“World’s largest chip” has more compute cores for data access

Claimed to be the largest chip in the world, the Cerebras wafer scale engine (WSE) measures 216 x 216mm (8.5 x 8.5 inch). At 46,225mm2 the chip is 56x larger than the biggest graphics processing unit (GPU) ever made, claims Cerebras.

It has 400,000 cores and 18Gbyte on-chip SRAM. The large silicon area, more than the largest graphics processing unit, enables the WSE to provide more compute cores, tightly coupled memory for efficient data access, and an extensive high bandwidth communication fabric for groups of cores to work together, claims Cerebras.

The WSE contains 400,000 sparse linear algebra (SLA) cores. Each core is flexible, programmable, and optimised for the computations that underpin most neural networks. Programmability ensures the cores can run all algorithms for constantly changing machine learning operations.

The cores on the WSE are connected via the Swarm communication fabric in a 2D mesh with 100 petabytes (Pbytes) per second of bandwidth. The Swarm on-chip communication fabric delivers breakthrough bandwidth and low latency at a fraction of the power draw of traditional techniques used to cluster GPUs, says Cerebras. It is fully configurable. Software configures all the cores on the WSE to support the precise communication required for training the user-specified model. For each neural network, Swarm provides an optimised communication path.

The 18Gbyte of on-chip memory is accessible within a single clock cycle, and provides 9 Pbytes per second memory bandwidth. This is 3,000 times more capacity and 10,000 times greater bandwidth than the leading competitor, claims Cerebras. The WSE provides moree cores, more local memory and enables fast, flexible computation, at lower latency and with less energy than other GPUs, concludes Cerebras.

https://www.cerebras.net/technology/

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Porsche invests in Israeli startup TriEye to increase road visibility and safety

Israeli startup TriEye, whose Short-Wave-Infra-Red (SWIR) sensing technology enables vision in adverse weather and night-time conditions, has expanded its Series A round to $19 million with an investment from the German sports car manufacturer Porsche. The additional funding will be used for ongoing product development and operations, as well as team growth.

In May 2019, TriEye announced a Series A funding round, led by Intel Capital. Other investors in the round include Marius Nacht and TriEye’s existing investor Grove Ventures. Since its inception, TriEye has raised $22 million, including a seed investment of $3 million led by Grove Ventures in November 2017.

Porsche Ventures seeks strategic investments in business models relating to customer experience, mobility and digital lifestyle, as well as in future technologies such as artificial intelligence, blockchain and virtual and augmented reality. Through its venture capital activities, the sports car manufacturer Porsche invests in new companies that are in the early and growth phases.

TriEye was founded in 2017 by Avi Bakal (CEO), Omer Kapach (VP R&D) and Prof. Uriel Levy (CTO), after nearly a decade of advanced nanophotonics research by Prof. Levy at the Hebrew University in Jerusalem. The company has succeeded in developing an HD SWIR camera that is a smaller size, higher resolution, and a fraction of the price of current technologies. TriEye already succeeded in proving that the technology works and can be mass-produced.

The company’s CMOS-based Raven camera, whose initial samples are due to launch in 2020, is designed to save lives on the roads. Once integrated, the camera will allow ADAS and AV to achieve unprecedented vision capabilities under common adverse weather and low-light conditions such as fog, dust or night-time.

As ADAS systems are expected to operate under a wider range of scenarios, car manufacturers and their suppliers (OEMs and Tier 1s) are realizing that SWIR plays a key role in ADAS and AV sensor fusion in order to achieve full visibility under any weather or lighting conditions. Driving tests and research have shown that even when fusing other sensing solutions such as radar, lidar, and standard cameras, the fusion solution fails in solving the low visibility challenge.

“TriEye is a promising technology company led by an exceptionally strong team with experience in the areas of nanophotonics, deep learning, and the development of semiconductor components,” says Michael Steiner, Member of the Executive Board for Research and Development at Porsche. “We see great potential in this sensor technology that paves the way for the next generation of driver assistance systems and autonomous driving functions. SWIR can be a key element: it offers enhanced safety at a competitive price.”

