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Space computing reference design provides high speed data connectivity

Thu, Oct 05, 2023

Based on Microchip Technology’s radiation-tolerant GbE PHYs, the QLS1046-Space reference design has been developed by Teledyne e2v to provide high speed data connectivity in space applications.

The space computing reference design was presented at EDHPC 2023 (European Data Handling & Data Processing Conference, October 2-6, 2023 in Juan-Les-Pins, France) and enables high speed data routing in space applications.

It features Teledyne e2v’s radiation tolerant Qormino QLS1046-Space processing platform and data communication technology from Microchip. The radiation-tolerant design delivers robust, high performance processing, with enhanced sub-system connectivity capabilities. The QLS1046-Space has 30,000 DMIPS computing capability via the quad Arm Cortex-A72 cores and four to 8Gbyte of high speed DDR4 and multiple high speed interfaces. The architecture can process and route large incoming data rates from various sources, including telecommunication RF front ends, high resolution image sensors, radars, and other processing devices in the spacecraft.

The GbE interfaces ensure high-speed connectivity, supported by Microchip’s radiation tolerant Ethernet PHYs, claimed Teledyne e2v. The space computing reference design uses the VSC8541RT PHY to offer two RGMII links, and the VSC8574RT to offer two SGMII interfaces. The four Gigabit Ethernet connections could be ported up to seven Ethernet interfaces by exploiting all high speed interfaces available for high speed transfers between the QSL1046-Space and the other devices placed on different accompanying boards within the satellite or spacecraft. Target use cases include Earth observation, satcom applications, defence in space and space debris monitoring.

“In the vast majority of cases, modern space hardware will have a decentralised architecture. Normally communication between the constituent subsystems relies on 10 to100Mbit data transfer rates, explained Thomas Porches, application engineer at Teledyne e2v. “Greater levels of functional sophistication are now being incorporated for purposes like advanced telecommunication schemes, real time image processing, AI-driven analysis, and navigation.

“By working with Microchip, we’ve been able to significantly boost the interfacing capabilities for designs using the QLS1046-Space, leading to accelerated speeds plus extended propagation range. Consequently, they are completely aligned with what space customers are now demanding for edge computing applications.”

Staff from both Teledyne e2v and Microchip will present papers relating to their involvement in edge-located processing and inter-board communication for space deployments at the conference.

http://www.teledyne.com

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Qualcomm launches next-generation XR and AR platforms

Wed, Oct 04, 2023

Two spatial computing platforms called Snapdragon XR2 Gen 2 and Snapdragon AR1 Gen 1 have been introduced by Qualcomm to enable the next generation of mixed reality (MR), virtual reality (VR) devices and smart glasses.

Snapdragon XR2 Gen 2 brings premium MR and VR technology into a single chip architecture for immersive experiences in thinner and more comfortable headsets, that do not require an external battery pack.

It is engineered to deliver a lag-free experience with immersive sound blending virtual content with the user’s physical surroundings and transition seamlessly between MR and VR experiences.

Snapdragon AR1 Gen 1 platform is designed with power optimisations for sleek, lightweight smart glasses that enable the user to capture, share or live-stream hands-free, directly from the glasses. On-device AI enables personal assistant experiences such as audio quality enhancement, visual search and real-time translation. There is also support for a visual heads-up display to enable content consumption, including video, that blend seamlessly in the users’ field of view.

The platforms were developed in close collaboration with Meta and will commercially debut on Meta devices in 2023. The Meta Quest 3 will be powered by Snapdragon XR2 Gen 2 Platform, and Ray-Ban Meta smart glasses collection will be powered by Snapdragon AR1 Platform. Other manufacturers are expected to follow next year.

“At Meta, we’re focused on developing the technologies of the future in mixed reality and smart glasses, as well as the foundational innovations that will one day power our vision for AR glasses,” said Andrew “Boz” Bosworth, Meta’s CTO and Head of Reality Labs.

“The Snapdragon XR2 Gen 2 and Snapdragon AR1 platforms are the latest purpose-built processors that are designed to power the next generation of MR and VR devices and sleek smart glasses for all,” said Hugo Swart, vice president and GM of XR, Qualcomm Technologies. “The commercial debut of these two platforms with Meta is a further step forward in realizing our joint vision – unlocking premium, all-in-one XR devices and smart glasses that are affordable to users around the globe.”

http://www.qualcomm.com

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Cube architecture targets powerful edge AI devices, says Winbond

Mon, Oct 02, 2023

Affordable edge AI computing can be enabled in mainstream use cases with the CUBE customised ultra-bandwidth elements) architecture which has been introduced by Winbond Electronics. The architecture optimises memory technology for seamless performance running generative AI on hybrid edge/cloud applications.
CUBE enhances the performance of front-end 3D structures such as chip on wafer (CoW) and wafer on wafer (WoW), as well as back-end 2.5D/3D chip on Si-interposer on substrate and fan-out solutions, said Winbond. It is compatible with memory density from 256Mbit to 8Gbit with a single die, and it can also be 3D stacked to enhance bandwidth while reducing data transfer power consumption.

