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Integrated connected car module is scalable

Mon, May 14, 2018

Targeted at the global automotive industry, the Laird Modular Automotive Connectivity (MAX) module is believed to be the first fully integrated connected car platform.

The integrated and scalable module is for secure mobile connectivity and automotive Ethernet for reliable internet use inside and outside the vehicle.

Laird MAX has been introduced worldwide and brings together communications technologies, an open software concept, a Linux-based security module, and Laird’s integrated antenna system.

MAX enables a range of services for safety and comfort, explains Laird, from driver-assisted navigation, advanced diagnostics for maintenance, theft protection and over-the-air software updates that can be scaled to meet the needs of automakers and their customers.

Worldwide sales of connected cars are expected to reach 72.5 million in the next five years, according to industry analyst IHS Markit, with almost 70 per cent of all passenger vehicles sold around the globe will be exchanging data with external sources, bringing new services and new business models to bear in automotive markets by 2023.

The modularisation of MAX enables automakers to have a short time-to-market compared to tailor-made solutions, says Laird. It can be integrated into a Laird system solution, including control unit and antenna, and used for external service providers as the basis for a back-end connection or for app development.

Its scalability means it can cater for customers who only need networking for small batches.

Applications that can be implemented on MAX include internet gateway functionality, a remote diagnostic tool, a remote-control system, location functions, and driver statistics. It can be used to set up a wide range of services for OEMs, fleet operators and insurance companies.

MAX enables a connected vehicle to continuously and securely stream and share data with multiple wireless devices and applications inside and outside the vehicle’s immediate environment. It can serve as a communication basis for networked and autonomous vehicles in smart cities, as well as with trucks, fork-lifts or machines in networked logistics or for smart farming.

The use of custom features limits the number of components and their weight, to make MAX is environmentally-friendly, says Laird. By optimizing the energy management, the power consumption is reduced, which is a differentiation advantage especially for electric vehicles.

http://www.laird.com

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Software improves operation efficiency for distributed systems management

Fri, May 11, 2018

Designed to improve operational efficiency and decrease maintenance costs through a centralised interface for automating tasks, SystemLink application software is for distributed systems management.

NI has introduced the software in response to trends like the industrial IoT, 5G and the electrification of vehicles, coupled with maintaining distributed legacy systems. NI believes the drive towards connected and centrally co-ordinated systems has transformed theories and pilot projects into large-scale, distributed deployments. Companies derive returns from the actionable, data-driven insights that help them maximise uptime, increase efficiency and drive future product innovation. At the same time, companies need to balance their adoption of new, connected technologies while preserving support for valuable legacy assets with long life cycles.

Systems that manage, maintain and extract insight from small-scale pilots or groups of systems are relatively straightforward to implement, explains NI. The next challenge is to scale and manage large deployments, varying life cycle stages and distributed testers and nodes across entire plants, fabs and factories. This includes tasks like remote software and system configuration as well as data management and performance monitoring in industries from aerospace and defence to transportation and manufacturing.

SystemLink enables engineers to connect, deploy, and manage distributed systems, both NI and third-party, through a centralised interface accessible from anywhere. As a result it is possible to remotely configure and deploy software, monitor the health and performance of their equipment, manage alarms, and visualise application parameters. Additionally, engineers can automate the communication of data to

To meet demands like testing higher complexity devices under test and shorter timeframes, engineers need tools tailored to their needs. SystemLink is the latest addition to NI’s software-centric platform. It has LabVIEW engineering system design software at its core and TestStand test management software for overall execution. The workflow helps to improve the productivity of test and validation labs, says NI. Each piece of the workflow is also interoperable with third-party software to maximise code/IP reuse and draws on the LabVIEW Tools Network ecosystem of add-ons and tools for more application-specific requirements.

http://www.ni.com/systemlink

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Premier Farnell signs global franchise with SiTime

Fri, May 11, 2018

Farnell element14 customers now have access to the latest silicon MEMS based timing from SiTime, following a franchise agreement between the two parties.

It will give access to SiTime’s MEMS-based silicon timing solutions, which offer short lead-times, high performance, low power, small size and high reliability.

Over one billion SiTime silicon timing devices are being used today in applications from smartphones, tablets and cameras to air transportation and earthquake detection systems. Devices such as mobile phones, fitness trackers and tablets rely on the small size and low power consumption of SiTime products. Mission-critical electronics such as space rockets, self-driving vehicles and earthquake detection systems rely on the reliability and precision of the company’s solutions.

