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Mouser and Vishay examine battery management solutions in new eBook

Fri, May 03, 2024

Mouser Electronics, has released a new eBook in collaboration with Vishay Intertechnology, analysing the considerations and challenges of designing high-performing and reliable battery systems.

The eBook, 8 Industry Experts Discuss Battery Management Solutions, focuses on the battery management system (BMS), which is the electronic control circuit that monitors and regulates the charging and discharging of batteries. The BMS informs the systems of the state of charge (SOC) of the battery, ensures that the conditions are optimal for the battery’s state of health (SOH), and protects the battery from fault conditions that could damage it. The eBook explores proper BMS design and the ways that Vishay helps its customers achieve the best performance and reliability for battery systems. The eBook also includes examples from Vishay’s wide portfolio of discrete semiconductors and passive components to help extend battery life, improve operational safety, and ensure reliable data acquisition for precise battery health monitoring and efficient power management.

The Vishay VOA300 linear optocoupler is ideal for voltage and current monitoring in the BMS of electric and hybrid vehicles (EV/HV). The automotive-qualified device provides a fast response, gain stability, and isolation voltage greatly improved over other standard optocouplers.

The WSBE series Power Metal Strip shunt resistors feature a very low resistance and a high power capability, enabling high current sensing to 1825A. These resistors are made using a proprietary processing technique that reduces the temperature coefficient of resistance (TCR) to < 10 ppm/°C across the entire operating range of -55 °C to 150 °C. The devices also offer many other advantageous attributes that help simplify BMS designs and reduce costs while achieving the highest levels of performance.

Vishay surface-mount PAR transient voltage suppressor (TVS) diodes protect sensitive electronics against voltage transients induced by inductive load switching and lightning on ICs, MOSFET, and signal lines of sensor units for automotive.

Consisting of two resistors integrated into one surface mount molded package, the CDMM thick film chip dividers provide a single-component replacement for multiple discrete resistors used in high voltage up to 1.5KV divider applications. The space-saving AEC-Q200 qualified device is optimised for high-power DC/DC converters and inverters in electric automobiles.

The Vishay / Siliconix SQ automotive power MOSFETs are AEC-Q101 qualified and produced using a special process design that is optimised for use in the automotive industry. These devices are available in a wide range of package options for design flexibility.

To read the new eBook, visit https://manufacturers.mouser.com/vishay-automotive/vishay-8-industry-experts-discuss-battery-management-solutions-2/

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Omnivision unveils two new global shutter sensors for machine vision applications

Wed, May 01, 2024

Omnivision has created a new Machine Vision Unit, which will focus on creating innovative solutions for industrial automation, robotics, logistics barcode scanners and intelligent transportation systems (ITS).

Omnivision’s new GS sensors feature the industry’s smallest 2.2-micron (µm) backside-illuminated (BSI) pixel for high resolution in a compact design. The high-resolution, small-format GS sensors provide the highest shutter efficiency available on the market with the ability to capture high-speed moving objects clearly and accurately at high frame rates. They also feature high sensitivity, low noise and enhanced NIR quantum efficiency (QE) for industry-leading low-light performance.

Compared to the previous-generation 2.5µm frontside-illuminated (FSI) GS sensors, the 2.2µm BSI GS sensors can achieve 1.08x sensitivity with an F2.0 lens and 2.16x sensitivity with an F1.4 lens. The new OG05B1B is a 5-megapixel (MP) resolution CMOS monochrome GS sensor in a 1/2.53-inch optical format (OF). The new OG01H1B is a 1.5MP resolution CMOS monochrome GS sensor in a 1/4.51-inch OF.

Both image sensors feature Omnivision’s Nyxel near-infrared (NIR) technology, which boosts QE to 700-1050nm, enabling the capture of brighter images from farther away; PureCel Plus-S stacked-die architecture for best-in-class image sensor performance; and CSP package technology for the smallest possible dimensions.