Winbond said CUBE is a major step forward, enabling seamless deployment across various platforms and interfaces. The technology is suited to advanced applications such as wearable and edge server devices, surveillance equipment, ADAS and co-robots, said the company.
The company believes that the integration of cloud AI and powerful edge AI will define the next phase of AI development. “With CUBE, we are unlocking new possibilities and paving the way for improved memory performance and cost optimisation on powerful edge AI devices,” added the company.
CUBE is power efficient, consuming less than 1pJ/bit, ensuring extended operation and optimised energy usage. It has bandwidth capabilities ranging from 32Gbytes per second to 256Gbytes per second per die for accelerated performance that exceeds industry standards.
Memory capacities range from 256Mbit to 8Gbit per die, based on the 20nm specification now and 16nm in 2025. This allows CUBE to fit into smaller form factors seamlessly. The introduction of through-silicon vias (TSVs) further enhances performance, improves signal and power integrity while reducing the I/O area through a smaller pad pitch, said Winbond. It also reduces heat dissipation, especially when using SoC on the top die and CUBE on the bottom die, advised the company.
It is also cost-effective, said Winbond, boosting the data rate up to 2Gbits per second with total 1K I/O. When paired with legacy foundry processes like 28nm/22nm SoC, CUBE unleashes high bandwidth capabilities, reaching 32 to 256Gbytes per second, equivalent to harnessing the power of 4-32pcs LP-DDR4x 4266Mbits per second x16 I/O bandwidth.
Stacking the SoC (top die without TSV) on top of the CUBE (bottom die with TSV) minimises the SoC die size, eliminating any TSV penalty area, said Winbond.
The company said CUBE can unleash the full potential of hybrid edge/cloud AI to elevate system capabilities, response time, and energy efficiency.
The company added that it is actively engaging with partner companies to establish the 3DCaaS platform, which will leverage CUBE’s capabilities.
Winbond Electronics supplies semiconductor memory products with capabilities of product design, R&D, manufacturing and sales services. The company’s product portfolio consists of specialty DRAM, mobile DRAM, code storage flash and TrustME secure flash for tier-1 customers in communication, consumer electronics, automotive and industrial, and computer peripheral markets.
Winbond is headquartered in Central Taiwan Science Park (CTSP), and has subsidiaries in the USA, Japan, Israel, China, Hong Kong and Germany and 12 inch fabs in Taichung and Kaohsiung in Taiwan.

https://www.winbond.com

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Contactless connections simplify and streamline design, says Molex

Wed, Sep 27, 2023

The MX60 series of contactless connectivity solutions have been developed to ease device pairing, streamline design engineering and boost product reliability, said Molex.

These low power, high speed, solid state devices feature miniaturised mmWave RF transceivers and built-in antennas in a single package. They deliver faster, simpler, device-to-device communications without the use of physical cables or connectors, said the company. The MX60 solutions can offer seamless device pairing and increased communications reliability for video displays, sleek and light consumer electronics, industrial robotics and devices operating in harsh environments, the company continued.

The MX60 series is based on wireless chip-to-chip technology and more than 350 filed patent applications acquired in 2021 with the purchase of core technology and IP from high-speed, contactless connectivity company, Keyssa. The acquired technology operates at data rates from 1,0 to 5.4Gbits per second on the 60GHz band with no Wi‑Fi or Bluetooth interference.

The first models in the MX60 series replace traditional DisplayPort, Gigabit Ethernet and USB SuperSpeed connectors to reduce development time, cost and risk, explained Molex. An integrated retimer optimises signal integrity at higher data rates.

A space-saving, contactless solution that provides USB2 and other low-speed interfaces is currently in development.

“Every piece of real estate counts when designing smartphones, AR/VR glasses, smartwatches and other consumer devices,” said Walter Rivera, senior manager, wireless connectivity product manager for the Micro Solutions business unit at Molex. “By combining USB2 and other low-speed interfaces in one contactless solution, we will offer product developers a critical head-start as they won’t have to worry about fitting extra components into ever-shrinking form factors,” he added.

The MX60 series also improves the durability of products exposed to harsh environmental conditions, such as dust, moisture and corrosion. The series addresses a variety of applications and devices, including smartphones, AR/VR glasses, tablets, self-driving vehicles, video walls, industrial robotics, medical wearables and wireless docking stations.

The sealed, contact-free solutions provide significant benefits over physical metal-to-metal contacts which can degrade over time and impact product performance and reliability, claimed the company. The contactless connectivity solutions are less prone to risks associated with ingress and repeated motion, including high-vibration and rotational products. The ability to remove diagnostic ports on wirelessly charged devices also can reduce development and production costs while boosting overall product reliability.

Production samples are available for MX60 USB SuperSpeed products, for high vibration and harsh environments, including mobile devices and networking applications, MX60 Gigabit Ethernet, for wireless infrastructure, industrial automation, medtech and networking applications and MX60 DisplayPort main and auxiliary, the high speed replacements for conventional DisplayPort connectors.

Plans are underway to expand the MX60 series further by leveraging Molex’s mmWave antenna, high-speed signal integrity and volume manufacturing expertise.

http://www.molex.com

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Space computing reference design provides high speed data connectivity

Qualcomm launches next-generation XR and AR platforms

Cube architecture targets powerful edge AI devices, says Winbond

Contactless connections simplify and streamline design, says Molex

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