u-blox adds Script option to Bluetooth and Wi-Fi connectivity software

For easy and interactive development of embedded applications, u-blox has developed u-connectScript and added it to the u-connectXpress software series.

The extended software series is claimed to further simplify wireless Bluetooth and Wi‑Fi device development, enabling embedded script applications in the module, and reducing complexity and time to market.

The software series manages the wireless connectivity ‘behind the scenes’ and scripting support increases development efficiency and brings the wireless technology to companies that are new to the IoT, says u-blox.

u-connectXpress was introduced more than 15 years ago and lets developers configure device connectivity without having to write and test complex code. u-blox has added to the software series so that it now comprises over 130 standard and u-blox-specific AT commands

u‑connectScript has been added to further speed up embedded device development, says u-blox. It is based on the JavaScript programming language, which has been widely adopted, and which has a short learning curve. u‑connectScript uses simple syntax to allow device developers to quickly embed Bluetooth applications right onto the module without requiring extensive experience in embedded systems programming. Developers write their applications using u-blox’s integrated development environment (IDE) or a text editor of their choice.

u-connectScript efficiently manages data flows between wireless and physical interfaces. This ensures power consumption and performance of the resulting application remains on a par with traditionally developed embedded applications; u-blox argues that this is contrary to other script solutions available in the market.

Security is fundamental and is handled behind the scenes when using any member of the u‑connect software series. Secure Boot ensures that devices only boot up in the presence of original certified software. u‑connect additionally ensures a high level of link and data security with support for Wi‑Fi enterprise security (e.g. EAP-TLS), IP end-to-end security (e.g. TLS) and LE secure connections for Bluetooth.

Applications developed for u-connectXpress or u-connectScript can be re-used across the entire product line and are forward compatible with new product generations.

u-connectXpress is available across the u-blox Short Range product portfolio. u-connectScript will be available on selected product variants, starting with the NINA-B3 module.

https://www.u-blox.com

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Sensors use Bluetooth Low Energy for IoT development

Sensor technology, with what is claimed to be the industry’s lowest power Bluetooth Low Energy radio are combined in the RSL10 sensor development kit from ON Semiconductor.

The sensor development kit brings together the RSL10 system in package (SiP) with a range of advanced low power sensors from Bosch Sensortec to provide nine degrees of freedom (DoF) detection and environmental monitoring, including ambient light, volatile organic compounds (VOC), pressure, relative humidity and temperature. A low noise, digital microphone is also included, along with a user-programmable RGB LED, three programmable push-button switches, and 64kbit EEPROM.

The sensors are Bosch Sensortec’s integrated BME680 environmental sensor which detect a range of gases for air quality applications, its BMM150 geomagnetic sensor and the BHI160 smart sensor for high accuracy motion sensing. The RSL10 sensor kit combines motion and environmental sensing with the low power capabilities of the Bluetooth 5-certified RSL10, targeting both consumer and industrial IoT applications.

Developers can use the RSL10 Sense and Control mobile application to connect to the RSL10 sensor development kit to monitor sensors and to evaluate the kit’s features. The app also supports multiple commercial cloud platforms for uploading sensor data.

The RSL10 sensor development kit is available now. ON Semiconductor’s other energy-efficient, rapid prototyping platforms for IoT include the Bluetooth IoT development kit and the recently-introduced energy harvesting Bluetooth low energy switch.

The RSL10 is available in a 5.5mm2 WLCSP, a 6.0 x 6.0mm QFN package, and a complete SiP with an integrated antenna.

ON Semiconductor will host a live demonstration of how service-provider companies can use the RSL10 sensor development kit to monitor worker safety at Embedded World (Nuremberg, Germany (26 to 28 February) at the company’s stand in Hall 4A – 260.

ON Semiconductor supplies energy-efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, SoC and custom devices for automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.

http://www.onsemi.com

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Compact LoRa module uses Renesas Synergy

Hardware and software supplied by Renesas Electronics is used by Miromicro following the companies’ collaboration to develop an enhanced LoRa module, based on Synergy.

The compact and low-power FMLR-61-x-RSS3 module is based on LoRa devices and wireless radio frequency (RF) technology. The Miromico module enables customers to connect easily to LoRaWAN-based networks and uses the Synergy platform to give customers access to microcontrollers (MCUs) and a large production-grade software package.

