Melexis’ robotics e-Guide on mastering the integration of sensing solutions

Melexis has launched a new e-Guide, “Engineering the Future of Robotics: Mastering the Integration of Enhanced Sensory Capabilities”, exploring the robotics landscape as well as Melexis’ latest technologies. The document examines how Melexis’s sensor solutions enable engineers to satisfy the industry demand by addressing integration and cost challenges while optimising designs for performance and scalability.

This engaging e-Guide, available on the Melexis website, details key innovations in robotic perception technologies such as 3D tactile sensing as well as internal sensing systems such as high-precision magnetic encoders, inductive, current, and temperature sensors.

In this piece, Melexis analyses the challenges that modern robotics face — from the complexity of integrating high-performance sensing systems into unpredictable environments to the pressures of reducing development time and overall costs. The guide then explores how traditional sensor systems often fall short when addressing the intricate requirements of tactile, positional, and torque feedback in robotic applications, especially in high-volume production.

Engineers will discover how Melexis’ sensor technologies – including Tactaxis and Arcminaxis – not only deliver robust performance but are also specifically designed to ease the transition from prototype to mass production. For instance, Tactaxis offers precise three-dimensional force measurement that emulates human touch, thereby enabling robots to interact safely and naturally with their environment. This is particularly valuable in collaborative and service robotics, where subtle tactile feedback is critical.

The e-Guide further explores the technical drivers behind Arcminaxis – Melexis’ high-resolution magnetic angular sensing solution that simplifies the mechanical complexities of encoder integration without compromising precision. Also discussed are other robotic-specific solutions such Magnetic, inductive, temperature and current sensors.

Beyond technical discovery, the guide dives into wider market trends and the future of robotics, providing engineers with practical, real-world examples and applications.

https://www.melexis.com

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Microchip introduces MCU family to simplify analog sensor design

Microchip has released the PIC16F17576 microcontroller (MCU) product family with integrated low-power peripherals and the ability to precisely measure volatile analog signals.

PIC16F17576 MCUs feature a new low-power comparator and voltage reference combination that can operate while the MCU core is in sleep mode, allowing for continuous analog measurement while consuming less than 3.0 µA of current. The Analog Peripheral Manager (APM) controls which peripherals are active to minimise total energy consumption and enable battery-operated applications to monitor signals effectively without excessive power drain.

Engineered for applications that measure volatile analog signals, PIC16F17576 MCUs include operational amplifiers (op amps) with software-controlled gain ladders. This feature enables a single op amp to switch between multiple gain options, helping mitigate noise while maintaining precision and power efficiency. Equipped with up to four op amps and a 12-bit differential ADC with automated averaging, the MCUs enable precise signal measurement over a wide range of inputs.

“Sensor systems can quickly become complex, often requiring multiple analog components that add board size, cost and power draw,” said Greg Robinson, corporate vice president of Microchip’s MCU business unit. “With the integrated analog features in our low-power PIC16F17576 MCUs, we’re cutting that complexity. You can eliminate parts and reduce power consumption, cutting costs and simplifying the overall design process.”

PIC16F17576 MCUs are well suited for measuring analog signals in a number of industries, including environmental and industrial monitoring, smart home and building automation. Key applications include vibration and strain measurement, flow metering, gas detection, cold asset tracking and motion sensing.

Development Tools
PIC16F17576 MCUs are supported by MPLAB X Integrated Development Environment (IDE) and MPLAB Code Configurator which allows designers to easily manage the functionality of the APM and analog peripherals. The devices are compatible with Microchip’s Curiosity Nano EV14L29A development board and MPLAB PICkit development tools.

https://www.microchip.com

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Mouser explores smart tech in farming with agriculture resource hub

Mouser offers insights into the latest innovations in farming through its agriculture resource centre. Through the integration of sensors, drones, and AI, farmers have the capability to collect and analyse vast amounts of data. Technological advancements, like satellites, have enabled farmers to track changes in land use, such as crop growth and vegetation health, which helps feed the growing global population while maintaining sustainable practices. By gaining insights into the field, like pH and CO2 levels in the moisture content, they can better understand their soil quality, leading to enhanced crop yields.

