Supermicro offers rack scale solutions with new 5th gen Intel Xeon processors 

Supermicro, announces rack scale air and liquid cooled solutions based on the X13 family of workload-optimised servers now support the new 5th Gen Intel Xeon processors (formerly codenamed Emerald Rapids). The new product lineup includes GPU servers for Generative AI, throughput and latency-optimised E3.S Petascale servers, cost-effective high-density Enterprise and Simply Double storage servers for large-scale object storage, and a new 4-node SuperEdge systems with enhanced storage capacity.

Supermicro X13 systems take advantage of the new processors’ built-in workload accelerators, enhanced security features, higher core count, more last-level cache, and increased performance within the same power envelope as the previous generation of Intel Xeon processors. The 5th Gen Intel Xeon processors provide a 36% higher average performance/watt across workloads vs. 4th Gen Intel Xeon Scalable processors.

The new Intel Trust Domain Extensions (Intel TDX) are built into the CPU die. Supermicro X13 systems also include firmware protected hardware root of trust (RoT) compliant with NIST 800-193, as well as benefiting from Supermicro’s supply chain attestation and ‘Made in the USA’ program for added security from production to end customer.

“5th Gen Intel Xeon processors deliver meaningful performance and efficiency improvements for our customers’ most important workloads,” said Lisa Spelman, corporate vice president and general manager Xeon Products & Solutions at Intel. “Supermicro’s X13 range of servers are designed to give customers the fastest path to increased performance given their compatibility with 4th Gen Xeon based platforms already in the market.”

Among the new additions to the broad X13 server range is a new dual processor GPU server with 8 Intel Data Centre GPU Max 1550 OAM GPUs optimised for large-scale AI training, generative AI, and HPC applications. The Intel Data Centre GPU Max 1550 GPUs utilises the open-standard Open Accelerator Module (OAM) form factor for flexible high-speed interconnect and contains 128GB of HBM2e memory for a maximum GPU memory bandwidth of 3276.8 GB/second. Both CPU and GPU direct-to-chip liquid cooling are available on the system via Supermicro’s complete rack integration and liquid cooling solutions.

Supermicro is also launching several new servers supporting the new Intel Xeon E-2400 processors (formerly codenamed Catlow Platform, Raptor Lake-E). The new systems are optimised for maximum efficiency Edge and Cloud workloads and include the I/O flexible WIO, storage-optimised, short-depth, and mid-tower configurations, as well as multi-node Supermicro MicroCloud and Supermicro MicroBlade architectures. The new Intel Xeon E-2400 processors have up to 8 cores and a top frequency of 5.6 GHz. These servers are available for shipping immediately

https://www.supermicro.com/

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Time-of-flight sensor from ST boosts ranging performance and power saving

ST has announced the latest-generation 8×8 multi-zone time-of-flight (ToF) ranging sensor that delivers a range of improvements including greater ambient-light immunity, lower power consumption, and enhanced optics.

ST’s direct-ToF sensors combine a 940nm vertical cavity surface emitting laser (VCSEL), a multi-zone SPAD (single-photon avalanche diode) detector array, and an optical system comprising filters and diffractive optical elements (DOE) in an all-in-one module that outperforms conventional micro lenses typically used with similar alternative sensors. The sensor projects a wide square field of view of 45° x 45° (65° diagonal) and receives reflected light to calculate the distance of objects up to 400cm away, across 64 independent zones, and up to 30 captures per second.

The new VL53L8CX boosts ranging performance with a new-generation VCSEL and advanced silicon-based meta-optics. Compared with the current VL53L5CX, the enhancements increase immunity to interference from ambient light, extending the sensor’s maximum range in daylight from 170cm to 285cm and reducing power consumption from 4.5mW to 1.6mW in low-power mode.

ST released the first multi-zone time-of-flight sensor with the VL53L5CX in 2021. By increasing performance, the new VL53L8CX now further extends the advantages of these sensors over alternatives with conventional optics, which have fewer native zones and lose sensitivity in the outer areas. Thanks to its true 8×8 multi-zone sensing, the VL53L8CX ensures uniform sensitivity and accurate ranging throughout the field of view, with superior range in ambient light.

When used for system activation and human presence detection, the VL53L8CX’s greater ambient-light immunity enables equipment to respond more consistently and quickly. As part of ST’s STGesture platform that also includes the STSW-IMG035 turnkey gesture-recognition software and Gesture EVK development tool, the new sensor delivers the precision needed for repeatable gesture-based interaction. In addition to motion gesture recognition, hand posture recognition is also possible leveraging the latest AI models available in the STM32ai-modelzoo on GitHub.

Moreover, the VL53L8CX provides increased accuracy for monitoring the contents of bins, containers, silos, and tanks, including liquid-level monitoring, in industrial bulk storage and warehousing. The superior accuracy can also enhance the performance of drinks machines such as coffee makers and beverage dispensers.

Mobile robots including autonomous vacuum cleaners can leverage the VL53L8CX to improve guidance capabilities like floor sensing, small object detection, collision avoidance, and cliff detection. Also, the synchronisation pin enables projectors and cameras to benefit from coordinated autofocus. There is also a motion indicator, an auto-stop feature that allows real-time actions, and the sensor is immune to cover-glass crosstalk beyond 60cm. Now supporting SPI connectivity, in addition to the 1MHz I2C interface, the new sensor handles host data transfers at up to 3MHz.

