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3D HAL-based position sensor has SENT interface

Mon, Oct 16, 2023

A Hall-effect sensor by TDK, the HAL 83927, is based on 3D HAL technology. The position sensor has a linear ratiometric analogue output with integrated wire break detection. It also has a SENT (single edge nibble transmission) interface with SENT protocol according to SAE J2716 rev. 4

It is also claimed to offer superior angular measurement and ISO 26262 compliant development to support safety critical automotive and industrial applications in a small SOIC8 surface mount package.

The HAL 83927 has been added to the company’s portfolio of Micronas direct angle, Hall-effect sensor family. with the new HAL® 3927* sensor for automotive and industrial applications.

Samples are available now with the start of production planned for Q1 2024.

The high resolution position sensor for position measurements. Its versatile programming characteristics and high accuracy mean that the HAL 3927 is suitable for linear movement measurements in transmissions, in clutch pedals, as an engine stroke sensor, for liquid level sensing, and for cylinder and valve position measurements, said TDK.

It is also well suited for rotary position measurement in gear selectors, as a rotary selector with push function or in rear-axis. Its accurate integrated temperature sensor allows customers to replace other external temperature sensors if the application is using the SENT interface, explained TDK.

The HAL 3927 can measure horizontal and vertical magnetic-field components BX, BY and BZ. Based on the signals of two out of three magnetic field components, the device can measure 360 degrees angular range and linear movements. On-chip signal processing calculates one angle out of two orthogonal magnetic field components and converts this value into an output signal. In addition to the integral signal processing, the sensor features an arbitrary programmable output characteristic, e.g., for linearisation of the output signal via up to 33 setpoints (17 variable- or 33 fixed). Major characteristics like gain and offset, reference position, etc. can be adjusted to the magnetic circuitry by programming the non-volatile memory.

This sensor is defined as ASIL B ready SEooC (safety element out of context) according to ISO 26262. It has a very low angular error of ±1.0 degrees at 30 mT amplitude with an end-of-shaft and off-axis 360 degrees angular measurement.

The sensor’s operating temperature range of -40 to +160 degrees C makes it suitable for automotive applications.

https://www.micronas.tdk.com

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NXP reference platform puts two-wheelers in the picture

Fri, Oct 13, 2023

A combined digital instrument cluster and connectivity reference platform delivers high performance graphics and rich connectivity for an advanced two-wheeler user experience, said NXP Semiconductors.

It is designed for mass-market two-wheelers, including motorcycles, electric scooters and commuter bikes. It combines the i.MX RT1170 crossover microcontroller with AEC-Q100 Grade 3 qualification. This helps reduce system costs due to the highly integrated nature of the i.MX RT1170, which does not require expensive external memory or power management subsystems, said NXP. The NXP Wi-Fi and Bluetooth device drivers are pre-integrated into the MCUXpresso SDK (software development kit), along with display and GNSS, making it easy for developers to create their own twowheeler connected cluster. The dual-core i.MX RT1170 crossover MCU provides a wide range of interfaces for connecting peripherals, such as WLAN, Bluetooth, GPS, audio, displays, and camera sensors, plus a vector graphics accelerator. The i.MX RT1170 crossover MCU’s rich graphics capabilities are supported by NXP’s broad ecosystem of partners, including Altia, The QT Company, Embedded Wizard by TARA Solutions, and Crank.

The reference platform also includes the integrated AW611 a highly integrated dual-band Wi-Fi 6 and Bluetooth/Bluetooth Low Energy 5.2 single-chip solution with AEC-Q100 Grade 2 qualification. This high degree of integration enables efficient coexistence between internal radios, as well as with external radios, while helping to reduce system costs, said NXP.

The KW45 secure wireless access microcontroller delivers secure vehicle access and vehicle location services. Its three-core architecture integrates a 96MHz Arm Cortex-M33 application core, a dedicated Cortex-M3 radio core and an isolated EdgeLock secure enclave. It also integrates a Bluetooth Low Energy 5.3-compliant radio that supports up to 24 simultaneous secure connections.

Connected digital displays with rich graphics are essential to the safe operation of two-wheeler electric vehicles, which are rapidly gaining in popularity for transport around cities. The displays can provide critical information that allows drivers to compare navigation details to battery levels and health, as well as the location of charging points.

Telemetry in the field also provides OEMs with important information about usage and battery lifetimes.

NXP’s digital instrument cluster and connectivity reference platform is designed to allow OEMs to deliver these capabilities, while also enabling a wide variety of different connectivity use cases designed to improve the user experience, for example three-way Bluetooth pairing between the phone, scooter’s digital cluster, and headphones, rider and pillion music sharing or even location capabilities such as “find my bike” in a parking lot.

“Not only does the digital instrument cluster inform the driver of the state of their vehicle, it also represents the main way a driver can customise their vehicle to their preferences,” said Dan Loop, vice president and general manager, Automotive Edge, NXP. “NXP’s digital instrument cluster and connectivity platform enables consistent updates and customizations to support the latest safety, security and connectivity features, all in a platform that balances performance and wireless connectivity capabilities with cost considerations.”

