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Software provides open source API to run on embedded computing platforms

Mon, Feb 25, 2019

An updated version of Xsens’ MT software suite provides enhanced support for the NMEA interface for marine electronics, which is claimed to make calibration easier for end users, and improve the developer graphical user (GUI) interface, says the company.

The open source applications programming interface (API) enables users to develop applications to run on many embedded computing platforms. The software suite is an upgraded version of the existing software package for Xsens’ MTi-series of industrial motion trackers. An updated GUI for the MT Software development kit has improved signposting of functions.

The open source API is called XDA (Xsens Device API) and is intended for use on any computing platform that runs a Windows or Linux operating system. While many developers will continue to create applications to run on a PC or laptop, increasing numbers are developing prototypes and finished products on third party embedded computing platforms such as Raspberry Pi or Beagleboard.

The XDA in MT software suite 2019 gives developers access to the code for the first time to enable them to compile it for these platforms, for other third-party boards, or for proprietary embedded computing platforms. They can also modify or extend the XDA to support the particular requirements of their development project.

The XDA is also claimed to greatly facilitate debugging and application problem-solving, as users can now see in detail the message flow between an MTi-series module and the host application.

Users can now choose from hundreds of commercial hardware development platforms that support the Windows or Linux environments, says the company. There are also enhancements to the user experience and extended message support for working with Xsens motion tracking modules.

Enhancements to the MT software suite 2019 release include extended National Marine Electronics Association (NMEA) message support, helping developers integrate an MTi module more easily with third-party equipment. There is also a uniform set of application examples across all supported programming languages, for greater consistency of user experience and an upgraded magnetic field mapping function which makes it easier for the end user to perform a calibration routine for any MTi-series module.

The MT Software Suite 2019 is now available for download from the Xsens website. It supports all current MTi-series products. Xsens is also providing updated firmware for all MTi modules, compatible with the new MT Software Suite 2019.

https://www.xsens.com

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Collaboration realises onboard data management for ‘data centre on wheels’

Mon, Feb 25, 2019

Solid state drives from Toshiba Memory Europe will be used in OSR’s Evolver onboard data management, or ‘data centre of wheels’ platform.

The two companies have extended their partnership to provide in-car data centre services as OEM customers are requesting ways of logging, analysing and managing the growing amounts of data.

OSR Enterprises created the Evolver automotive platform for connected, autonomous, shared and electric mobility. This announcement extends the companies’ existing collaboration to enhance live data management and logging in cars, in a vehicle’s data centre, with high-density and low-power solid state drives.

Evolver is described as an artificial intelligence (AI) ‘brain’ for smart, autonomous and securely networked vehicles. The hardware and software platform provides the computing power for the car of the future and operates as a central data hub which stores, processes and analyses real-time data for AI and analytical insights. The data and information are crucial for autonomous driving, customised user experiences and is the foundation for new automotive business models, explains OSR.

One of the elements supporting this capability is an advanced high-density in-car storage. The collaboration with Toshiba Memory Europe. The combination of the technologies ensures that the development cycles of OSR’s OEM customers are shortened, while retaining robustness for a solid development process, claims the company.

Toshiba Memory’s flash technology features high performance, low latency and high-density solid-state drives. Toshiba Memory’s CM5 NVM Express™ (NVMe) is built with its latest 64 layer, three-bit-per-cell enterprise-class TLC (triple-level cell) BiCS Flash, making today’s demanding storage environments possible. This, combined with selectable power modes in Toshiba Memory’s solid state drives (SSDs) which improve the thermal performance and heat dissipation of the system. Additionally, optimal operation and data integrity is provided by its power loss protection technology within the storage components.

OSR Enterprises is a Swiss based automotive Tier 1 supplier with R&D centres in Switzerland and Israel.

Toshiba Memory Europe is the European business of Toshiba Memory Corporation.

https://business.toshiba-memory.com

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Development board helps developers connect for Cloud IoT Core

Mon, Feb 25, 2019

To help device manufacturers to develop secure IoT products, Microchip Technology introduces the PIC-IoT WG development board for Cloud IoT Core. PIC microcontrollers are used in a wide variety of products, from coffee makers to thermostats and irrigation systems yet as developers migrate next-generation PIC microcontroller-based applications to the cloud, they have to overcome complexities associated with communications protocols, security and hardware compatibility. To accelerate the development of these applications, Microchip has announced an IoT rapid development board for Google Cloud IoT Core that combines a low-power PIC microcontroller, CryptoAuthentication secure element IC and fully certified Wi-Fi network controller. According to Microchip, this provides a simple way to connect and secure PIC microcontroller-based applications, removing the added time, cost and security vulnerabilities that come with large software frameworks and real time operating systems (RTOS). Once connected, Google Cloud IoT Core provides powerful data and analytics to help designers make better, smarter products, explains Microchip.

