NXP introduces battery cell controller IC designed for lifetime performance and battery pack safety

NXP has introduced its next-generation battery cell controller IC, designed to optimise battery management systems (BMS) performance and safety. With down to 0.8 mV cell measurement accuracy and maximum cell balancing capability over a wide temperature range, NXP’s MC33774 18-channel analog front-end device comes with ASIL D support for use in safety-critical, high-voltage lithium-ion (Li-ion) batteries to maximise the usable capacity.

Li-ion batteries are commonly used in EVs because of their high energy density by volume and weight, low self-discharge, low maintenance, and ability to sustain thousands of charge-discharge cycles. They account for approximately 30 to 40 percent of the total cost of the EV. A typical 800 V Li-ion battery system comprises around 200 individual cells connected in series. It is critical to accurately estimate the battery pack’s state-of-charge (SoC) at any given temperature and instant in the years-long life-cycle. NXP’s MC33774 is designed to deliver lifetime accurate cell measurement data in temperatures ranging from -40°C to +125°C, enabling very precise range predictions.

“The MC33774 has undergone a rigorous design and validation process to ensure its safety and reliability in automotive use,” said Robert Li, Vice President and General Manager, Product Line Driver and Energy Systems at NXP. “This includes system-level validation to test electromagnetic compatibility, electrostatic discharge, transient immunity, and communication reliability in demanding scenarios. The MC33774 is designed to reduce costs for OEM systems while maintaining its reliability, allowing for a safe launch of cars despite shorter development cycles in the EV industry.”

Based on NXP’s SmartMOS SOI (Silicon-on-Isolator) technology, the MC33774 Li-ion battery cell controller offers cell measurement accuracy down to ±0.8 mV, which helps to ensure lifetime performance with both nickel manganese cobalt (NCM) and lithium iron phosphate (LFP) cell chemistries. The precision design and calibration technologies of the NXP MC33774 save customers end-of-line (EoL) calibration costs.

The NXP MC33774 18-channel Li-ion battery controller IC is part of the NXP High Voltage BMS chip-set solution, which includes future products like the MC33777, a battery junction box controller for pack level measurement, and the already released MC33665 battery management communication gateway. The comprehensive and robust BMS system solution offers first-time-right battery systems while working to avoid field incidental surprises. The complete design package, which includes production-grade software and functional safety libraries, helps to accelerate the development time of functional safety systems and saves system bill-of-material costs.

https://www.nxp.com

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TDK releases new ASIL C ready stray-field robust 3D HAL sensors

TDK has furtherer extended its Micronas 3D HAL position sensor family with new HAL 3930- 4100 and HAR 3930-4100 for automotive and industrial applications. Both sensors empower precise position detection with robust stray-field compensation capabilities, offering flexible digital output interfaces in the form of PWM or SENT. The single die devices are defined as SEooC (Safety Element out of Context) ASIL C ready according to ISO 26262 and can be integrated in automotive safety-related systems up to ASIL D. The sensors are suitable for applications such as steering angle position detection, transmission position detection, shifter position detection, accelerator and brake pedal position detection.** . The start of production is planned for January 2024; samples are now available on request.

Both sensors offer user-configurable PWM or SENT output interfaces, which enhances adaptability. Additionally, the sensors introduce a switch output with versatile high-/low-side switch configurations. The switch signal originates from calculated position data or other sources along the device’s signal path, such as temperature or magnetic-field amplitude. As ASIL C ready devices, HAL 3930-4100 and HAR 3930-4100 both conduct self-tests when starting up and during regular operation to enhance its reliability. These tests are designed to either prevent the sensor from giving incorrect readings or to report errors either via the SENT interface according to the SENT standard or via the PWM interface.

HAR 3930-4100 is the dual-die version of the HAL 3930-4100, providing full redundancy. It is equipped with two independent dies stacked on top of each other, separated both mechanically and electrically. These two dies, while measuring nearly identical magnetic fields, ensure synchronised output signals. This redundancy design, housed within a single package, accomplishes the dual feat of reducing system costs and elevating overall reliability. Smaller PCBs and fewer solder joints further bolster system dependability. The HAR 3930-4100 is conveniently available in a compact SSOP16 package, while the single-die variant is housed in a SOIC8 package.

HAL 3930-4100 and HAR 3930-4100 offer an extensive range of measurement capabilities, encompassing 360° angular measurements, linear movement tracking, and the provision of 3D position data for magnets. This 3D position information can be transmitted through SENT or two PWM outputs. Moreover, the sensors feature a modulo function, primarily tailored for chassis position sensor applications. This function facilitates the partitioning of the 360° measurement range into smaller, more precise segments like 90°, 120°, and 180°.

