Devices based on the Wi-Fi 7 communications standard are already being developed, creating a growing demand for test instrumentation that can evaluate them.
To meet this need, Anritsu has introduced a Network Mode option for its MT8862A wireless connectivity test set. This mode emulates real world operation to evaluate RF characteristics. It uses the data link layer communication protocol implemented in both the chip and the tester to establish communication. In addition to evaluating RF characteristics using conducted tests, the network mode is useful for over the air (OTA) wireless performance testing, including antenna characteristics, of finished products.
Developed by the Institute of Electrical and Electronics Engineers, the IEEE802.11be (Wi-Fi 7) wireless communication standard is the successor to the IEEE802.11ax (Wi-Fi 6/6E) WLAN standard, supporting theoretical maximum speeds up to 9.61Gbps.
The new standard is designed to achieve a transmission speed of 30Gbps or more, which is much faster than Wi-Fi 6/6E. In addition to extending conventional technologies, including 4096 QAM, 320 MHz channel bandwidth, and Multi-RU, Wi-Fi 7 also adopts new technologies such as multi-link operation (MLO), enabling a device to simultaneously send and receive data across different frequency bands and channels.
The development of the Wi-Fi 7 standard is scheduled for completion in 2024 and is expected to be used for devices that support the latest applications and services, such as ultra-high-definition video streaming and AR/VR. Devices using chips based on the draft standard of Wi-Fi 7 have already appeared and there is rapidly increasing demand for test instruments to evaluate these devices.
The MT8862A allows the user to specify the data rate for the test, enabling RF evaluation to be conducted at all the data rates used by the major WLAN standards, including Wi-Fi 7.
It also provides a test environment for evaluating RF TRX characteristics (e.g., TX power, modulation accuracy, RX sensitivity) of WLAN devices, including Wi-Fi 7.
Sector News
Renesas bases high performance MCUs on Arm Cortex-M85
Claimed to be the world’s most powerful microcontrollers (MCUs), the RA8 series from Renesas Electronics deliver breakthrough performance of over 3000 CoreMark points. It is also characterised by fully deterministic, low latency, real time operation.
The MCUs are believed to be the first to implement the Arm Cortex-M85 processor, enabling the new devices to deliver industry-leading 6.39 CoreMark / MHZ performance. They are part of Renesas’ RA family of MCUs based on Arm Cortex processors. Existing designs built for other RA devices can be ported to the new RA8 MCUs.
This level of performance will allow system designers to use the MCUs in applications that previously required microprocessors, advised Renesas
The RA8 series MCUs deploy Arm Helium technology, Arm’s M-Profile vector extension that provides up to a four-fold performance boost for digital signal processor (DSP) and machine learning (ML) implementations versus MCUs based on the Arm Cortex-M7 processor. This performance uplift can enable customers to eliminate an additional DSP in their systems for certain applications.
The MCUs enable edge and endpoint devices to implement natural language processing in voice AI and predictive maintenance applications, using Helium to accelerate the neural network processing.
“The advent of AI is increasing demand for intelligence at the edge and endpoints to serve new applications across diverse markets including industrial automation, smart home, and medical,” said Paul Williamson, senior vice president and general manager, IoT line of business, Arm. “Renesas’ new MCUs, built on Arm’s highest-performing and most secure Cortex-M processor to date, are specifically optimised for signal processing and ML workloads, and will be game-changing for innovators looking to address the growing AI opportunities in the embedded and IoT space, without compromising on security,” he added.
For security, the RA8 series MCUs’ Cortex-M85 core includes Arm TrustZone technology which enables isolation and secure / non-secure partitioning of memory, peripherals and code. The MCUs introduce the most advanced Renesas Security IP (RSIP-E51A) that provides leading edge cryptographic accelerators and supports a true secure boot. Other security features include immutable storage for a strong hardware root-of-trust, Octal SPI with decryption-on-the-fly (DOTF), secure authenticated debug, secure factory programming and tamper protection.
The Armv8.1-M architecture introduces Pointer Authentication and Branch Target Identification (PACBTI) security extension that provides mitigation for software attacks targeting memory safety violations and memory corruptions. The RA8 Series also targets PSA Certified Level 2 + Secure Element (SE), NIST CAVP and FIPS 140-3 certifications.
Low Power Features
Renesas has begun volume shipments of the first devices in the RA8 Series, the RA8M1 Group. These are general-purpose devices that address diverse compute intensive applications in industrial automation, home appliances, smart home, consumer, building/home automation, medical and AI in applications such as fingerprint scanners, thermostats, PLC, smart meters and home hubs.
