ST releases innovative satellite navigation receiver to democratise precise positioning

ST has introduced the Teseo VI family of global navigation satellite system (GNSS) receivers aimed at high-volume precise positioning use cases. For the automotive industry, Teseo VI chips and modules will be core building blocks of advanced driving systems (ADAS), smart in-vehicle systems, and safety-critical applications such as autonomous driving. They have also been designed to improve positioning capabilities in multiple industrial applications including asset trackers, mobile robots for home deliveries, managing machinery and crop monitoring in smart agriculture, timing systems such as base stations, and many more.

“Our new Teseo VI receivers represent a real breakthrough among positioning engines for several reasons: they are the first to integrate multi-constellation and quad-band signal processing in a single die; they are the first to embed a dual-Arm®-core architecture enabling both very high performance and ASIL-level safety for assisted and autonomous driving applications. Last but not least, they embed ST’s proprietary embedded Non-Volatile-Memory (PCM), thus delivering a very integrated, cost-effective, and reliable platform for new precise-positioning solutions,” said Luca Celant, Digital Audio and Signal Solutions General Manager, STMicroelectronics. “ST’s new satellite-navigation receivers will support exciting, advanced capabilities in automotive ADAS applications and enable many new use cases being implemented by industrial companies.”

Teseo VI is the first in the market to integrate all the necessary system elements for centimetre accuracy into one die, supporting simultaneous multi-constellation and quad-band operations. This innovation simplifies the development of end-user navigation and positioning products, enhances reliability even in challenging conditions like urban canyons, and reduces bill-of-materials costs. Additionally, the single chip accelerates time to market and allows for compact and lightweight form factors.

The new Teseo VI family of precise positioning receiver chips leverages decades of experience and integrates multiple ST proprietary technologies, including precise positioning and advanced embedded memory.

ST’s new GNSS device family includes the Teseo VI STA8600A and Teseo VI+, STA8610A, each with dual independent Arm® Cortex®-M7 processing cores for local control of all the IC’s (integrated circuit) functions. The Cortex-M7 brings powerful 32-bit processing and helps enable concurrent multi-constellation and multi-band operation on a single die.

Teseo VI+ can also host various enhanced positioning engines, developed independently by third ST Authorised Partner companies, to provide complete real-time kinematics for centimetre position accuracy.

Completing the family, the Teseo APP2 STA9200MA operates dual cores in lockstep, providing hardware redundancy for applications such as road vehicle guidance meeting ISO 26262 ASIL-B functional safety. Pin-compatibility between Teseo APP2 and other Teseo VI ICs simplifies PCB design for companies producing ASIL-certified and non-ASIL applications.

All variants feature ST’s innovative RF architecture and GNSS baseband design provides quad-band GNSS support (L1, L2, L5 and E6) with the unique ability to acquire and track only L5. This is highly effective in reducing outliers and increasing robustness in difficult conditions such as urban canyons and in the presence of jammers.

In addition, the proprietary phase-change memory (PCM) technology removes external memory needs, thereby minimising the system bill of materials (BOM) and simplifying the manufacturing supply chain. Proprietary PCM is robust to withstand challenging environments such as automotive, non-volatile like Flash, and has a small cell architecture suited to space-efficient on-chip integration.

The ICs all contain a full set of hardware cyber security features including secure boot, over-the-air firmware update, and output-data protection. In addition, ST’s hardware security module (HSM) provides robust protection against online hacking. The devices comply with the latest UNECE R155 and ISO 21434 specifications that mandate cybersecurity by design.

The Teseo VI product family is supported by an established ecosystem of suppliers and partners for algorithms, reference designs, and compatible complementary hardware.

The Teseo VI product family includes also two new GNSS automotive modules: the Teseo-VIC6A in a 16mm x 12mm form factor (embedding Teseo VI), and the Teseo-ELE6A in a 17mm x 22mm form factor (embedding Teseo VI+). These new modules simplify the integration of Teseo VI/VI+ ICs on the customer platform and ensure optimum performance.

https://www.st.com/teseo6

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Renesas teams up with Applus+ Labs to achieve PSA Certified Level 1 with CRA extension

Renesas has announced that it has successfully obtained PSA Certified Level 1 certification with the European Cyber Resilience Act (CRA) compliance extension for three of its latest microcontroller Groups (MCUs). This certification, evaluated by Applus+ Laboratories, marks a significant step in Renesas’ commitment to cybersecurity and compliance with upcoming European regulations.

The certified RA4L1 MCU Group features low power, 32-bit microcontrollers (MCUs) based on the Arm Cortex-M33 (CM33) core with Arm TrustZone® technology, delivering an ideal balance of low voltage operation, low power consumption and high performance. The integrated low power features, advanced security engine, and communication interfaces make these devices ideal for many Industrial Automation, Home Appliances, Smart Home, Consumer, Building/Home Automation and Medical/Healthcare applications.

The certified RA8E1 and RA8E2 MCU Groups, both based on the Arm Cortex-M85 (CM85) architecture, are designed for a wide range of applications including industrial automation, home appliances, smart home systems, and medical devices. The RA8E1 MCU Group features Arm Helium technology for Vision and Voice AI applications, while the RA8E2 MCU Group incorporates a Graphics LCD for advanced Human-Machine Interface (HMI) solutions.

PSA Certified, a leading global security framework established by Arm and industry partners in 2019, has introduced an extension to its Level 1 certification that addresses the compliance requirements of the upcoming European Cyber Resilience Act. This new regulation, set to become mandatory in December 2027, will apply to a broad spectrum of digital products.

