NB-IoT shield enhances ARIS-Edge platform

An NarrowBand IoT shield by Shiratech has been added to the ARIS (Arrow Renesas IoT Synergy) platform, available from the distributor Arrow Electronics. The ARIS-Edge-NB-IoT shield features a Quectel BG96 module and plugs onto the ARIS-Edge-S3 board, which is based on the low-power Renesas Synergy S3A3 microcontroller. These two boards combined, enable users to evaluate streaming of sensor data to Microsoft’s Azure cloud via a cellular connection (2G/3G, NB-IoT or CAT-M1 depending on network availability), easily and fast.

The shield has an Arduino form factor and the low-power Quectel BG96 LTE CAT-M1 and NB-IoT modem, together with built-in GPS plus an antenna. Download speed up to 300kbits per second and upload up to 375kbits per second are supported. The ARIS-Edge-S3 board features a radio module with Bluetooth Low Energy (BLE 4.1/4.2), Thread, and ZigBee stacks. The kit is suitable for home automation, smart meters, smart lighting, wearable electronics, medical monitors and industrial sensing. Arrow plans to add a LoRa shield as well.

The ARIS-Edge-S3 features a Bosch Sensortec BNO055 nine-degrees-of-freedom (9-DOF) application specific sensor node (ASSN). This sensor is widely used in robotics, augmented and virtual reality, drones, gaming, and other industrial applications. There is also an on-board BME280 environmental sensor from Bosch Sensortec, which combines temperature, humidity and pressure sensing, a separate MEMS microphone and an ambient light sensor for contextual awareness.

Arrow’s ARIS-Edge concept connects developers with the Renesas Synergy platform giving access to an optimised operating system, qualified stacks, consistent software libraries, and APIs that streamline IoT-device development and lower total cost of ownership.

Arrow Electronics maintains a network of more than 345 locations serving over 80 countries.

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Zynq UltraScale+ family is certified for AI-class devices

Xilinx has received the IEC 61508 specification certificate, issued by Exida, for the Zynq UltraScale+ MPSoC family. The processors has been assessed as SIL 3, HFT1 capable, according the IEC 61508 functional-safety specification. This means product developers can build systems including artificial intelligence (AI) for safety-critical applications using Xilinx’s feature-rich, integrated single-chip MPSoC family, with the assurance of IEC 61508 functional-safety certification up to Safety Integrity Level 3 (SIL 3).

The industry’s first commercial ARM-based SoC, the Zynq-7000 is able to demonstrate compliance to functional safety requirements for on-chip redundancy (HFT=1).  The Zynq-7000 and Zynq UltraScale+ MPSoC families feature isolated function domains on a single die with hardware protection mechanisms, creating the required hardware fault tolerance consistent with on-chip redundancy. Developers can take advantage of the embedded FPGA fabric to accelerate performance beyond conventional software-based systems, explains Xilinx, to achieve the fast response times and low latency typically required of safety-critical systems. Xilinx has also introduced safety-enhanced automotive-qualified XA Zynq UltraScale+ MPSoCs, certified to ISO 26262 ASIL C (pictured).

Combined with the recent IEC 61508 safety certification of the supporting Vivado Design Suite by TÜV Süd and the MicroBlaze compiler for additional soft processors by SGS-TÜV Saar, Xilinx believes it provides a complete ecosystem with supporting documentation, assessment reports and IP, to minimise risks for customers.

Developers can find tools and resources at  Xilinx’s online Functional Safety Lounge. Privileges include access to the Safety Manual for Zynq UltraScale+ MPSoC, device and architecture updates, tool-flows and documentation including future reports and assessments.