Microchip Technology has an extended partnership with Google Cloud, which means that the PIC-IoT WG development board enables PIC microcontroller designers to easily add cloud connectivity to next generation products using a free online portal at www.PIC-IoT.com. Once connected, developers can use Microchip’s MPLAB Code Configurator (MCC) development tool to develop, debug and customise an application. The board combines smart, connected and secure devices to enable designers to create connected applications. It includes the eXtreme low-power PIC microcontroller with integrated core independent peripherals. Suitable for battery-operated, real-time sensing and control applications, the PIC24FJ128GA705 microcontroller employs the PIC architecture with added memory and advanced analogue integration explains Microchip. It is supported by the latest Core Independent Peripherals (CIPs) designed to handle complex applications with less code and decreased power consumption.

There are also secure element to protect the root of trust in hardware. The ATECC608A CryptoAuthentication device provides a trusted and protected identity for each device that can be securely authenticated. It is supplied pre-registered on Google Cloud IoT Core. For Wi-Fi connectivity to Google Cloud, the ATWINC1510 is an industrial-grade, fully certified IEEE 802.11 b/g/n IoT network controller that provides an easy connection to a microcontroller via an SPI, with the designer needing networking protocols expertise.

Google Cloud IoT Core provides a managed service that enables designers to easily and securely connect, manage and ingest data from devices at a global scale. The platform collects, processes and analyses data in real time to enable designers to improve operational efficiency in embedded designs.

The PIC-IoT WG development board is supported by the MPLAB X integrated development environment (IDE) and MCC rapid prototyping tool and is compatible with more than 450 MikroElektronika Click boards to expand sensors and actuator options.

http://www.microchip.com

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Ethernet PHYs optimise network performance

Fri, Feb 22, 2019

Two Ethernet physical layer (PHY) transceivers have been introduced by Texas Instruments. They are designed to offer more connectivity options for designers of both space-constrained applications and time-sensitive networks (TSNs).

The DP83825I low-power 10-/100-Mbits per seocnd Ethernet PHY has a 44 per cent smaller package size than competing devices, claims Texas Instruments and provides a 150m cable reach. The DP83869HM is the industry’s only gigabit Ethernet PHY that supports copper and fibre media, and offers high -temperature operation up to 125 degrees C, which enables engineers to leverage the speed and reliability of Gigabit Ethernet connectivity in harsh environments.

The small package, low power consumption and long cable reach of the DP83825I enable designers to reduce the size and cost of compact IP network camera, lighting, electronic point-of-sale and other space-constrained applications without sacrificing network reach, explains Texas Instruments. The high operating temperature of the DP83869HM, as well as its electrostatic discharge (ESD) immunity and support for media conversion, are claimed to help increase performance and design flexibility in factory automation, motor drive and grid infrastructure equipment designs.

Network reach can be expanded while system size and cost can be reduced, with the DP83825I. This is claimed to be the industry’s smallest Ethernet PHY, in a 3.0 x 3.0mm QFN 24-pin package. It also has a long cable reach and helps designers shrink system designs while increasing the physical span of networks, says Texas Instruments. The device’s extended cable reach eliminates the need for Ethernet repeaters, which further reduces operating costs.

The DP83825I reduces thermal loading and power demands for Ethernet connectivity and enables the allocation of power to other critical components within a system by consuming less than 125mW. The device also includes power-saving features such as energy-efficient Ethernet, wake-on-LAN and media access control isolation.

The DP83869HM is claimed to have the industry’s widest temperature range and high ESD immunity. Operating temperature is -40 to +125 degrees C for Gigabit fibre operation and ESD immunity exceeds the 8kV International Electrotechnical Commission 61000-4-2 standard. The DP83869HM helps improve Ethernet system reliability in high-temperature and static-prone industrial environments such as factory floors.

It supports 1000Base-X and 100Base-FX Ethernet protocols and conversion between copper and fibre Ethernet standards, to extend long-distance networks. There is also TSN support through low latency (less than 390 nano seconds total) for both 1000Base-T and 100Base-TX standards.

Evaluation models for both PHYs are available.

http://www.ti.com

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Software provides open source API to run on embedded computing platforms

Collaboration realises onboard data management for ‘data centre on wheels’

Development board helps developers connect for Cloud IoT Core

Ethernet PHYs optimise network performance

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