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Sensor module boost to light curtain applications

Wed, Oct 02, 2019

A series of infrared (IR) sensor modules in five compact package types from Vishay have entered the market.

Featuring a fast 300 microsecond reaction time, Vishay Semiconductors TSSP9xxx AGC 0 devices deliver long range presence and proximity sensing up to 2m, and a range up to 30m for light curtain and perimeter guard applications.

The fixed-gain sensors provide higher interference strength without spurious signals and an output pulse width closer to the optical burst length, claims the company. They offer an almost constant detection threshold over their -25 degrees C to +85 degrees C temperature range and can detect a valid IR signal up to a higher DC illuminance level.

The TSSP9xxx AGC 0 suits fast proximity applications (~15 ms) by using a burst pattern with variable intensity. The devices are suitable for sensing the distance to objects for toys, drones, robots, and vicinity switches. They may also be used as reflective sensors for hand dryers, towel or soap dispensers, water taps, toilets, vending machine fall detection, and security and pet gates.

To simplify designs in these applications, TSSP9xxx series devices feature a PIN photodiode and sensor IC in compact Minimold (TSSP930..), Mold (TSSP940..), Heimdall (TSSP950..), Panhead (TSSP960..), and Minicast (TSSP980..) packages.

The modules operate at a supply voltage range from 2.0V to 3.6V, feature a low supply current of 0.8mA, and offer carrier frequencies of 38 kHz and 56 kHz. The sensors are designed to receive IR pulses from an emitter with a peak wavelength of 940 nm.

The devices are insensitive to supply voltage and ripple noise and provide shielding against EMI, while an IR filter suppresses visible light.

The series is RoHS-compliant and halogen-free.

Samples and production quantities of the new sensors are available now, with lead times of four weeks.

Vishay Intertechnology is a leading manufacturers of discrete semiconductors (diodes, MOSFETs, and infrared optoelectronics) and passive electronic components (resistors, inductors, and capacitors).

https://www.vishay.com

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Adaptable buck-boost converters deliver up to 2.5A in tiny packaging

Tue, Oct 01, 2019

A family of four high-efficiency, low-quiescent-current (IQ) buck-boost converters that feature tiny packaging with minimal external components for a small solution size is now available from Texas Instruments (TI).

The integrated TPS63802, TPS63805, TPS63806 and TPS63810 DC/DC non-inverting buck-boost converters offer wide input and output voltage ranges that scale to support multiple battery-driven applications, helping engineers simplify and accelerate their designs.

Each of the devices automatically selects buck, buck-boost or boost mode according to the operating conditions. Their complete solution size of 19.5 square mm to square mm 25 is a result of compact packaging, an advanced control topology requiring few external multilayer ceramic capacitors, and tiny 0.47-microH inductors.

The devices offer a 1.3-V to 5.5-V input and 1.8-V to 5.2-V output voltage range, to help engineers speed their designs and encourages reuse across multiple applications.

These DC/DC converters are the latest addition to TI’s low-IQ power-management portfolio, providing low 11- to 15-microA IQ for light-load efficiency while minimising power losses and extending run times in battery-driven applications such as portable electronic point-of-sale terminals, grid infrastructure metering devices, wireless sensors and handheld electronic devices.

The TPS63802 is a 2-A buck-boost converter with low 11-microA IQ consumption suitable for pulsed-load applications such as industrial Internet of Things devices. The TPS63805 is a 2-A buck-boost converter with a 22-microF output capacitor and 0.47-microH inductor resulting in a small solution size of 19.5 mm squared that meets the requirements of handheld industrial and personal electronics applications.

The new series also includes the TPS63806, a 2.5-A buck-boost converter with a focus on improved load-step regulation for applications with an aggressive load profile that require tight regulation, such as time-of-flight sensors in smartphones, cameras or augmented reality devices. And the

TPS63810 is a 2.5-A buck-boost converter with I2C interface for dynamic voltage scaling through either a two-wire interface or the VSEL pin, enabling the device to serve as a pre-regulator or voltage envelope tracker for systems found in smartphones, wireless hearing aids or headphones.

http://www.ti.com

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Software uses AR to automate manual operations into 4.0 environment

Tue, Oct 01, 2019

FactoryOptix from Aegis Software is a technology that integrates human assembly operations directly into the automated Industry 4.0 environment, using augmented reality (AR) as an additional method to deliver FactoryLogix paperless work instructions.

