New inertial GNSS smart antenna from Septentrio

Septentrio has announced AntaRx-Si3. This is the first GNSS/INS (Inertial Navigation System) Smart Antenna on the market in an ultra-rugged enclosure, designed for easy installation on machines such as agriculture robots. AntaRx-Si3 is the new member of the family of receivers leveraging FUSE+, which is designed to answer the need for position availability in tough industrial environments where GNSS signal reception may be temporarily compromised, such as under foliage. The IMU sensor in FUSE+ also improves positioning integrity and reliability, which is critical for autonomous systems.

“With AntaRx-Si3 you get a receiver delivering positioning information with a high level of availability and integrity, that you can install with minimal effort. This is especially beneficial for after-market upgrades. It also allows removal of this component at the end of the day to protect against theft or vandalism,” commented Danilo Sabbatini, Product Manager of GNSS/INS at Septentrio.

It is designed to be mounted outside on a machine for operation in harsh environments out in the field. Enclosed in an impact resistant polycarbonate IP69K housing it can handle high levels of shocks and vibrations. This multi-frequency receiver delivers Septentrio’s field proven RTK positioning down to the centimetre level. AntaRx-Si3 has a built-in 4G cell modem, so there is no need for additional modem integration to acquire high-accuracy corrections.

AntaRx-Si3 leverages Septentrio’s GNSS+ algorithms with advanced multipath mitigation, which allows uninterrupted operation in environments where satellite signals could be reflected off nearby machinery or high structures such as silos. It delivers positioning at a high update rate and low latency, which are critical for control loops in autonomous movement or rotation.

https://www.septentrio.com/

> Read More

Infineon and VMAX intensify collaboration for energy-efficient and cost-effective fast charging of electric vehicles

VMAX, a leading Chinese manufacturer of power electronics and motor drives for new energy vehicles, has selected the new CoolSiC hybrid discrete with TRENCHSTOP 5 Fast-Switching IGBT and CoolSiC Schottky Diode from Infineon for its next generation 6.6 kW OBC/DCDC on-board chargers. Infineon’s components come in a D²PAK package and combine ultra-fast TRENCHSTOP 5 IGBTs with half-rated free-wheeling SiC Schottky barrier diodes to achieve a perfect cost-performance ratio for both hard and soft switching topologies.

“We are proud to choose Infineon’s CoolSiC Hybrid device in our next-generation OBC, achieving higher reliability, stability, improved performance, and power density. This deepens our already strong partnership with Infineon and drives technological application innovation through close collaboration, working together to promote the thriving development of new energy vehicles,” said Jinzhu Xu, PL Director& Chief Engineer, R&D Department at VMAX.

“We are excited to strengthen our partnership with VMAX with our highly efficient hybrid products,” said Robert Hermann, Vice President for Automotive High Voltage Chips and Discrete’s at Infineon. “Together, we will continue to drive e-mobility advancements, providing efficient solutions that meet the requirements of the industry in terms of performance, quality and system cost.”

With its fast, hard switching TRENCHSTOP 5 650 V IGBT co-packed with zero reverse recovery CoolSiC Schottky diode, the hybrid discrete benefits from very low switching losses at switching speeds above 50 kHz. This makes the device an excellent option for high-power electric vehicle charging systems. In addition, the robust 5 th generation CoolSiC Schottky diode offers increased robustness against surge currents, maximising reliability. Furthermore, the diffusion soldering of the SiC diode has improved the thermal resistance (R th) to the package for small chip sizes, resulting in increased power switching capability. With these features, it enables optimum system reliability and longevity, meeting the stringent requirements of the automotive industry. To further maximise compatibility with existing designs, the product also features a pin-to-pin compatible design based on the widely used D²PAK package.

https://www.infineon.com

> Read More

Cadence unveils Millennium Platform the industry’s first accelerated digital twin  

Cadence has announced the Cadence Millennium Enterprise Multi-physics Platform, the industry’s first hardware/software (HW/SW) accelerated digital twin solution for multiphysics system design and analysis. Targeted at one of the biggest opportunities for greater performance and efficiency, the first-generation Cadence Millennium M1 accelerates high-fidelity computational fluid dynamics (CFD) simulations. Available in the cloud or on premises, this turnkey solution includes graphics processing units (GPUs) from leading providers, extremely fast interconnections and an enhanced Cadence high-fidelity CFD software stack optimised for GPU acceleration and generative AI. Millennium M1 instances can be fused into a unified cluster, enabling customers to achieve an unprecedented same-day turnaround time and near-linear scalability when simulating complex mechanical systems.