Engineers can use the S3A6 MCU on the LoRa-based module to handle various tasks, while seamlessly streaming data across a LoRaWAN-based network to the cloud. The LoRaWAN protocol is quickly becoming the de facto standard to connect the ‘things’ of the IoT across long distances (up to 50km), flexibly and securely, while keeping batteries alive for years.

The FMLR-61-x-RSS3 measures only 14.2 x 19.5mm. Operating voltage is 1.8 to 3.3V and power consumption ranges from 1.4 microA in sleep mode to 25.5mA (typical) in TX mode (14dBm). Receiver sensitivity is -148dBm in LoRa mode SF12 at 10.4 kHz and operating temperature range is -40 to +85 degrees C.

The licensed LoRaWAN stack has firmware over the air (FOTA) capabilities. The module’s specifications make it suitable for urban as well as rural sensing applications such as metering, asset tracking, building automation, security, wearables and predictive maintenance, says Renesas.

The FMLR-61-x-RSS3 module employs the S3A6 MCU with integrated 48MHz Arm Cortex-M4 core, and features 256kbyte code flash memory, 8kbyte data flash, and 32kbyte SRAM. Most MCU signals are available at the module level to make them externally accessible.

Manufactured in a low- power process, the S3A6 peripheral set includes analogue features such as a 14-bit SAR ADC, 12-bit DAC, op amps, and comparators. Timer channels and serial ports, USB function, CAN, DMA, and powerful safety and security hardware makes the S3A6 suitable for battery-operated applications. As part of the Renesas MCU portfolio, the S3A6 can be scaled up for more functionality or scaled down for cost optimisation.

The Renesas Synergy Platform features production-grade software in the Synergy Software Package (SSP). This includes the ThreadX RTOS and associated middleware such as a file system, USB stack, graphical user interface (GUI) software, application frameworks and functional libraries that can be used for encryption and DSP functions.

Samples of the FMLR-61-x-RSS3 LoRa module are available now from Miromico and distributor, Avnet Silica. Mass production is scheduled to start in Q2 2019.

Both Renesas and Miromico are LoRa Alliance members.

The FMLR-61-x-RSS3 demo kit will be on display at the Avnet Silica at Embedded World 2019, in Nuremberg, Germany (Hall 1 – Stand 1-370).

http://www.renesas.com

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Renesas Electronics simplifies automation network for buildings

At this year’s Embedded World, Renesas Electronics will show a proof-of-concept G3-PLC modem with KNX protocol that is claimed to simplify building automation for smart buildings.

The company has implemented KNX protocol on its G3-PLC powerline communication (PLC) solution. Based on the Powerline Modem Solution, Renesas will demonstrate a proof of concept to illustrate how to implement KNX networks and take advantage of the flexibility and efficiency of modern G3-PLC technology while eliminating the need for new network cable deployment.

Combining data line and power line onto one cable system and using the most efficient modulation techniques, PLC is a cost-efficient way to expand connectivity through the building in particular over long distances and across the walls.

Most commercial buildings have areas where RF and tradition network cabling do not reach. The Renesas Powerline Modem Solution demonstrates the possibilities for G3-PLC technology to address these needs without requiring new cable deployment by combining the advantages of the open G3-PLC standard with the popular KNX protocol. The result, says Renesas, will enable the deployment of reliable and cost-effective networking solutions for HVAC, lighting, fire and safety, and building access security.

Primarily developed for energy metering applications, the G3-PLC protocol is freely usable as an open standard and continuously maintained by the G3-PLC Alliance. 

The Renesas Powerline Modem Solution comprises Renesas’ OFDM PLC software modem (R9A06G037), a Renesas Synergy microcontroller (MCU) and the ISL15102, which serves as the power line driver. The software stack is based on the Synergy Software package (SSP) and combines the Renesas G3-PLC stack with a KNX software stack provided by Tapko Technologies. The proof-of-concept allows customers to build KNX over the G3-PLC protocol, offering a smooth migration path from existing KNX standard towards upcoming KNX IoT standard.

G3-PLC is a protocol for narrow band low frequency powerline communication that facilitates high-speed, highly-reliable, long-range communication over the existing powerline grid. The protocol is developed and maintained by the G3-PLC Alliance.

The Renesas G3-PLC Modem Solution with complete set of software supporting KNX Protocol will be available in Q3, 2019.

Visit Renesas at Embedded World in Nuremberg, Germany (26 to 28 February) Hall 1 – stand 1-310.

http://www.renesas.com

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