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NFC antennas expand Amphenol RF portfolio for keyless access

Thu, Aug 03, 2023

The near field communication (NFC) antennas that Amphenol RF has added to its portfolio of internal RF antennas support keyless access and smart tag applications. The antennas are easy to use, said the company and are designed to support NFC Forum standards.

NFC antennas offer high performance capabilities which support NFC Forum wireless standards. They are available in standard configurations with adhesive mount options. They are short range internal antennas which operate at 13.56MHz and are therefore suitable for compact IoT devices such as smartphones, tablets and portable gaming systems as well as in payment readers and ticketing systems. They are also commonly used in devices that require pairing with a Bluetooth device.

NFC antennas are extremely small in size and are manufactured from either PI or FR-4 materials, with or without ferrite and adhesive.

Testing, tuning and measurement capabilities of NFC antennas is available. The antennas are for use in quick, short range data transfer within smart IoT devices, advised Amphenol RF.

The NFC antennas are the latest additions to Amphenol RF’s range of internal and external options. They are designed to meet any design requirement, said the company but custom designs are also available if additional assembly is needed such as cable and connector or combo-design with a wireless charging coil.

Amphenol RF is a manufacturer of coaxial connectors for use in radio frequency (RF), microwave and data transmission system applications. The company is headquartered in Danbury, Connecticut, USA and has sales, marketing and manufacturing locations in North America, Asia and Europe. Standard products include RF connectors, coaxial adapters and RF cable assemblies. Custom engineered products include multi-port ganged interconnect, blind mate and hybrid mixed-signal solutions.

https://www.amphenolrf.com

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Radar sensor is smallest 60GHz with antennas in package, says Infineon

Mon, Jul 31, 2023

The BGT60UTR11AIP Xensiv 60GHz radar sensor is in a compact antenna in package (AIP) for a footprint of just 16mm², for use in consumer electronics, IoT applications and healthcare devices, said Infineon Technologies.

The company said it is the smallest 60GHz radar sensor with AIP available today and is suitable for small devices, for example vital sensing (heart and respiratory rate) and healthcare devices such as baby monitors and sleep trackers. It is also suitable for consumer electronics such as laptops, TVs and cameras, as well as smart home and building devices such as air conditioners, thermostats and smart doorbells. The radar sensor can also be used in industrial applications including robotics and tank level measurement.

The monolithic microwave integrated circuit (MMIC) is based on Infineon’s B11 SiGe BiCMOS technology. It has a wide bandwidth of 5.6GHz and a ramp speed of 400MHz per microsecond to enable high resolution frequency modulated continuous wave (FMCW) operation with sensitive presence and motion detection at up to 15m (50 feet). The sensor also enables precise distance measurement, 1D gesture and vital sign detection, all with sub-mm motion detection capabilities.

The integrated antennas provide a ±60 degree field of view while an integrated state machine enables real time data acquisition without processor interaction. The MMIC also includes a 12-bit ADC with a sampling rate of up to 4Msamples per second).

The MMIC’s built-in broadcast mode allows multiple chips to be synchronised. It also includes on-chip sensors for measuring Tx output power and temperature. A deep sleep mode ensures the sensor’s low power operation, added Infineon.

The Xensiv 60GHz radar BGT60UTR11AIP sensor can be ordered now and will begin shipping in Q4 2023. The Demo BGT60UTR11AIP and the radar development kit (RDK) are both available for download from the Infineon Developer Center (IDC).

https://www.infineon.com

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Modular industrial PCs combine edge AI built on AMD Ryzen

Mon, Jul 31, 2023

Israeli company, SolidRun has introduced the Bedrock R7000, a fanless edge AI industrial PC in a compact, rugged housing. It combines eight-core AMD Ryzen 7040 series processors with three Hailo-8 AI accelerators for AI applications. The fanless modular industrial PCs is specifically designed to meet demanding vision-based situational awareness in harsh environments.

The AMD Ryzen 7840HS processor is integrated with a 4nm APU (accelerated processing unit) with 8C/16T Zen4 CPU and integrated RDNA 3 Radeon 780M GPU (graphics processing unit). The 7840HS / 7840U processor features eight cores and 16 threads running at up to 5.1GHz and is based on the AMD Zen4 4nm microarchitecture that also integrates the AMD Radeon 780M GPU with up to 12 CUs at 2700MHz. CPU power can be precisely adjusted in BIOS between 8.0 to 54W. For Edge AI workloads, up to three Hailo-8 AI accelerators can be installed with combined inferencing performance of up to 78 tera operations per second (TOPS).

