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u-blox introduces ANNA-B5 a compact, powerful and secure Bluetooth LE module

Thu, Apr 10, 2025

u-blox has announced the launch of the ANNA-B5 Bluetooth LE module. Built on Nordic Semiconductor’s next-generation wireless SoC, the nRF54L15 chipset is an ultra-compact module (6.5 × 6.5 mm) featuring a fully integrated antenna on the module, high security, a powerful MCU as well as distance measurements capabilities.

Designed with a new antenna solution for size-constrained, battery-powered applications, the ANNA-B5 delivers robust performance across industrial automation, smart home/smart building, healthcare, asset tracking and a broad range of other segments. Supporting Bluetooth LE, 802.15.4 with Thread, Zigbee, and Matter, ANNA-B5 ensures seamless connectivity. Qualified against Bluetooth® Core 6.0, the System in Package (SiP) module includes Bluetooth® Channel Sounding, providing more accurate range measurements.

With its next-generation security features, including physical tamper detection, secure boot, secure storage, and a crypto accelerator, it is designed to meet PSA Certified Level 3. This makes it an ideal choice for applications that require advanced security and compliance with the latest regulatory requirements, ensuring long-term viability in the evolving IoT landscape.

The ANNA-B5 module is powered by the Nordic Semiconductor nRF54L15 ultra-low power wireless SoC, featuring an Arm Cortex-M33 MCU running at 128 MHz, 256 kB of RAM, and 1.5 MB of non-volatile memory. Optimised for ultra-low power consumption, it is ideal for applications demanding extended battery life.

The module’s compact size (6.5 × 6.5 × 1.2 mm) with a fully integrated antenna makes it suitable for a wide range of IoT devices. Its compatibility with other u-blox ANNA modules is key to effortless technology migration, such as transitioning to the latest generation of Bluetooth LE modules.

With its professional-grade u-connectXpress software, ANNA-B5 ensures reduced compliance costs, faster time to market, and seamless international deployment.

https://www.u-blox.com

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HSYCO expands smart building integration with new Shelly driver

Wed, Apr 09, 2025

HSYCO has announced the launch of its new Shelly Driver, transforming the way homes and businesses manage energy, lighting, and automation. As the demand for energy-conscious and IoT-driven solutions continues to rise, HSYCO’s Shelly integration provides seamless, future-proof automation for residential, commercial, and industrial applications.

With this latest addition, HSYCO empowers users to instantly connect and control Shelly’s Wi-Fi-enabled smart relays, sensors, and energy meters—maximising efficiency and convenience. Whether it’s reducing energy consumption, enhancing security, or streamlining automation, the Shelly Driver delivers flexibility for both small-scale smart homes and large commercial automation projects.

Key Features
Effortless Connectivity – Instantly integrate Shelly devices with HSYCO’s powerful automation platform.
Real-Time Monitoring & Control – Easily manage and track Shelly smart relays, plugs, and sensors via HSYCO’s fully customisable, web-based graphical interface.
Scalable & Flexible – Suitable for both small-scale smart homes and large commercial automation projects, tailored to meet unique user needs.
Enhanced User Experience – A streamlined interface for intuitive control and seamless automation.
Smarter Energy Management – Gain real-time valuable insights to reduce energy consumption and improve sustainability.
Free iOS and Android App and wearable support
Why Choose HSYCO’s Shelly Driver?
Plug & Play – Simple setup for quick deployment.
Interoperability – Connect Shelly devices with 100+ protocols already supported by HSYCO.
Custom Automation – Build tailored automation scenarios to meet unique needs.
Secure & Reliable – Ensure safe and stable operation in any environment.

About HSYCO
HSYCO is a versatile supervision platform that supports over 100 protocols and is continually evolving to integrate emerging technologies. It simplifies the creation of secure, scalable solutions for industrial and building automation. With a graphical interface, HSYCO streamlines control, enhances user experience, and minimises operator training. Integration and interoperability optimise efficiency, reducing duplicative activities and costs in field systems. The platform ensures safety by combining functionalities and automating responses to alarms. HSYCO provides a secure umbrella for diverse systems, correcting unexpected behaviours and preventing unauthorised activities for enhanced security. Customisable and open for developers, HSYCO offers a powerful API based on Java and JavaScript languages. It caters to complex installations while remaining easy to maintain.

https://hsyco.com/

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Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

Tue, Apr 08, 2025

Adlink has announced the launch of its COM-HPC-mMTL — an innovative module that stands as the only small form factor solution available with Intel Core Ultra architecture and rich I/O capabilities. This makes it the perfect fit for edge applications that demand both superior processing power and versatile connectivity.