Designers can quickly evaluate the VL53L8CX and jump-start their projects taking advantage of the supporting ecosystem that includes the X-NUCLEO-53L8A1 expansion board and SATEL-VL53L8 breakout boards. The P-NUCLEO-53L8A1 pack is also available, which contains a STM32F401 Nucleo microcontroller board and X-NUCLEO-53L8A1 expansion board ready to power up and start exploring.

 

http://www.st.com/VL53L8CX

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Renesas launches cloud-based environment to accelerate automotive AI software development

Renesas has launched a new cloud-based development environment aimed at streamlining the software design process for automotive AI engineers. The new platform, AI Workbench, is an integrated virtual development environment that empowers automotive AI engineers to design, simulate and fine-tune their automotive software – all within the cloud.

With this environment, engineers can immediately begin designing automotive software by leveraging Microsoft Azure services including Azure Compute, IaaS services, Microsoft Entra ID and Azure Security. Instead of installing tools on a PC or obtaining an evaluation board, they can perform tasks such as performance evaluation, debugging and verification using simulation tools online. This approach aligns with the “Shift-Left” approach, which enables software creation and testing earlier in the design cycle, even before the actual hardware becomes available. For example, it is possible to start developing AI-enabled application software to support ADAS (Advanced Driver Assistance System) and autonomous driving for the upcoming fifth-generation R-Car System on Chip (SoC) prior to the availability of hardware samples. This environment will serve as a unified development platform for designing and testing Renesas’ scalable automotive SoCs and microcontrollers (MCUs), regardless of product type or application.

“Cloud-based development is a secure and cost-effective method to address the increasing complexities of today’s embedded projects. The collaboration between Renesas and Microsoft aims to tackle this challenge and accelerate the digital transformation of the automotive industry,” said Ulrich Homann, Corporate Vice President & Distinguished Architect, Cloud + AI, Microsoft. “With Renesas’ AI Workbench, developers can now efficiently build and test software for a myriad applications using Renesas SoCs in a cloud-based environment powered by Azure.”

The AI Workbench includes the following four functional blocks today. Renesas plans to enhance its offering in the future with additional features such as selected functionality or customisation options tailored to support various development processes.

Availability
The AI Workbench will be available in January 2024 in limited preview. Renesas plans to expand availability of the AI Workbench from Q2 2024 and build similar environments for other major cloud services in the future. Additionally, Renesas will consider integrating tools provided by partners of the R-Car Consortium into the cloud environment for improved efficiency. More information about the AI Workbench is available at: https://renesas.com/ai-workbench.

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Optimising automation with Axiomtek’s new GPU edge system

Axiomtek has unveiled the eBOX671B, a fanless edge computing system that offers optimal data transferring with 2.5GbE LAN ports, cellular 5G module, and Wi-Fi 6 module support for edge computing in industrial automation. With its compatibility with MXM 3.1 Type A GPU cards, the eBOX671B can effectively accommodate up to five display outputs, ensuring optimised performance for various display requirements. Designed to operate reliably in industrial environments, the IP40-rated embedded system features a wide operating temperature of -40°C to +65°C, 3 Grms vibration resistance, and a 9 to 36 VDC power input. The eBOX671B is well-suited for various industrial automation applications such as edge controllers, embedded controllers, machine vision, OT servers, robotics, and more.

The eBOX671B is powered by the 13th/12th gen Intel® Core™ i9/i7/i5/i3 and Celeron® processors with Intel® R680E chipset (codename: Alder Lake S). The reliable eBOX671B comes with two 262-pin DDR5-4800 SO-DIMM slots with up to 64GB of system memory. Two 2.5” SATA HDD/SSD (RAID 0,1 supported) drive bays, one NVMe through M.2 Key M 2280 slot, and one mSATA are available for extensive storage needs. Up to five display outputs are enabled via two HDMI 1.4b, one DisplayPort 1.4a, and two DisplayPort 1.4a via an optional MXM module kit. The eBOX671B also offers great expansion interfaces with one full-size PCI Express Mini Card slot, one M.2 Key M 2280 socket for storage, one M.2 Key E 2230 socket for Wi-Fi 6E, and one M.2 Key B 3052 socket for 5G connectivity. Plus, one front-access SIM slot with cover (through M.2 Key B) and one internal SIM slot for PCIe Mini Card slot are available.

To achieve higher graphics performance, customers can install the MXM GPU onto the eBOX671B within the existing system footprint without increasing the system size, saving time, effort, and money. To optimise system performance and speed up deployment, the rugged eBOX671B can easily enhance its overall efficiency and effectiveness through an optional fan kit and a flexible I/O window supported by mPCIe modules. It is also equipped to facilitate high-speed NVMe storage, leading to a decrease in latency,” said Jason Kao, product manager of AIoT Division at Axiomtek. “Axiomtek’s eBOX671B continues the system design of the series so customers can easily upgrade. In addition, the eBOX671B utilises the Trusted Platform Module 2.0 (TPM 2.0) function onboard to ensure data and network security.”

The edge computing system is equipped with rich I/O interfaces, including two RS-232, two RS-232/422/485 with autoflow, four USB 3.2 Gen2 ports, two USB 3.2 Gen1 ports, three 2.5GbE LAN ports, and one GbE LAN port. Other interfaces include one remote power switch, one grounding screw, and five antenna openings. Besides, this powerful computing embedded system supports Windows 11 IoT, Windows 10 IoT, and Linux.

https://www.axiomtek.com

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