Avi Bakal, CEO and Co-founder of TriEye, commented: “Our mission is to save lives and reduce risks of accidents in all weather and lighting conditions. The expansion of our Series A round and the addition of Porsche as a strategic investor further proves that SWIR is a critical component in the necessary sensor fusion solution to enable safer and better ADAS and AV.”

TriEye is expected to exhibit at the IAA Conference in Frankfurt from September 11th-13th, as well as the AutoSens conference, due to take place on September 17th-19th in Brussels.

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Optiga Trust M secures automated, cloud connected devices

To improve the security and performance of cloud connected devices and services, Infineon has launched the Optiga Trust M.

It helps manufacturers to enhance the security of their devices, says Infineon, and improves overall system performance. The single chip securely stores unique device credentials and enables devices to connect to the cloud up to 10 times faster than software-only alternatives, claims the company. It is intended for industry and building automation, smart homes and consumer electronics and anywhere that hardware-based trust anchors are critical for connected applications and smart services, from a robotic arm in the smart factory to automated air conditioning in the home.

The growth of cloud connectivity and AI-based applications means that zero-touch provisioning of devices to the network or cloud is gaining more and more traction. Optiga Trust M injects critical assets, such as certificates and key pairs which identify a device, into the chip at the factory premises. The turnkey set-up minimises design, integration and deployment of embedded systems by providing a cryptographic toolbox, protected I2C interface and open source code on GitHub. The high-end security controller is certified according to CC EAL6+ (high) and provides advanced asymmetric cryptography. It has a lifetime of 20 years and can be securely updated in the field.

Infineon’s Optiga family combines hardware security controllers with software to increase the overall security of embedded systems, including IoT end nodes, edge gateways and cloud servers, from basic device authentication to Java card-based programmable components.

The Optiga Trust M is available now. Evaluation kits are also available.

http://www.infineon.com

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Computer on module simplifies security integration

Featuring the eighth and ninth generation Intel Core processors, the COM-CFHB6 computer on module (COM) is built to bring flexible computing to any embedded project, says Aaeon.

The COM-CFHB6 is built to the COM Express Type 6 form factor. It features a wide range of processors from the Intel Celeron to Intel Xeon, and the eighth and ninth generation Intel Core processors (Coffee Lake H/Coffee Lake Refresh).

The COM-CFHB6 supports low power 25W processors, making it particularly suitable for mobile applications, and up to 45W six-core Xeon server CPUs. It also has support for up to 48Gbyte DDR4 memory with ECC support (Xeon, Core), the COM-CFHB6 is built to provide high performance in the most demanding of applications, continues Aaeon.

The COM-CFHB6 offers flexibility with support for four USB 3.1 Gen 2 ports and eight USB 2.0 ports, up to three display ports, and up to 24 PCI Express 3.0 lanes. This, says Aaeon, makes the module suitable for edge computing and AI applications. The COM-CFHB6 is slim, just 28mm tall, to fit into almost any tight space.

Target applications include digital signage, factory automation, and robotic controller. It can even be used as an edge device or artificial intelligence of things (AIOT) gateway in smart city applications.

Aaeon offers its manufacturer and OEM/ODM service, Q-Service Plus for the COM-CFHB6. The company works closely through the entire process, from board design, BIOS set up and product testing.

Established in 1992, Aaeon designs and manufactures professional intelligent IoT solutions. It provides reliable computing platforms, including industrial motherboards and systems, industrial displays, rugged tablets, embedded controllers, network appliances and related accessories, as well as integrated solutions.

It also has hardware and services for premier OEM/ODMs and system integrators worldwide.

As an Associate Member of the Intel Internet of Things Solutions Alliance, Aaeon offers customised end-to-end services from initial product conceptualisation and board product development to mass manufacturing and after-sales service programs.

http://www.aaeon.com

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