Designing mechanical systems for new levels of performance and efficiency has become a key priority in the automotive, aerospace and defence (A&D), energy and turbo-machinery industries. To optimise performance and reduce greenhouse gases, automotive designers are focused on improving fuel efficiency, reducing drag and noise, and extending electric vehicle range. Increasing efficiency, reducing carbon emissions and reducing maintenance frequency are top of mind for A&D and turbo-machinery design engineers. Advances in multi-physics simulation technology are critical to achieving these goals. Performance, accuracy, capacity and accelerated computing are all essential to enabling digital twin simulations that explore more design innovations, providing confidence that they will function as intended before undertaking prototype development and testing.

The Millennium Platform addresses these needs. Highlights and benefits include:
* Performance: Combines best-in-class GPU-resident CFD solvers with dedicated GPU hardware to provide supercomputer-equivalent throughput per GPU of up to 1000 CPU cores
* Efficiency: Reduces turnaround time from weeks to hours with 20X better energy efficiency compared to its CPU equivalent
* Accuracy: Leverages Cadence Fidelity CFD solvers to provide unmatched accuracy to address complex simulation challenges
* High-Performance Computing: Built with an extensible architecture and massively scalable Fidelity solvers to provide near-linear scalability on multiple GPU nodes
* AI Digital Twin: Rapid generation of high-quality multi-physics data enables generative AI to create fast and reliable digital twin visualisations of the optimal system design solution
* Turnkey Solution: The industry’s first solution that couples GPU compute with modern and scalable CFD solvers, providing an optimised environment for accelerated CFD and multidisciplinary design and optimisation
* Flexibility: Available with GPUs from leading vendors, in the cloud with minimum 8 GPU configurations, or on premises with a minimum 32 GPU configuration—providing a flexible and scalable solution to fit each customer’s deployment needs

“Throughout our 35-year history, Cadence has been focused on increasing performance with no loss of accuracy for the most challenging computational applications. Algorithmic throughput remains a key priority, and we’re now leveraging generative AI to harvest knowledge gained from massive quantities of design and simulation data,” said Ben Gu, corporate vice president of R&D for multi-physics systems analysis at Cadence. “Our revolutionary Millennium platform is a giant leap forward, delivering unprecedented acceleration and scalability of digital twin and AI applications. CFD is poised to benefit greatly from performance and efficiency gains, and the tremendous power of the Millennium M1 is disrupting industries that must explore more design innovations and bring them to market faster.”

https://www.cadence.com

> Read More

NeoMesh click boards speed development of ultra-low power, massively scalable IoT and Cloud-based sensor networks

Mikro Elektronika today announced three new NeoMesh Click boards that are ideal for wireless mesh networking. The Click boards eliminate the need for engineers to create any development PCB hardware themselves, enabling them to initiate Proof-of-Concept testing of the NeoMesh network protocol stack in a real application quickly and at minimal cost.

The Click Boards feature NeoCortec’s compact, low-power NC1000 and NC2400 network modules which address a broad range of applications based on IoT and Cloud-based sensor networks, including smart building and smart workplace, metering, security, agriculture, transportation, industry 4.0, medical and food distribution. Three versions of NeoMesh Click are available, one for each of the communication modules which operate at 868MHz, 915MHz and 2.4 GHz. Average power consumption is as low as 20uA.

Explains Thomas Steen Halkier, CEO of NeoCortec: “The NeoMesh protocol is a natural choice when building battery-powered, highly scalable and reliable wireless sensor networks. Now, developers have access to a large selection of MCU, sensor and other boards which can simply ‘Click’ together to form a prototype device.”

Click boards follow mikroBUS a modular prototyping add-on board standard invented by MIKROE, enabling design engineers to change peripherals easily, cutting months off development time. Any Click board can be connected to the microcontroller or microprocessor on a main board. Many leading microcontroller companies including Microchip, NXP, Infineon, Dialog, STM, Analog Devices, Renesas and Toshiba now include the mikroBUS socket on their development boards.

https://www.neocortec.com

 

 

 

 

> Read More

About Smart Cities

This news story is brought to you by smartcitieselectronics.com, the specialist site dedicated to delivering information about what’s new in the Smart City Electronics industry, with daily news updates, new products and industry news. To stay up-to-date, register to receive our weekly newsletters and keep yourself informed on the latest technology news and new products from around the globe. Simply click this link to register here: Smart Cities Registration