Microchip adds ECC20x and SHA10x families of secure authentication ICs to TrustFLEX platform

Secure key provisioning is vital to protect sensitive keys against third-party tampering and malicious attacks. For securing consumer, industrial, data centre and medical applications, secure key storage is essential but the process to develop and document secure key provisioning can be complex and costly. To lower the barrier of entry into secure key provisioning and enable more rapid prototyping, Microchip Technology has added the ECC204, SHA104 and SHA105 CryptoAuthentication ICs to its TrustFLEX portfolio of devices, services and tools.

ECC20x and SHA10x ICs are hardware-based, secure storage devices that are designed to keep secret keys hidden from unauthorised attacks. As part of the TrustFLEX platform, ECC204, SHA104 and SHA105 ICs are preconfigured with defined use cases, customisable cryptographic keys and code examples to streamline the development process.

“Adding the ECC20x and SHA10x pre-configured devices to our TrustFLEX platform will facilitate leveraging Microchip’s secure provisioning services for a broader set of applications,” Nuri Dagdeviren, corporate vice president of Microchip’s secure computing group. “With this platform expansion, Microchip is continuing to strengthen its portfolio, making security authentication ICs more accessible and more specifically optimised for high-volume, cost-sensitive applications.”

ECC20x and SHA10x devices meet Common Criteria Joint Interpretation Library (JIL) High rated secure key storage requirements and have been certified by the NIST Entropy Source Validation (ESV) and Cryptographic Algorithm Validation Program (CAVP) in compliance with the Federal Information Processing Standard (FIPS). The secure IC families are designed to implement trusted authentication to maintain the confidentiality, integrity and authenticity of data and communications in a wide range of systems and applications.

Microchip’s CryptoAuthentication ICs are small, low-power devices that are designed to be compatible with any microprocessors (MPUs) or microcontrollers (MCUs). They provide flexible solutions for securing industrial, medical devices, battery powered equipment and disposable applications. Additionally, the ECC204 is a Wireless Power Consortium (WPC) approved Qi authentication Secure Storage Subsystem (SSS).

ECC20x and SHA10x ICs are supported by Microchip’s Trust Platform Design Suite, which provides code examples and learning materials and enables the secure transfer of credentials to more easily leverage Microchip’s secure key provisioning services. The devices are also supported by the MPLAB X Integrated Development Environment (IDE), product-specific evaluation boards and CryptoAuthLib library support.

https://www.microchip.com

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Taiwan Semi’s new ESD protection devices are optimised for high-density electronics

Taiwan Semiconductor has introduced a new series of new ultra-small ESD protection devices optimised for wearables and other high-density electronic products. All DFN0603-packaged models in the 3.3V and 5.0V TESDx Series exceed the 8kV IEC61000-4-2 20kV contact discharge standard as well as IEC6100-4-5 4A peak pulse current, with margin. TESDx Series devices utilise Taiwan Semiconductor’s proprietary clamping cells to prevent overvoltage damage from ESD and lightning on control, power and data lines. Additionally, their industry’s lowest capacitance allows for full USB 3.0 data rates without compromise.

Applications for the new 3.3V/5.0V ESD protection series include wearable products, portable medical and test and measurement instrumentation and IoT and IIOT devices. Other applications include consumer electronics, computing, networking, peripherals, USB3.X ports and any application where ESD protection is needed — and where size is a top-of-mind concern.
The TESDx Series offers three models to choose from:
• TESDH3V3B03P1Q0 3.3V/40W 0.2pF
• TESDL3V3B23P1Q0 3.3V/70W 17pF
• TESDH5V0B03P1Q0 5.0/100W 0.2pF
“For wearables and other high-density electronic products, the devices used for ESD protection should be as small and thin as possible, so our new DFN0603-packaged devices are an ideal choice,” said Sam Wang, vice president, TSC Products. “The 3.3- and 5.0-volt models in the series provide full-compliance electrostatic discharge and electronic fast-transient protection, with margin. When protecting high-speed data signals, they also offer extremely low capacitance to ensure that the signal integrity in the application remains within spec and uncompromised.”

https://www.taiwansemi.com/en/

 

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Infineon expands its Bluetooth portfolio with eight new parts

Infineon has announced the expansion of its Bluetooth portfolio by eight new products in the AIROC CYW20829 Bluetooth Low Energy 5.4 microcontroller (MCU) family, featuring Systems-on-Chip (SoCs) and modules optimised for industrial, consumer, and automotive use cases. The high integration of the CYW20829 product family allows designers to reduce bill-of-material (BOM) cost and device footprint in a wide variety of applications, including PC accessories, low-energy audio, wearables, solar micro inverters, asset trackers, health and lifestyle, home automation and others. Product designers also benefit from Infineon’s development infrastructure and commitment to robust security, with support for secure boot and execution environments and cryptography acceleration to safeguard sensitive data.

The latest automotive part in the product family, the AIROC CYW89829 Bluetooth Low-Energy MCU, is ideal for car access and wireless battery management systems (wBMS) applications, due to its robust RF performance, long range and latest Bluetooth 5.4 features including PAwR (Periodic Advertising with Responses). The dual ARM Cortex core design of the chip family features separate application and Bluetooth Low Energy subsystems that deliver full featured support for Bluetooth 5.4, low-power, 10 dBm output power without a PA, integrated flash, CAN FD, crypto accelerators, high security including Root of Trust (RoT), and is PSA level 1 ready.

https://www.infineon.com

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TTI & Raffenday showcase advanced e-mobility connectivity technologies at Cenex Expo 2024

TTI will together with its recent acquisition Raffenday Ltd, showcase a broad portfolio of interconnect technologies and cable harnesses for low carbon vehicles at this year’s Cenex Expo, stand C4-612 in Hall 4. The event will be held from 4-5 September at UTAC Millbrook, UK.
During the show, visitors to the stand will have the opportunity to learn about innovative electronic technologies from TTI’s valued manufacturing partners for powertrain and battery charging applications, as well as Raffenday’s expertise in providing both high voltage and low voltage cable harnesses for electric and fuel cell vehicles. These technologies will provide customers with a one-stop shop for components needed to develop the next generation of electric and fuel-cell vehicles.
“Exhibiting at Cenex Expo 2024 underpins TTI IP&E Europe’s strategic direction towards supporting our customers and accelerating the electrification of the transportation sector,” says Dermot Byrne, Industry Marketing Director – Transportation at TTI Europe. “With Raffenday, the TTI family of specialists have a company with capabilities to produce highly customized high-and low voltage cable assemblies needed to develop prototype vehicles with the built-in capacity to support production volumes”.
Simon Blincow, General Manager and Sales Director, Raffenday Ltd, says: “With a legacy spanning 37 years in the specialised automotive and transportation sectors, Raffenday Ltd proudly joins the TTI family. We are catering to diverse industries, including specialist vehicles, industrial machinery, marine, and the evolving high-voltage and electric vehicle sectors, and our alignment with TTI signifies a seamless synergy for Raffenday’s journey ahead.”

https://www.ttieurope.com

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