“We’re proud to be at the forefront of IoT security,” said Daryl Khoo, Vice President of the Embedded Processing Marketing Division at Renesas. “Achieving PSA Certified Level 1 with the CRA compliance extension demonstrates our commitment to providing our customers with secure, future-proof solutions.”

“With the continued adoption of edge AI devices across all markets and new government regulations coming into effect, security must be prioritised to ensure trusted AI deployment, protecting both businesses and consumers,” said David Maidment, senior director, market strategy at Arm. “Initiatives like PSA Certified are fundamental to driving robust device security and we congratulate Renesas on these new certifications which showcase security leadership in the age of AI.”

Jose Ruiz, Cybersecurity BU Director at Applus+ Laboratories, added, “We are committed to providing cybersecurity evaluation solutions that boost market trust and help vendors comply with regulatory requirements. Reducing fragmentation in cybersecurity certification is key, and we welcome PSA Certified’s efforts to align with other private schemes as well as governmental requirements.”

PSA Certified Level 1 also offers additional extensions to comply with the European RED directive and the UK PSTI regulation, both applicable to connected and IoT products, further enhancing its value to manufacturers in meeting global security standards. In addition, Renesas has achieved PSA Certified Level 3 RoT Component certification for the RA8D1, RA8M1 and RA8T1 MCU Groups, further demonstrating Renesas’ long-term commitment to security, including physical protections for the Root of Trust. Visit the Renesas IoT security page for more information.

https://www.renesas.com/MCUs

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Infineon sensor technology enables integration of industry-first 5-axis robot arm

Infineon provides sensor technology to Roborock for its state-of-the-art Saros Z70 robotic vacuum. The standout feature of the smart robot is its industry-first 5-axis robot arm that can move obstacles out of its way and clean in areas that were previously blocked. This innovation is made possible by the small form factor of Infineon’s REAL3 Time-of-Flight (ToF) technology. Unveiled at CES 2025 in Las Vegas, today, Roborock launched the new Saros series in Germany.

Infineon’s REAL3 Time-of-Flight, jointly developed with pmdtechnologies, enables a next level of navigation and object recognition of robot cleaners with best-in-class performance and space efficiency. The technology is 100 times smaller compared to conventional laser distance scanner freeing up space for the integration of the retractable robot arm while maintaining a sleek and slim design, marking a significant advancement in the robotics industry. Furthermore, the integration of an additional Time-of-Flight camera from Infineon guarantees the precise and smooth operation of the robot arm, significantly enhancing the capabilities of the Saros Z70. For customers, this translates into increased benefits when using the robotic vacuum for home cleaning, as the robot arm can now move blocking objects and clean areas that used to be inaccessible.

“It’s a major breakthrough that Roborock, a market leader for robot vacuum cleaners, has recognised the full potential of Infineon’s sensor technology and transformed it into an innovative product that consumers have never seen before”, said Andreas Kopetz, Vice President of Ambient Sensing at Infineon. “The collaboration is a great example for Infineon reinforcing its position as a leading player in the field of sensors and its goal to make life easier, safer, and greener. Together with customers and partners.”

Enabling the industry-first 5-axis robot arm for a robot vacuum underlines Infineon’s ambitions to further strengthen the competitiveness and go-to-market approach in the area of sensors. To accelerate innovation and value to customers further, Infineon has combined its sensor and RF expertise in a new business unit (SURF, sensor unit and radio frequency) to drive the company’s growth in the sensors market. This strategic move will capitalise on the vast potential of the sensor and RF markets, projected to exceed 20 billion US-Dollars by 2027.

https://www.infineon.com/cms/en/product/sensor/

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Mouser now shipping Nordic’s Thingy:91 X prototyping platform for wireless IoT applications

Mouser is now shipping the new Thingy:91 X Prototyping Platform from Nordic Semiconductor. The Thingy:91 X is an easy-to-use, battery-operated prototyping platform for cellular Internet of Things (IoT) proof-of-concept (PoC) demos and initial cellular IoT device development for logistics, asset tracking, smart city, predictive maintenance, industrial and wearable applications.

The Nordic Semiconductor Thingy:91 X is designed to address the needs of emerging low-power cellular IoT applications utilising Nordic’s nRF9151 cellular IoT system-in-package (SiP) with an integrated Arm Cortex-M33 CPU and Arm TrustZone and CryptoCell security technology, which supports LTE-M, NB-IoT, GNSS, and NR+ certified for global operation. The Thingy:91 X platform comes preloaded with an asset-tracking application and a comprehensive set of sensors that monitor environmental conditions and movement, enhancing its utility in various IoT applications. The Thingy:91 X includes multiple digital and analog interfaces and peripherals for many design possibilities, including expansion options through a debug board connector and an expansion board connector compatible with Qwiic, STEMMA QT, and Grove systems.

The Thingy:91 X Prototyping Platform comes with all necessary modem firmware, RTOS, application software examples, and hardware reference designs to implement a full cellular IoT design. The Thingy:91 X features two user-programmable buttons for user input, with user-programmable RGB LEDs for output, along with a Nano/4FF SIM card slot, supporting (e)SIM, and bundled Onomondo and Wireless Logic SIM cards preloaded with data to connect to nRF Cloud out-of-the-box. The package also includes a 1350mAh rechargeable Li-Po battery to facilitate prototype field testing.

https://eu.mouser.com

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