Kontron presents compact motherboards with Intel Core series 2 processors

Kontron has announced the availability of a comprehensive BIOS update for all current ATX, µATX and mITX motherboards supporting the 12th, 13th and 14th generation of Intel Core i processors. The update enables full compatibility with the new Intel Core Series 2 processors (codename “Bartlett Lake”) and will be available starting November 2025.

Featuring up to 24 cores (8P + 16E), the new processor family delivers higher performance, particularly for AI-based and real-time applications. All Kontron motherboards belong to a unified product family with a synergetic BIOS, consistent drivers and an extensive toolset for customer-specific configurations (e.g., default settings, thermal management, boot logo). The products are designed and manufactured in Germany and are ideal for connected IoT applications in industrial automation, medical technology, KIOSK, digital signage, POS/POI, video surveillance, and casino gaming.

The compact Mini-ITX motherboards K3833-Q and K3832-Q are based on the Intel Q670E chipset, offering comprehensive features such as vPro Manageability, Stable Image (SIPP) and RAID support. Real-time applications benefit from Time Sensitive Networking (TSN) functionality. Both boards feature dual Intel LAN interfaces with teaming and TSN support, a PCIe x16 Gen5 expansion slot, USB 3.2 Gen2 interfaces, M.2 Key-M and Key-E slots, and two SO-DIMM sockets for high-performance DDR5 memory.

The Mini-ITX motherboard K3836-Q/R is based on the Intel Q670 and R680E chipsets for ECC-based applications, offering additional USB, COM and SATA interfaces as well as dual power supply options (standard ATX power supply or single 12 V input).

The ATX motherboard K3851-R, based on the Intel R680E chipset, is designed for applications requiring extensive PCIe expandability (including PCIe 5.0). It features three network interfaces (2× Intel i226 and 1× Intel i219LM GbE vPro controller incl. AMT & teaming), dual M.2 Key-M PCIe/NVMe SSD slots, four COM ports, six PCIe slots, one PCI slot, and eleven USB ports including USB Type-C 3.2 Gen2.

The µATX Motherboards K3841-Q, K3842-Q and K3843-B each include two M.2 slots and an integrated Intel TPM 2.0 for Windows 11 support. All models support Intel Core i3/i5/i7/i9 processors of the 12th and 13th generations with a maximum CPU TDP of 125 W.

The K3841-Q µATX industrial motherboard features three LAN interfaces (one Intel i219LM Gb Ethernet controller with manageability functions and two latest-generation i226LM controllers with 2.5 Gbit Ethernet ports), four COM interfaces, four PCIe ports (including Gen5 and two x1 ports) and eleven USB interfaces (USB 3.2 Gen2 and Type-C). The K3842-Q µATX board, which features an Intel Q670 chipset and up to two LAN interfaces, is ideal for high-quality desktop PCs or semi-industrial applications. Based on the Intel B660 chipset, the K3843-B µATX board offers features such as cTDP, DDR5, four DisplayPorts and four PCIe Gen5 interfaces for high speed and bandwidth.

www.kontron.com

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TDK expands i7A series with high-power, high-current DC-DC buck converters

TDK has announced a significant expansion of the TDK-Lambda i7A series of non-isolated DC-DC buck converters, introducing new high-performance models that can deliver up to 1000 W of output power and support output currents of 60 A and 80 A, providing engineers with a very large increase of up to 82 % over existing models.

Maintaining the compact, 1/16th brick footprint, the new converters feature redundant input and output power pins to support higher current delivery. This enhanced pinout enables scalable power solutions ranging from 400 W to 1000 W, streamlining system design and integration. Despite their increased power, the converters weigh only 85 grams, due to an enhanced baseplate construction—making them suitable for weight-sensitive applications.

With a wide input voltage range of 18 V to 60 V and an adjustable output from 3.3 V to 28 V, the expanded i7A series offers exceptional flexibility to support a broad spectrum of DC input sources and system load voltages. This versatility helps reduce the number of unique part numbers in the bill of materials (BOM), simplifying inventory management. An adjustable output current limit reduces overcurrent and short-circuit levels, lowering device stress during overload conditions such as charging large capacitive loads. This feature also enables parallel operation of multiple i7A modules for redundancy or increased power capacity.

Delivering efficiencies up to 99 %, these converters reduce power loss and reduce energy consumption while enhancing thermal performance, system reliability, and overall power density, making them very well-suited for demanding industrial-grade applications.

