Innodisk unveils MIPI over Type-C solution for enhanced AI vision applications

Innodisk, has announced the launch of its industry’s first MIPI over Type-C solution. This exclusive technology overcomes traditional MIPI cable lengths limitations, allowing embedded camera modules to be positioned farther from the system.

This expands the possibilities for visual AI applications, particularly in smart manufacturing and smart cities, enabling the seamless integration of high-quality vision systems into these evolving environments.

The increasing popularity of vision-based applications across industries highlights the critical need for high- quality, reliable camera solutions. As computer vision becomes a cornerstone of AI development, the demand for industrial-grade cameras continues to surge. Innodisk recognises this need and has developed the MIPI over Type-C Solution to address the challenges faced by vision system integrators and developers.

Innodisk’s MIPI over Type-C technology extends the connection distance to 2 meters or more, surpassing the previous 30 cm cable length limitation while maintaining high performance. It enables seamless conversion to a custom USB Type-C interface through a tailor-made adapter board and offers cost- effectiveness compared to SerDes solutions. Additionally, this solution boasts successful deployments on NVIDIA Jetson, Intel x86, and ARM platforms, with Innodisk actively investing in R&D to ensure ongoing compatibility across various platforms, accelerating the deployment of edge AI applications for clients.

Innodisk’s MIPI over Type-C camera module solutions are extensively used in various smart applications. They are revolutionising industries like smart manufacturing, where AMRs and forklifts benefit from high- quality imaging and extended reach. Similarly, shared mobility applications such as shared bikes leverage these modules for enhanced safety and efficiency. By offering a combination of high bandwidth and longer range, Innodisk’s solution removes cable length limitations, unlocking a wave of new possibilities for smart applications.

Innodisk’s MIPI over Type-C solution marks a significant leap forward, building upon its diverse MIPI camera module portfolio and seamless platform integration. This includes compatibility with NVIDIA Jetson, Intel 12th to 13th Gen, Core Ultra processor, AMD Xilinx, and NXP. As the sole Intel-certified MIPI Camera partner in Taiwan, Innodisk collaborates closely with IPC manufacturers, possessing professional integration capabilities to offer comprehensive support and services to customers. The MIPI over Type-C Solution is poised to redefine the future of vision technology, offering performance, flexibility, and affordability.

http://www.innodisk.com

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THine introduces camera kit for NVIDIA Jetson Orin NX/Nano

THine Solutions have announced the new THEIA-CAM 13MP PDAF camera, THSCJ101, for the NVIDIA Jetson Orin NX and Jetson Orin Nano platforms. Along with its pre-optimised ISP firmware and Linux driver, Jetson users are now able to easily integrate advanced imaging capabilities into their systems.

The THSCJ101 kit is a camera reference design kit for embedded camera applications that are using the NVIDIA Jetson Orin NX or the Jetson Orin Nano platform. The THSCJ101 kit is based on THine’s THP7312-P ISP and Sony’s IMX258 13MP CMOS PDAF image sensor.

THine’s optimised ISP firmware provides ultra-quick autofocus using Phase Detection Autofocus (PDAF) technology and best-in-class image quality. The kit hardware includes all items required to interface with Jetson Orin carrier boards with a 22-pin MIPI CSI-2 input connector, including a camera board in an acrylic case and a flat flexible cable.

The Video4Linux2 (V4L2) driver for the THSCJ101 is also available to control various video functions. The performance of each kit is repeatable for use in high volume production due to our production process to characterise the image parameters of each image sensor and to calibrate the image signal processing to compensate for variation from sensor to sensor.
All technical information including the reference circuit schematics, ISP firmware, and V4L2 Driver are available to customers.

Also, for customers that require unique image performance features, THine can provide a GUI based software development tool that customises the ISP firmware and/or the image sensor selection. As a result, the THSCJ101 can accelerate NVIDIA Jetson Orin NX/Nano platform users’ time-to-market without expensive integration cost or additional effort for developing embedded camera systems.

THEIA-CAM is designed for embedded vision systems. Using and optimising THine’s own ISP, THine offers Best-in-Class image quality and high production quality suitable for any project phase from proof of concept to high volume production. THEIA-CAM supports various operating systems including Windows, macOS, Android, and Linux, and various platforms including Raspberry Pi, Jetson Orin, i.MX 8M families, and MediaTek Genio series. THEIA-CAM addresses wide-ranging camera applications including but not limited to AI + IoT devices, AR glasses, barcode reading devices, biometric devices, bodycams, document scanners, machine vision systems, medical scopes, microscopes, surveillance cameras, vision assistance glasses, and webcams. THSCU101, the first Kit in the family, is a 13MP PDAF USB video class (UVC) Camera

https://www.thinesolutions.com

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New Qualcomm-built advanced video processor by Teledyne FLIR powers AI at the Edge

Teledyne FLIR has announced the Teledyne FLIR AVP, an advanced video processor designed to power Teledyne FLIR’s Prism AI and computational imaging at the edge.

