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Validation app accelerates AI, graphics and processor development

Fri, May 24, 2019

Synopsys claims to delivers 100X faster formal verification closure for artificial intelligence (AI), graphics and processor designs with the introduction of the Datapath Validation (DPV) app as part of the VC Formal tool suite.

The DPV app leverages proven Hector technology (Synopsys’ C to RTL formal consistency checking technology) to deliver exhaustive formal verification closure on datapath-intensive designs during the design and verification cycle. The app also delivers over 100X speed-up in formal verification between a reference C/C++ algorithm and register transfer level (RTL) design implementation over conventional techniques of complex SoC designs and enables exhaustive functional verification in situations previously deemed impractical, explains Synopsys.

Samsung reports that using VC Formal’s Hector technology reduced simulation efforts and helped the team catch more than 30 RTL bugs in designs for its datapath-centric designs.

AI, graphics and processor designs involve complex algorithmic functional blocks that are datapath- heavy and have to have behaviour modelled in high-level languages such as C/C++. The implemented RTL for these designs needs to be verified for functional equivalence with the C/C++ model. The native integration of VC Formal with Synopsys’ Verdi automated debug system enables design and verification teams to leverage formal technologies and automate root cause analysis of formal results. The native integration of VCS in VC Formal allows formal analysis to be inserted easily into the existing verification environment.

The VC Formal Datapath Validation application is available now.

Synopsys styles itself as the ‘Silicon to Software’ partner for innovative companies developing electronic products and software applications. It is 15th largest software company in the world and specialises in electronic design automation (EDA) and semiconductor IP while growing its software security products. Its customer base is made up of SoC designers creating advanced semiconductors and software developers writing applications that require the highest security.

http://www.synopsys.com

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Arrow Electronics extends IoT support with cellular comms

Thu, May 23, 2019

Distributor Arrow Electronics has signed a global agreement with Infineon and Arkessa to simplify secure and scalable cellular connectivity for IoT devices.

Security is a major concern for organisations using connected devices. Infineon provides the secured hardware controllers based on GSMA’s Embedded Subscriber Identity Module (eSIM) specification and Arkessa provides secured mobile data services with the ability to provision and manage IoT devices from the factory into the field.

OEMs, system integrators and enterprises can obtain all the technology and service elements required to provide consistent connectivity for IoT devices anywhere in the world, explains Arrow, optimising Infineon’s security features and Arkessa’s network access and provisioning. eSIMs provide greater security and reliability in multiple IoT applications, continues Arrow, and can be flexibly coupled with cellular, NB-IoT, and LTE-M services today from Arkessa.

Andrew Orrock, CEO Arkessa, said: “We are delighted to be working with Arrow and Infineon to deliver the secure global connectivity that allows customers to deploy their IoT applications easily, efficiently, and at scale, wherever their devices are in the world.”

For progress to be made in Industry 4.0 adoption, machine to machine (M2M) communication must be secure. Machines in smart factories are increasingly using cellular networks to exchange information that ensures smooth operation and improves efficiency. Infineon’s SLM family of security controllers are optimised for industrial applications, providing higher levels of endurance over an extended temperature range of -40 to +105 degrees C.

In addition to industrial use, this secure connectivity can be used across smart cities, retail, and asset tracking.

Arrow provides components, modules and software for the edge of the IoT right through to the cloud services and analytics that exploit the data generated and encompasses all the connectivity in between and the security to protect the integrity of the network and its data.

Aiden Mitchell, vice president IoT, Arrow Electronics, said: “This new agreement will enable organisations to take advantage of the latest technologies to execute connected device strategies, using secure cellular services at scale, while staying focused on their own strengths and differentiators to create better outcomes for their customers and without being dependent on their clients’ networks.”

https://www.fiveyearsout.com

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High-current photorelays achieve UL 508 for factory automation

Thu, May 23, 2019

Certification to UL 508 for factory automation allows designers using Toshiba Electronics Europe’s photorelays to achieve UL approval for control equipment

The nine high-current photorelays in the series include low on-state resistance MOSFETs based upon Toshiba’s U-MOS VIII process that ensure high performance in a range of applications.