Aegis FactoryLogix, IIoT-driven MES, brings two digital worlds together in a single solution, for automation featuring the IPC connected factory exchange (CFX), and for human assembly, test and inspection operations featuring AR.

FactoryOptix uses the same internal digital product model to provide all the data and documentation needed for AR to work. The company says this means that cost of ownership and configuration is unchanged from the existing best-in-class FactoryLogix paperless work instruction solution.

This technology can double the productivity of human operators by enabling the use of both hands at all times, not having to pick up barcode readers, use keyboards or a mouse, nor having to look away to read work-instructions from a screen.

This latest AR hardware is claimed to have good battery life and is light enough to allow long-term usage throughout the day without fatigue, in the same way as a heads-up display that features in many cars.

The view through the AR glasses provides critical step-by-step instructions, with confirmation from the operator that each operation is done. Feedback from the operator is captured using voice recognition for commands and actions, with barcodes read by the glasses automatically when instructed to do so.

The automated environment for the operator equates to less dependency on narrowly focused specific skills, meaning that operators are more flexible to work on different tasks, products and variants, without risk of “memory-driven defects”, says Aegis.

Human operators become more broadly skilled, providing flexibility in the factory to adapt to changing manufacturing demands as is to be expected in the high-mix Industry 4.0 environment.

Founded in 1997, Aegis Software is headquartered in Philadelphia PA, with international sales and support offices in Germany, the UK and China.

https://www.aiscorp.com

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Microchip simplifies hardware-based IoT security

Mon, Sep 30, 2019

A pre-provisioned solution that provides secure key storage for low-, mid- and high-volume device deployments using the ATECC608A secure element is now available from Microchip Technology. According to the company, the Trust Platform for its CryptoAuthentication family enables companies of all sizes to implement secure authentication.

The platform consists of a three-tier offering, providing out-of-the-box pre-provisioned, pre-configured or fully customisable secure elements, allowing developers to choose the platform best suited for their individual design. As the first solution to provide ready-to-go secure authentication for the mass market, the first tier – Trust&GO – provides zero-touch pre-provisioned secure elements with a minimum orderable quantity (MOQ) as low as 10 units.

Device credentials are pre-programmed, shipped and locked inside the ATECC608A for automated cloud or LoRaWAN authentication onboarding. In parallel, corresponding certificates and public keys are delivered in a “manifest” file, which is downloadable via Microchip’s purchasing e-commerce store and select distribution partners.

With the ability to authenticate to any public or private cloud infrastructure, Microchip’s Trust Platform is also flexible and customisable. For customers who want more customisation, the program includes the TrustFlex and TrustCustom platforms.

The solution helps simplify provisioning logistics, says the company, making it easy for mass market customers to secure and manage edge devices without the overhead cost of third-party provisioning services or certificate authorities.

The second tier in the program, TrustFlex, offers the flexibility to use the customer’s certificate authority of choice while still benefiting from pre-configured use cases.

These use cases include baseline security measures such as transport layer security (TLS) hardened authentication for connecting to any IP-based network using any certificate chain, LoRaWAN authentication, secure boot, Over-the-Air (OTA) updates, IP protection, user data protection and key rotation. This can reduce the time and complexity involved in customising the device without requiring customised part numbers.

For customers who would like to customise their designs entirely, the third tier in the program – TrustCustom – provides customer-specific configuration capabilities and custom credential provisioning.

https://www.microchip.com

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Sensor module boost to light curtain applications

Adaptable buck-boost converters deliver up to 2.5A in tiny packaging

Software uses AR to automate manual operations into 4.0 environment

Microchip simplifies hardware-based IoT security

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