They are available in a choice of packages: 100/144/176 LQFP, 224 BGA and supported by Flexible Software Package (FSP) to accelerate application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions.
Renesas is also shipping the RA8M1 Group Evaluation Kit (RTK7EKA8M1S00001BE).
Modules combine Wi-Fi 6/E and Bluetooth 5.4 with LE Audio
Designed to prevent network congestion in industrial applications, the MAYA-W3 is series of compact, dual mode Bluetooth LE 5.4 modules with LE Audio. They also support Wi-Fi 6/E and can be used in healthcare, asset tracking and management, and smart home applications as well as industrial automation and monitoring.
MAYA-W3 is based on Infineon chipsets with a tri-band, dual-band, and single-band variant. The low power AIROCTM CYW55513 Wi-Fi 6/6E and Bluetooth 5.4 chipset goes “beyond the Wi-Fi 6/6E standards to deliver robust connectivity,” said Sivaram Trikutam, vice president of Wi-Fi products at Infineon Technologies. It enables the module to be used in a variety of industrial applications like remote monitoring and control, industrial automation, asset tracking, solar infrastructure and EV charging, he added.
The modules are available in several variants, offering Wi-Fi 6, Wi-Fi 6/E, tri-band, dual-band, and single-band configurations. It can be combined with various antennas, such as antenna pin(s) or U.FL connectors. It is also equipped with an LTE filter to coexist with other technologies.
According to TSR (Techno Systems Research), Wi-Fi 6 adoption is expected to increase steadily, to account for almost 50 per cent of the market by 2028, with IoT devices beginning adoption as early as 2024. The u-blox MAYA-W3 series’ Wi-Fi 6 and the 6GHz performance, alleviate network congestion, claimed u-blox, as well as enhances power efficiency. The modules can operate in temperatures ranging from -40 to +85 degrees C.
The modules measure 10 x 14 x 1.9mm. These are the same dimensions as predecessors to allow for migration.
MAYA-W3 includes Bluetooth LE Audio for point-to-point voice communication and voice broadcasting. All module variants hold global certifications for both Wi-Fi and Bluetooth.
The u-blox technical support team can assist with fast implementation, added the company.
Samples are available now, with volume production scheduled for Q3 2024.
Advantech upgrades ESBCs for edge AI and industry
Advantech’s range of embedded single board computers (ESBCs) are now equipped with 13th generation Intel Core processors, Intel Core mobile processors and Intel Processor N series. These new processors will bring significant performance enhancements to the SBCs, said Advantech. They are suitable for use in smart factories, machine automation, machine vision, transportation, medical, retail, and edge AI applications.
Intel’s latest processors will be integrated into three products across 2.5-inch (pico-ITX) 3.5-inch and four-inch ESBCs and launches from Q3 2023 to Q1 2024. This will improve application efficiency in intelligent factories, retail, healthcare, and energy management, said Advantech.
The new processors will increase single-thread performance by up to 1.04x, multi-thread performance by up to 1.34x, and CPU image classification inferencing performance by up to 1.25x compared to 12th Gen Intel Core processors.
The MIO-2364 2.5-inch Pico-ITX SBC will be equipped with the Intel Processor N-series. It has dual independent display (LVDS and HDMI), GbE (optional PoE/PD, 802.3at), four USB, a COM, and SMBus / I2C ports, with M.2 E-Key and M.2 B-Key expansion options. It supports iManager and software APIs and WISE-DeviceOn.
The MIO-5377R will feature the 13th Gen Intel Core processor with up to 14 cores and TDP of 28/15W. It has four simultaneous displays: LVDS / HDMI / DP / USB-C and two LAN, eight USB (including one USB4), four UART, two CANBus and three I2C ports. There are also M.2 E-Key, B-Key and M-Key (which supports NVMe) options. The SBC supports Windows 10 LTSC and Ubuntu 22.04 LTS, embedded software APIs and WISE-DeviceOn.
The third SBC is the MIO-4370, a four-inch ESBC which will feature the 13th Gen Intel Core processor. This model is scalable with socket type CPU (LGA1700) and support for a standard CPU cooler. It has DDR5 4800 up to 32Gbyte and three simultaneous displays (dual HDMI+eDP). There is also dual high speed 2.5G Ethernet with TSN, two COM, CANbus and TPM and three expansion options of dual M.2 M-Key (with support for NVMe) and M.2 E-Key. This ESBC also supports Windows 10 LTSC & Ubuntu 22.04 LTS, embedded software APIs and WISE-DeviceOn.
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