The platform enables high-performance graphics and rich connectivity use cases such as hands-free calling, wireless pairing for smartphone projection, Bluetooth audio, over the air (OTA) updates, cloud connectivity, fleet management, secure vehicle access and vehicle location.

http://www.nxp.com

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Advantech unveils its first Open Standard Module S Size

Fri, Oct 13, 2023

Industrial embedded company, Advantech has released the ROM-2620, its first Open Standard Module (OSM) designed to revolutionise AIoT applications with its low power consumption and small size.

The ROM-2620 is based on the Open Standard Module (OSM) Size-S form factor specified by the Standardization Group for Embedded Technologies (SGET). It incorporates NXP Semiconductors’ i.MX 8ULP applications processor with integrated EdgeLock secure enclave. According to Advantech, this combination offers modular embedded computing that is cost-effective, compact, and power-efficient at the intelligent edge.
The NXP i.MX 8ULP applications processor features two Arm Cortex-A35 cores for powerful processing, an Arm Cortex-M33 core for real-time response and a Cadence Tensilica Hifi 4 DSP and Fusion DSP for efficient edge AI / ML processing and acceleration. The processor is built using advanced 28nm FD-SOI process technology and NXP’s Energy Flex architecture. The i.MX 8ULP enables exceptional power efficiency in both static and dynamic modes. The Cortex-M33 reduces static power down to 36 microWatts for applications requiring extended battery life. The Cortex-A35 delivers a 40 per cent performance improvement from 32bit to 64bit at just 1.62W for main operation load. The NXP i.MX 8ULP device also offers 3D/2D GPUs and four-lane MIPI DSI parallel display interfaces to cater to industrial HMI graphics needs. Additionally, UART, GPIO, I2C, FlexCAN, and fast Ethernet interfaces enable edge data collection, control, and transmission.

The ROM-2620 adopts the standard OSM size-S form factor (30 x 30mm) with 332 pinouts to meet the growing space requirements of IoT applications. The LGA surface mount package is resilient to vibration, shock and other mechanical stressors, said Advantech, making it suitable for IoT edge nodes operating in harsh industrial environments.

To future-proof the OSM form factor, Advantech provides full support throughout the design-in process and volume production, to product lifecycle management. It also offers design references, hardware documentation and manufacturing guidelines, for example stencil design suggestion and IR reflow diagram, with practical tips and information to ensure project success and minimize time-to-market.

Integrating NXP’s High Assurance Boot (HAB) technology into Advantech’s AIM-Linux software service simplifies the establishment of secure systems, said the company. This ensures that only software images signed by developers can be executed on the SOC. By leveraging the NXP EdgeLock secure enclave integrated into the i.MX 8ULP as a built-in security subsystem, ROM-2620 provides a silicon root of trust and robust security architecture, protecting edge devices against physical and network attacks.

The low power, miniature ROM-2620 OSM is now available for sample purchase.
http://www.advantech.com

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Hyperlux HP image sensors extend battery life, says onsemi

Thu, Oct 12, 2023

Battery life in smart home and smart office devices can be extended with the Hyperlux LP image sensor, said onsemi.
They are suitable for industrial and commercial cameras such as smart doorbells, security cameras, AR / VR / XR headsets, machine vision and video conferencing. These 1.4 micron pixel sensors have low power consumption while maximising performance to capture crisp, vibrant images even in difficult lighting conditions., said the company.
Depending on the use case, customers can choose between the 5Mpixel AR0544, the 8Mpixel AR0830 or the 20Mpixel AR2020.
The stacked architecture design minimises the footprint and at its smallest approaches the size of a grain of rice, making it ideal for devices where size is critical, claimed onsemi.
The sensor can be used in home security cameras which demand high image quality, reliability and long battery life.
The image sensors can deliver clear images and more accurate object detection even in harsh weather and lighting conditions. Additionally, these cameras are often placed in locations that can be difficult to access to replace or recharge batteries, making low power consumption a critical feature.
To optimise performance, the sensors incorporate a wake on motion feature which enables them to operate in a low power mode that draws a fraction of the power needed in the full performance mode. Once the sensor detects movement, it moves to a higher performance state in less time than it takes to snap a photo.
Another feature is smart region of interest (ROI) delivering more than one ROI to give a context view of the scene at reduced bandwidth and a separate ROI in original detail.
The near-infrared (NIR) performance delivers superior image quality, said onsemi, due to the silicon design and pixel architecture, with minimal supplemental lighting.
It also reduces thermal noise and eliminates the need for heat sinks, reducing the overall cost of the vision system.
In addition to smart home devices, the Hyperlux LP family can be used in video conferencing systems.
The Hyperlux LP image sensor family will be available in Q1 2023.

http://www.onsemi.com

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3D HAL-based position sensor has SENT interface

NXP reference platform puts two-wheelers in the picture

Advantech unveils its first Open Standard Module S Size

Hyperlux HP image sensors extend battery life, says onsemi

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