Powered by the Intel Core Ultra architecture with up to 14 CPU cores, 8 Xe GPU cores, and an integrated NPU for high-performance AI acceleration, combining ultra-power with energy efficiency. It is for high-performance battery-powered applications, such as industrial automation, data loggers, UAVs (Unmanned Aerial Vehicles), portable medical ultrasound devices, and AI-powered robots.

The COM-HPC-mMTL is designed with up to 64GB LPDDR5x memory soldered directly onto the board at speeds of 7467MT/s, supporting maximum performance and efficiency. Its 95mm x70mm size allows it to fit into even the most constrained spaces, with a rugged operating temperature range from -40°C to 85°C (for selected SKUs).

In spite of its compact form factor, the COM-HPC-mMTL integrates 16x PCIe lanes, 2 SATA interfaces, 2x 2.5GbE Ethernet ports, and DDI/USB4, USB 3.0/2.0 interfaces, providing rich I/O options for demanding applications.

The COM-HPC-mMTL ensures that high-performance embedded solutions are now possible even in tight spaces, offering the right balance of power, size, scalability, and a stackable design that maximises space efficiency without compromising functionality for next-generation edge applications. Adlink offers the COM-HPC-mMTL development kit for efficient prototyping and referencing, available in the 2nd half of 2025.

https://www.adlinktech.com

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ST releases microprocessors featured for performance and economy

Mon, Apr 07, 2025

STMicroelectronics has announced mass-market availability of new STM32MP23 general-purpose microprocessors (MPUs), combining high-temperature operation up to 125°C with the speed and efficiency of dual Arm Cortex-A35 cores, for performance and ruggedness in industrial and Internet-of-Things (IoT) edge compute, advanced HMI, and machine-learning applications.

Joining the STM32MP25 series launched in 2024, the new MPUs contain dual 1.5GHz Arm Cortex-A35 cores, a 400MHz Cortex-M33 for real-time applications, and a neural network accelerator with 0.6 TOPS performance. There is also a 3D graphics processor, H.264 decoder, MIPI CSI-2 camera interface with raw data support, dual Gigabit Ethernet ports with time-sensitive networking (TSN), and two CAN-FD interfaces.

Combining diverse processing resources and optimised on-chip features, the STM32MP23 series fulfils numerous sensing, processing, and data-handling roles throughout smart factories, smart cities, and smart homes. With the neural engine, bringing AI and machine-learning capabilities, these MPUs handle intuitive and adaptive HMIs, vision-based interaction, and predictive maintenance. The H.264 decoder supports up to 1080p60 video resolution and the 3D GPU handles high-performance, real-time graphics with support for open-source frameworks including OpenGL, OpenCL, and Vulkan.

The STM32MP23 series targets SESIP3 (already achieved for STM32MP25 MPUs) and PSA Level 1 certifications. Protection features include secure boot, Arm TrustZone architecture, secure key storage, and tamper detection, with hardware cryptographic accelerators.

Coinciding with the STM32MP23 release, ST is also extending support for each release of the OpenSTLinux distribution from two years to five years. The enhanced support ensures stability for customers throughout development and extends access to the latest security patches easing compliance with the EU Cyber Resilience Act (CRA). ST’s commitment to mainlining OpenSTLinux lets developers work comfortably with popular frameworks including Yocto, Buildroot, OpenWRT, and OpenSTDroid, and helps accelerate time to market.

Additional benefits for developers include three BGA package options that offer the choice of high-density 0.5mm interconnect pitch or 0.8mm pitch that allows simplified 4-layer PCBs with plated-through holes. The three packages are all pin-to-pin compatible with STM32MP25 MPUs. The devices operate over the industrial temperature range, from -40°C to 125°C maximum junction temperature.

https://www.st.com

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u-blox introduces ANNA-B5 a compact, powerful and secure Bluetooth LE module

HSYCO expands smart building integration with new Shelly driver

Adlink launches Intel Core Ultra COM-HPC Mini with powerful computing performance

ST releases microprocessors featured for performance and economy

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