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Low power SOTB process technology means no batteries to power IoT devices

Renesas Electronics believes its energy-harvesting embedded controller can eliminate the need to use or replace batteries in IoT devices. The process was developed based on Renesas’ silicon-on-thin-buried-oxide (SOTB) process technology to achieve an “extreme reduction in both active and standby current consumption”. The company says this combination was not previously possible to achieve in conventional microcontrollers. These low current levels of the SOTB-based embedded controller enables system manufacturers to use harvesting ambient energy sources such as light, vibration, and flow and eliminate batteries. The use of extreme low-power and energy harvesting gives rise to a new market of maintenance-free connected IoT sensing devices with endpoint intelligence for applications in industrial, business, residential, agricultural, healthcare, and public infrastructure, as well as health and fitness apparel, shoes, wearables, smart watches, and drones.

Renesas’ first commercial product using SOTB technology, the R7F0E embedded controller, is a 32-bit, Arm Cortex-based embedded controller capable of operating up to 64MHz for rapid local processing of sensor data and execution of complex analysis and control functions. Consuming just 20 microA/MHz active current, and only 150 nanoA deep standby current, approximately 10% of conventional low-power microcontrollers, the R7F0E is suited for extreme low-power and energy harvesting applications.

The R7F0E has a configurable energy harvest controller (EHC) function that increases robustness and minimises costly external components. The EHC enables direct connection to many different types of ambient energy sources, such as solar, vibration, or piezoelectric, while protecting against harmful inrush current at start-up. The EHC also manages the charging of external power storage devices, such as supercapacitors or optional rechargeable batteries.

Other system characteristics for extreme low power are the ability to sense and capture external analogue signals at all times because the 14-bit ADC consumes only three microA. There is also the ability to retain up to 256kbyte of SRAM data content while consuming just one nanoA per kbyte SRAM. It can also provide graphics data conversion including rotation, scroll, and colorisation with low-power hardware techniques for driving an external display using memory-in-pixel (MIP) LCD technology that consumes virtually no power to retain an image.

Yoshikazu Yokota, executive vice president and general manager of Industrial Solution Business Unit of Renesas said: “By removing the need for batteries, or the need to replace batteries, new markets will open for us and our customers. Energy harvesting will become a mandatory technology for a smart society . . . Renesas continues to push forward with e-AI to realize AI at the endpoint, in embedded devices. Looking forward, our SOTB technology will expand our reach into use cases where combining e-AI and energy harvesting will make a very large positive impact to our day-to-day lives”.   

Samples of the R7F0E embedded controller are available now for beta customers, and samples are scheduled to be available for general customers from July 2019. Mass production is scheduled to start from October 2019.

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Six-axis inertial module combine robustness for industrial applications

Adding to STMicroelectronics’ family of low power MEMS sensors for industrial applications, the ISM330DLC six-axis inertial measurement unit (IMU) is said to combine high accuracy and robustness with long-term availability assured by ST’s 10-year longevity programme.

The ISM330DLC contains a three-axis accelerometer and a three-axis gyroscope with user-selectable full-scale up to ±16g and ±2000dps respectively. It provides high measurement resolution and energy-saving features for long-lasting battery-powered industrial devices. Target applications include industrial IoT systems, robots, drones, platform stabilisers, and telematics. The wide accelerometer bandwidth up to 3kHz also allows its use in vibration-monitoring and compensation systems.

The ISM330DLC consumes just 0.5mA in normal combination mode and 0.75mA in high-performance mode. A large integrated FIFO that lets the host system retrieve data efficiently, and saves energy with tilt detection, free-fall, wakeup, 6D/4D orientation, click, and double-click features. There is also a sensor-hub feature for collecting data from additional external sensors.

Integrated industrial-grade design features include a dedicated configurable low-latency signal-processing path, low noise, and filtering optimised to ensure closed-loop control stability. The signal path can be independently configured to make gyroscope or accelerometer data available through an auxiliary SPI.

The ISM330DLC also contains a temperature sensor and built-in self-test both for the gyroscope and accelerometer.

The ISM330DLC is in production now, as a 2.5 x 3.0 x 0.83mm plastic land-grid array (LGA) system-in-package.

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