The AVP incorporates the latest Qualcomm QCS8550, the most advanced mobile processor chip from the leader in mobile, automotive, and robotics system-on-chip (SoC) technology. The AVP provides best-in-class artificial intelligence (AI) performance within a small, lightweight, and low-power module for thermal and visible camera integration into unmanned aerial vehicles, robots, small gimbals, handheld devices, and fixed-mounted security systems.

AVP runs the Teledyne FLIR Prism AI and ISP software libraries and interfaces with the Boson and Neutrino thermal infrared imaging camera modules and a wide range of popular visible cameras. Trained on the world’s largest thermal image data lake of more than 5 million annotations, Prism AI is a powerful perception software designed to detect, classify, and track targets or objects for automotive autonomy, automotive automatic emergency braking, airborne camera payloads, counter-drone systems, ground intelligence, surveillance and reconnaissance (ISR), and perimeter security. Prism ISP is a comprehensive set of image processing algorithms that include super resolution, image fusion, atmospheric turbulence removal, electronic stabilisation, local-contrast enhancement, and noise reduction.

“The new AVP is the most powerful and SWaP-optimised processor on the market today, running AI workloads up to five times faster than competitive offerings,” said Dan Walker, vice president of product management, Teledyne FLIR. “The combination of powerful edge computing and our Prism digital solutions ushers in a new era of electro-optical system capabilities while simplifying development and reducing integration risk.”

The AVP is designed to empower integrators to build powerful, edge-intelligent products. It is supported by several tools to simplify and streamline development including a Qualcomm RB5 development kit. Software and board-support packages are also available to enable developers to design and fabricate custom interface boards that meet each product’s specific form, fit, function, and input-output (IO) requirements.

https://www.flir.com/avp.

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IMDT and Hailo introduce an Edge AI solution for ultimate performance in real time

IMDT and Hailo have announced a new partnership to integrate the Hailo-8 AI acceleration module into IMDT’s single board computer (SBC), a ready-to-use AI-powered vision system based on IMDT’s NXP iMX8M Plus SOM.

The IMDT imx8-E SBC is combined with the Hailo-8 AI processor which features up to 26 tera-operations per second (TOPS). It offers power efficiency and enables simultaneous processing of multi-streams and multi-models, and delivers a fully functional system with the NXP host processor capabilities and the full connectivity that the IMDT SBC delivers.

Specifically designed for real-time AI applications such as robotics, autonomous guided vehicles, smart cities, and security systems, the ready-to-use AI-powered vision system offers impressive performance in a cost-effective platform, comes in small form factor, and allows full customisation for camera sensors and communication ports.

“I’m very pleased that we are introducing another new high performance solution to the market. The new imx8-E SBC, integrated with the top-performing Hailo AI accelerator, delivers high performance for AI applications with incredible power efficiency at a low cost point,” says Avi Shimon, CEO of IMDT. “This new addition to our line of products is based on NXP’s iMX8M Plus. It’s also an addition to the variety of SOMs and SBCs we offer, based on different platforms such as Renesas, Qualcomm, and Inuitive. In an industry with a myriad of needs and use cases, we pride ourselves on the fact that all our platforms are flexible and may be customised according to our customers’ changing requirements and needs. Our partnership with Hailo only furthers our mission of innovation.”

“Hailo’s top performing AI accelerator in combination with IMDT systems will take cameras, high-performance AI applications, and full system connectivity to the next level,” says Yaron Ofer, Regional General Manager at Hailo. “The integrated platform will deliver high-end solutions for applications that require top performing AI computing such as robotics, smart cities, smart parking solutions, medical devices, and more. We are very pleased to be working with IMDT to bring the industry a solution that addresses fundamental connectivity and vision challenges.”

The embedded IMDT imx8-E SBC system is based on NXP’s i.MX 8M Plus SoC. The NXP i.MX 8M Plus family focuses on machine learning and vision, advanced multimedia, and industrial automation with high reliability. With high AI processing capacity, the imx-E SBC is built to meet the needs of smart homes, smart buildings, smart cities, and Industry 4.0 applications.

https://www.imd-tec.com
https://hailo.ai/

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