IoT devices are added to optimise agricultural practices like RFID tagging livestock to track their movements and analyse the herd’s feeding behaviours, stress levels, and potential health issues. This new level of data analytics ensures that livestock and plants are receiving proper nourishment in various climates, as well as in greenhouse and indoor agriculture. Connected devices allow engineers to take environmental control and adjust growing conditions through sensors, microcontrollers, and LEDs. Through a range of innovations, traditional farming is evolving into a data-driven and sustainable industry.

The library of resources offers engineers the tools to make informed decisions from irrigation to fertilisation. With eBooks, articles, blogs, and products from Mouser’s technical team and manufacturing partners, readers will gain valuable knowledge on the cutting-edge technology that is transforming agriculture.

https://resources.mouser.com/agriculture/

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Renesas introduces new RA0 series based on the Arm Cortex-M23 processor

The new devices offer extremely low power consumption, extended temperature range, and a wide variety of peripheral functions and safety features.

RA0E2 MCUs are fully compatible with RA0E1 devices, offering pin-expansion while maintaining the same peripherals and ultra-low power. This compatibility lets customers re-use existing software assets. The new devices deliver industry-leading power consumption of only 2.8mA current in active mode, and 0.89 mA in sleep mode. In addition, an integrated High-speed On-Chip Oscillator (HOCO) enables the fastest wake-up time for this class of microcontroller. The fast wake-up enables the RA0 MCUs to stay in Software Standby mode more of the time, where power consumption drops to a minuscule 0.25 µA.

Renesas’ RA0E1 and RA0E2 ultra-low power MCUs deliver an ideal solution for battery-operated consumer electronics devices, small appliances, industrial system control and building automation application.

The RA0E2 devices have a feature set optimised for cost-sensitive applications. They offer a wide operating voltage range of 1.6V to 5.5V so customers don’t need a level shifter/regulator in 5V systems. The RA0 MCUs also integrate timers, serial communications, analog functions, safety functions and security functionality to reduce customer BOM cost. A wide range of packaging options is also available, including a tiny 5mm x 5mm 32-lead QFN.

In addition, the new MCU’s high-precision (±1.0%) HOCO improves baud rate accuracy and enables designers to forego a standalone oscillator. Unlike other HOCOs in the industry, it maintains this precision in environments from -40°C to 125°C. This wide temperature range enables customers to avoid costly and time-consuming “trimming,” even after the reflow process.

Key Features of the RA0E2 Group MCUs
Core: 32MHz Arm Cortex-M23
Memory: Up to 128KB integrated Code Flash memory and 16KB SRAM
Extended Temperature Range: Ta -40°C to 125°C
Timers: Timer array unit (16b x 8 channels), 32-bit interval timer (8b x 4 channels), RTC
Communications Peripherals: 3 UARTs, 2 Async UART, 6 Simplified SPIs, 2 I2C, 6 Simplified I2Cs
Analog Peripherals: 12-bit ADC, temperature sensor, internal reference voltage
Safety: SRAM parity check, invalid memory access detection, frequency detection, A/D test, output level detection, CRC calculator, register write protection
Security: Unique ID, TRNG, AES libraries, Flash read protection
Packages: 32- and 48-lead QFNs, 32-, 48-, and 64-pin LQFP

The new RA0E2 Group MCUs are supported by Renesas’ Flexible Software Package (FSP). The FSP enables faster application development by providing all the infrastructure software needed, including multiple RTOS, BSP, peripheral drivers, middleware, connectivity, networking, and security stacks as well as reference software to build complex AI, motor control and cloud solutions. It allows customers to integrate their own legacy code and choice of RTOS with FSP, thus providing full flexibility in application development. Using the FSP will ease migration of RA0E1 designs to larger RA0E2 devices if customers wish to do so.

https://www.renesas.com/RA0E2

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