Key features of the OG05B1B GS image sensor:
● 2592 x 1944 resolution (5MP)
● Fast frame rate of 60fps
● High shutter efficiency of 106 dB
● Interface: 4-lane MIPI & DVP
● External trigger snapshot mode enabling back-end exposure control for improved accuracy
● Nyxel boosting QE from 700 to 1050nm, 58% QE @850nm

Key features of the OG01H1B GS image sensor:
● 1440 x 1080 resolution (1.5MP)
● Fast frame rate of 120fps
● High shutter efficiency of 106 dB
● Interface: 4-lane MIPI & DVP
● External trigger snapshot mode enabling back-end exposure control for improved accuracy
● Nyxel boosting QE from 700 to 1050nm, 58% QE @850nm

The GS sensors are available for sampling now and will be in mass production this quarter.

https://www.ovt.com

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Panasonic introduces new Amorton indoor solar cell series

Wed, May 01, 2024

Panasonic’s hydrogenated amorphous silicon (a-Si:H) solar cells, known as Amorton, power indoor and outdoor applications like IoT devices, watches, sensor nodes, asset trackers, or remote controls. Amorton can harvest energy reliably and sustainably even in low light and artificial light environments.

Now Panasonic introduces its latest Amorton solar cell series: Named AMG-1401C and AMG-1701C, the new products benefit from a nearly perfect black-reflective surface and much higher efficiency (+20%). These breakthroughs have been made possible thanks to an optimised production process, which significantly increased the active area compared to the previous generation. The result is a 20% increase in efficiency, making the new AMG-series one of the most efficient indoor amorphous solar cells on the market today. The AMG-1401C and AMG-1701C, which are based on glass substrates, are 1.1mm thin, generate approx. 8uW/cm2 at 200lux per active area.

The external dimensions are only slightly larger than the active area, which means the space and material consumption in the final application can be optimized. The AMG-1401C with external dimensions of 41.4mm x 26.1mm generates a maximum of 77.8uW at 200 lux. The cell voltage is 2.2V, which means it can be combined with many power management ICs available in the market.

https://industry.panasonic.eu/

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Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

Tue, Apr 30, 2024

New legislation takes effect in 2024, mandating stricter requirements on cybersecurity on everything from consumer IoT devices to critical infrastructure. Meeting these new security compliance requirements from a product and supply chain perspective can be complex, costly and time-consuming. To provide developers with an embedded security solution that allows them to design applications that comply with these requirements, Microchip has announced the new family of PIC32CK 32-bit microcontrollers (MCUs) with an integrated Hardware Security Module (HSM) subsystem and Arm Cortex-M33 core featuring TrustZone technology to help isolate and secure the device.

The PIC32CK SG is the first 32-bit device on the market that combines the strong security of an HSM with TrustZone technology, a hardware-based secure privilege environment. Microchip’s latest innovation for mid-range MCUs provides designers with a cost-effective embedded security solution for their products that meets the latest cybersecurity mandates. The inclusion of an HSM provides a high level of security for authentication, secure debug, secure boot and secure updates, while TrustZone technology provides an additional level of protection for key software functions. The HSM can accelerate a wide range of symmetric and asymmetric cryptography standards, true random number generation and secure key management.

The PIC32CK MCUs from Microchip are designed to support ISO 26262 functional safety and ISO/SAE 21434 cybersecurity standards. For increased flexibility and cost efficiency, the PIC32CK MCU family offers a wide range of options to tune the level of security, memory and connectivity bandwidth based on the end application’s requirements. Options include up to 2 MB dual-panel Flash and 512 KB SRAM, with various connectivity options like 10/100 Ethernet, CAN FD and USB.

For product supply chains that require additional security and safety protection such as in industrial designs, medical devices, home appliances and consumer IoT devices, the PIC32CK will be supported with Microchip’s Trust Platform Design Suite for provisioning as a service. This platform enables the secure factory provisioning of keys, certificates and IP without the need to reveal these secrets within the supply chain.

The 32-bit PIC32CK MCU family is supported by Microchip’s software platforms including MPLAB® Harmony v3 and Trust Platform Design Suite. The PIC32CK family is also supported by the PIC32CK SG and PIC32CK GC Curiosity Ultra Development Boards including the EV33A17A and EV44P93A.

https://www.microchip.com.

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Mouser and Vishay examine battery management solutions in new eBook

Omnivision unveils two new global shutter sensors for machine vision applications

Panasonic introduces new Amorton indoor solar cell series

Embedded security using Microchip’s PIC32CK 32-bit MCUs with hardware security module

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