Jeff Uden, global category director, IP&E for Premier Farnell and Farnell element14 said: “As the Development Distributor we aim to provide our customers with the very best devices for them to develop their products. SiTime is driving real innovation in this market, providing chip-scale packages for timing solutions. SiTime products are a great match for Farnell element14 customers looking for increased flexibility and reliable timing solutions in a tiny package.”

Mark Lunsford, executive vice president, worldwide sales, from SiTime added: “SiTime is redefining timing technology and is uniquely focused on solving the most difficult timing problems for the electronics industry. We take pride in the reliability, robustness, and accuracy of our timing devices, especially in harsh conditions. . . customers are using our timing products in 5G infrastructure, self-driving cars, the internet of things, and artificial intelligence systems. Our MEMS timing devices are up to 20 times more reliable, 30 times more resistant to shock and vibration and offer 50 times better quality. We are delighted to add Premier Farnell to our distributor network, as we continue to drive the electronics market to silicon-based timing.”

Farnell element14 will be stocking over 200 oscillators from SiTime. They include SiT15XX µPower oscillators, housed in what is claimed to be the industry’s smallest chip-scale package (CSP). The high stability of these low-frequency devices enable longer sleep modes, ideal for mobile, wearable, and IoT products.

There is also the Elite platform SiT938X oscillators delivering dynamic performance in of the presence common environmental hazards such as shock, vibration, power supply noise, and EMI. SiT938X oscillators are engineered for ASIL (Automotive Safety Integrity Level) -compliant automotive applications such as advanced driver assistance systems (ADAS) and in-vehicle 10/40/100G Ethernet.

SiTime products are available from Farnell element14 in Europe, Newark element14 in North America and element14 in APAC.

http://www.farnell.com

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Infineon launches new Development Centre for automotive electronics and AI in Dresden

Fri, May 11, 2018

Infineon is setting up a new Development Centre at its Dresden location. The company is planning to create around 100 additional new jobs in the first phase. The new Development Centre is expected to employ a total of around 250 people in the medium term. One focus of it will be to develop new products and solutions for automotive and power electronics, as well as artificial intelligence. It is scheduled to be launched in the course of the 2018 calendar year.

In Dresden, the Infineon Group already has one of its largest and most cutting-edge locations for developing wafer technologies and manufacturing processes, as well as a highly automated production plant. 2,200 employees carry out research into and develop technologies for microcontrollers, sensors and power semiconductors and make chips there – including for the automotive industry. System integration is gaining in importance to enable complex interaction between semiconductors in more and more technically sophisticated cars. Modeling complex systems and developing highly integrated products will be one of the new Development Center’s core tasks in addition to chip design.

“Microelectronics is responsible for around 90 percent of all innovations in the car. Semiconductors are a prerequisite for electromobility and autonomous driving, trends that are major growth drivers for Infineon,” says Dr. Reinhard Ploss, Chief Executive Officer of Infineon Technologies AG. “Algorithms, artificial intelligence and the Internet of Things play a key part in the increasing networking of traffic systems. The new Development Center will also address those issues intensively. We will create synergies as a result of the direct links with our development and production location in Dresden. That will help us develop products faster and put them on the market sooner.”

“Over the past years we’ve continuously increased our share of the growing market for automotive electronics,” says Peter Schiefer, Division President Automotive at Infineon. “We’re one of the technology leaders in the field of electromobility and autonomous driving. We’ll expand our leading position further thanks to the new Development Center in Dresden.”

“The State Government of Saxony offers us ideal conditions to do business in Dresden,” says Mathias Kamolz, Managing Director of Infineon Technologies Dresden GmbH. “We can also leverage a broad network of suppliers, universities, research establishments and public institutions in Saxony. The new Development Center will help Infineon enhance its development expertise in Dresden and deepen its successful collaboration with local partners.”

Automotive is Infineon’s largest business area: Semiconductors for the automotive industry generate 42 percent of the Group’s revenue. Infineon expects that the trend toward electrically driven, connected and increasingly autonomous cars will help boost its growth significantly in the coming years.

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Integrated connected car module is scalable

Software improves operation efficiency for distributed systems management

Premier Farnell signs global franchise with SiTime

Infineon launches new Development Centre for automotive electronics and AI in Dresden

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