The i7A series supports multiple cooling configurations, including open frame, baseplate, and heatsink options. This allows engineers to tailor thermal management to their system requirements, whether using conduction-cooled sealed enclosures, forced-air systems, or natural convection environments.

These new models complement the existing i7A converters, offering engineers a solution for demanding applications in medical, communications, industrial, test and measurement, robotics, drones, and battery-powered equipment. All models are certified to IEC/UL/CSA/EN 62368-1 and carry the CE and UKCA marks for Electrical Safety and RoHS Directives.

www.emea.lambda.tdk.com

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Analog Devices unveils CodeFusion Studio 2.0 to simplify embedded AI development

Analog Devices has launched CodeFusion Studio 2.0, an upgrade to its open source embedded development platform. Designed to simplify and accelerate the development of AI-enabled embedded systems, CodeFusion Studio 2.0 introduces advanced hardware abstraction, AI integration and powerful automation tools to streamline the journey from concept to deployment across ADI’s diverse processors and microcontrollers.

CodeFusion Studio 2.0 now supports complete AI workflows, enabling developers to bring their own models and deploy them efficiently across ADI’s processors and microcontrollers, from low-power edge devices to high-performance DSPs (digital signal processors). The latest platform, based on Microsoft’s Visual Studio Code, features a built-in model compatibility checker, performance profiling tools and optimisation capabilities that are designed to ensure robust deployment and an accelerated time-to-market.

A new Zephyr-based modular framework enables runtime performance profiling for AI/ML workloads, offering layer-by-layer analysis and seamless integration with ADI’s heterogeneous platforms. This encapsulation of toolchains simplifies machine learning deployment and enhances system-level performance insights.

The updated CodeFusion Studio System Planner now supports multi-core applications and expanded device compatibility, while unified configuration tools reduce complexity across ADI’s hardware ecosystem. Developers benefit from integrated debugging capabilities, including Core Dump Analysis and GDB (GNU debugger) support, making troubleshooting faster and more intuitive.

Availability
CodeFusion Studio 2.0 is now available for download. Developers can access the platform, documentation and community support at developer.analog.com

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ST launches three-in-one motion sensor for industrial IoT applications

ST has revealed the ISM6HG256X, a tiny three-in-one motion sensor for data-hungry industrial IoT applications, serving as an additional catalyst for edge AI advancement. This smart IMU sensor uniquely combines simultaneous detection of low-g (±16g) and high-g (±256g) accelerations with a high performance and stable gyroscope within a single compact package, ensuring no critical event—from subtle motion or vibrations to severe shocks—is ever missed.

The ISM6HG256X addresses the growing demand for reliable, high-performance sensors in industrial IoT applications such as asset tracking, worker safety wearables, condition monitoring, robotics, factory automation, and black box event recording. By integrating accelerometer with dual full-scale ranges, it eliminates the need for multiple sensors, simplifying system design and reducing overall complexity. Its embedded edge processing and self-configurability support real-time event detection and context-adaptive sensing, which are essential for long lasting asset tracking sensor nodes, wearable safety devices, continuous industrial equipment monitoring, and automated factory systems.

Edge AI is a crucial driver for ST’s MEMS activity as it boosts performance and efficiency by enabling real-time data processing on the device, reducing latency and energy use. It enhances privacy and security through local data handling, limits reliance on external processing, and provides scalability and flexibility for various applications. Additionally, edge AI supports innovative uses like advanced sensing and IoT integration, aligning with growing demand for smart, connected devices.

The ISM6HG256X contains the unique machine-learning core (MLC) and finite state machine (FSM), together with adaptive self-configuration (ASC) and sensor fusion low power (SFLP). These features bring edge AI directly into the sensor to autonomously classify detected events, ensuring real-time, low-latency performance and ultra-low system power consumption. This embedded technology can reconstruct signal dynamics to provide high-fidelity motion tracking. Thanks to the embedded SFLP algorithm, also 3D orientation tracking is possible with just few µA of current consumption.

ST’s new X-NUCLEO-IKS5A1 industrial expansion board with MEMS Studio design environment and software libraries, X-CUBE-MEMS1, are available to assist developers, helping implement functions including high-g and low-g fusion, sensor fusion, context awareness, asset tracking, and calibration.

www.st.com

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