The 20 native PCIe Gen4 lanes and up to three Hailo-8 AI accelerators, each with 26 TOPS can be used together with NVME Gen4x4 storage, dual 2.5 Gbit Ethernet and 4x4K displays, explained SolidRun. The CPU and all devices are passively cooled by the Bedrock R7000’s fanless cooling system in an industrial temperature range of -40 to +85 degrees C.

Edge AI box PCs are used in multiple segments of the embedded market, including industry 4.0, robotics, autonomous guided vehicles, healthcare, transportation, smart cities, retail, agriculture, defence and utilities.

“Efficiency and scalability are key factors in advanced edge AI,” said Irad Stavi, IPC product line manager at SolidRun. The modular design of the Bedrock R7000 allows for customisation, for example around the Hailo-8 AI accelerators.

“An important feature of Hailo-8 AI accelerator and Hailo AI Software Suite is linear scaling of the inference performance simply by adding modules,” said Dima Caplan, product manager at Hailo.

RAM and storage are modular with two SODIMMs supporting 64Gbyte DDR5 ECC/non-ECC, and three NVME 2280 PCIE Gen4x4 devices, including enterprise-grade NVME with power loss protection (PLP). RAM and storage are conduction-cooled for reliable operation at extreme temperatures.

I/O includes four displays comprising HDMI 2.1 + three DP 2.1, dual 2.5 Gbit Ethernet (Intel I226), optional WiFi 6E + BT 5.3, 5G or LTE modem, four USB 3.2 ports and a console port. All I/O is organised on a single face to simplify integration.

Bedrock R7000 supports all major PC operating systems, including most Linux distributions, Windows Desktop, Server and IoT.

Power input is by a dedicated interchangeable module for supporting various deployment use cases. The default PM 1260 supports a wide voltage range of 12V to 60V

The enclosure is made of heavy-duty machined aluminium with an anodised finish. It is offered in three variants – 1.0 litre enclosure for dissipating up to 30W by convection, 1.6 litre for 60W and an 0.6 litre “Tile” variant for conduction cooling. The enclosure is suitable for DIN-Rail mounting with a specially designed zero-force locking bracket.

Bedrock R7000 fanless design can handle up to 60W, which is over three times the cooling capacity of typical fanless PCs of similar size, said SolidRun. Cooling innovations include liquid metal TIM, 360 degree stacked heat pipes, dual layer chimney effect heat exchanger and thermal coupling of all internal devices. Dimensions are 45 x 160 x 130mm for the 30W, 0.9 litre model, k73 x 160 x 130mm for the 60W, 1.5 litre model and 29 x 160 x 130mm for the Tile (0.6 litre) model.

http://www.solid-run.com

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Industrial air sensor module adds value to edge AI

Thu, Jul 27, 2023

An industrial air sensor module monitors temperature, humidity and six air quality index detection parameters. It has been developed by Innodisk with its subsidiary, Sysinno and is claimed to be easy to implement and requires minimal computing power.

The module offers real-time monitoring of particulate matter (PM2.5, PM10), carbon monoxide (CO), carbon dioxide (CO2), formaldehyde (HCHO), total volatile organic compounds (TVOC) and ozone (O₃) in addition to temperature and humidity.

The air sensor module can integrate with industrial personal computers (IPC), PCs, edge servers, and embedded systems through an I2C interface or USB sensor carrier board. The module’s design guarantees minimal computing power consumption and prevents excessive heating during operation, said Innodisk.

It is manufactured in-house by Innodisk and have passed third-party accuracy tests to surpass other OEM air sensor devices available in the market, claimed the company.

Modules can integrate into smart poles, EV charging stations, and kiosks and can be installed in facilities such as in hospitals and healthcare centres to enhance air and service quality. In a smart factory, businesses can implement the modules to optimise humidity and air quality levels and safeguard workers’ well-being.

Innodisk is a service-driven provider of flash memory, DRAM modules, and embedded peripheral products for industrial and enterprise applications.

https://www.innodisk.com

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NFC antennas expand Amphenol RF portfolio for keyless access

Radar sensor is smallest 60GHz with antennas in package, says Infineon

Modular industrial PCs combine edge AI built on AMD Ryzen

Industrial air sensor module adds value to edge AI

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