use edge AI solution.
Designed to fulfil different application requirements in one kit, the EPC-R7300 provides up to 5 rear I/O configurations, including serial ports (RS-232, RS-485), isolated DIOs, USB 2.0, and a 4-port GbE hub to enable system capacity expansion. The I/O peripheral drivers are all integrated into the board support package (BSP) with NVIDIA Jetpack 6.2, making the EPC-R7300 capable of delivering excellent functionality without additional integration work.
The EPC-R7300 with NVIDIA Jetson Orin Nano Super support will be available starting Q1 2025.