Furthermore, the on-chip signal processing functionality computes up to two angles from magnetic-field components, converting them into a digital output signal. This flexible feature empowers customers to fine-tune essential parameters such as gain, offset, reference position, and more through non-volatile memory programming, ensuring seamless alignment with their specific magnetic circuitry requirements.

Further information on the products can be found https://www.micronas.tdk.com/en/products/direct-angle-sensors/hal-39xy.

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Infineon introduces the first 15 V trench power MOSFETs with OptiMOS™ 7 technology in PQFN packages

The ever-increasing power demand in data centres and computing applications requires advancements in power efficiency and compact power supply design. Infineon responds to trends on the system level by introducing its new OptiMOS™ 7 family, industry’s first 15 V trench power MOSFET technology. The OptiMOS 7 15 V series primarily targets optimised DC-DC conversion for servers, computing, datacenter, and artificial intelligence applications.

The product portfolio includes the latest PQFN 3.3 x 3.3 mm² Source-Down, with bottom- and dual-side cooling variants in standard- and centre-gate footprints. The portfolio also includes a robust PQFN 2 x 2 mm² variant with a reinforced clip. The OptiMOS 7 15 V technology is specifically tailored for DC-DC conversions with low output voltages, particularly in server and computing environments. This advancement aligns with emerging shifts towards high ratio DC-DC conversion in data-center power distribution.

Compared to the established OptiMOS5 25 V, the new OptiMOS 7 15 V achieves a reduction of R DS(on) and FOMQ g by ~30 percent, and FOMQ OSS by ~50 percent by lowering the breakdown voltage. The PQFN 3.3 x 3.3 mm² Source-Down package variants provide a more versatile and effective PCB-design. Furthermore, the PQFN 2 x 2 mm² package provides a pulsed current capability higher than 500 A and a typical R thJC of 1.6 K/W. By minimising conduction and switching losses and incorporating advanced packaging technology, thermal management becomes easy and effective, setting new benchmarks both for power density and overall efficiency.

Availability
The OptiMOS 7 15 V product portfolio can be ordered now and is available in two package sizes: PQFN 3.3 x 3.3 mm² Source-Down variants and PQFN 2 x 2 mm². More information is available at http://www.infineon.com/optimos-7-15v.

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Market leaders collaborate with Synopsys to realize gains of Generative AI

Synopsys aims to revolutionise the industry with generative AI capabilities, starting with Synopsys.ai Copilot, across the Synopsys.ai suite, building on its AI-driven optimisation and data analytics solutions.

Expansion of Synopsys.ai with generative AI capabilities will include collaborative, generative, and autonomous design to significantly boost productivity and accelerate innovation.

Synopsys have announced the expansion of its leading Synopsys.ai™ EDA suite, to bring the power of generative artificial intelligence (GenAI) across the full stack in order to dramatically improve engineering productivity for the semiconductor industry. This expands upon Synopsys’ recent announcement to deliver Synopsys.ai Copilot, the first in a series of GenAI capabilities for chip design.

The integration of GenAI across the Synopsys.ai suite will provide chip designers with collaborative capabilities that offer expert tool guidance; generative capabilities for RTL, verification, and other collateral creation; and autonomous capabilities for workflow creation from natural language. Synopsys is engaging early with leading chip makers including AMD, Intel, and Microsoft to leverage the value of GenAI across the Synopsys.ai full EDA stack, from design and verification to test and manufacturing.

“For 37 years, Synopsys has helped chipmakers solve their toughest design challenges and continues to be a catalyst for semiconductor progress,” said Shankar Krishnamoorthy, general manager, Synopsys EDA Group. “As the pioneer of AI-driven chip design, Synopsys is directly addressing engineering productivity during a period of talent shortages by expanding our leading Synopsys.ai suite to include generative AI capabilities across the full stack. This is an exciting time in the semiconductor industry and Synopsys continues to innovate relentlessly to enable the industry to meet stringent compute and performance-per-watt requirements of end markets.”

Synopsys is addressing the engineering productivity gap by delivering production-proven, AI-driven optimisation and data analytics capabilities across all stages of IC chip development. The Synopsys.ai EDA suite accelerates the chip design workflow by enabling companies to build more chips faster with a workforce that is not growing at the same pace as the industry demands.

https://www.synopsys.ai.

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