The TLP3556A, TLP3558A, TLP241A, TLP3543A, TLP3545A, TLP3546A, TLP3547, TLP3548 and TLP3549 are now fully certified to UL 508 and UL1577. These approvals allow designers to meet the UL safety requirements for control equipment, including the thermal design margin.

The devices can be used in industrial applications such as PLCs, interfaces and sensor control as well as building automation (heating and ventilation / heating ventilation air conditioning or HVAC). They can also be used for relay replacement in DC systems to 125V and AC systems to 400V, replacing 1-Form-A and other mechanical relays.

The photorelays are more robust than their mechanical counterparts and do not require a driver, so space, weight and cost savings can also be realised.

The nine photorelays are housed in DIP packages with four, six or eight pins (DIP4, DIP6 or DIP8). All packages have a surface mount option available, including wide-body versions. Devices are able to operate across the industrial temperature range of -40 to +85 degrees C ambient, while the case temperature can safely rise to 105 degrees C.

The photorelays can handle off-state output terminal voltages (Voff) as high as 600V. They also offer on-state resistances (Ron) as low as 22mOhm and can handle continuous currents (Ion) up to 5A. The pulsed current (IONP) is three times this level.

All nine photorelays in the range are available in production quantities.

http://www.toshiba.semicon-storage.com

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Embedded Vision Alliance awards REAL3 image sensor as “Product of the Year”

Thu, May 23, 2019

Smartphone cameras increasingly require 3D vision capabilities as differentiating factor. Hence, Infineon Technologies developed the REAL3™ IRS2381C, a premier 3D imager sensor solution especially designed for the mobile device market.

The Embedded Vision Alliance now awarded the 3D Time-of-Flight (ToF) single chip solution as “Product of the Year” in the category “Sensors”. The Award recognises the innovation and achievement of the industry’s leading technologies, services, and products from companies enabling next generation of practical applications for computer vision.

“Congratulations to Infineon for winning Best Sensor in our 2019 Vision Product of the Year awards,” said Jeff Bier, Founder of the Embedded Vision Alliance. “Innovative sensor designs, like Infineon’s 3D Image Sensor, are enabling new 3D vision experiences such as smartphone face recognition and augmented reality. Infineon has been a pioneer in creating 3D image sensors for visual AI applications. I applaud the company’s ongoing investment in innovation and quality in this rapidly changing and often confusing market. I’m proud that Infineon is a member of the Embedded Vision Alliance and delighted they have been recognised with this outstanding honour.”

“We would like to thank the Embedded Vision Alliance for having honoured us with the ‘Product of the Year’ Award, which recognises Infineon’s innovation and performance of our REAL3™ ToF-based 3D imager the category ‘Sensors’, said Philipp von Schierstaedt, Vice President, RF & Sensors, Infineon. “Building upon the combined expertise of Infineon and pmdtechnologies, the novel sensor delivers a new level of 3D camera capabilities in mobile device applications. Infineon’s REAL3TM ToF sensor enables a unique user’s experience in secure face-authentication, computational photography and seamless AR-applications”.

Time-of-Flight (ToF) is the most advanced image sensing technology powering 3D cameras in new generation mobile devices and is posed to fuel the dramatic growth of 3D image sensing application market expected for future years. “Time-of-flight” stands for the time the photons need to travel from the camera to the subject or object of desire and back to the REAL3 sensor. Behind this concept there is unparalleled innovation: it enables the next level of highly secure user smartphone interaction.

The awarded IRS2381C image sensor ensures a high-quality, real time and secure 3D vision experience with supreme performance at all light conditions including outdoor. Compared to other 3D technologies like structured light, Infineon’s 3D ToF technology reduces the number of key components from three to two. Moreover, as distance is measured directly, it requires the least computational resources on the application processor. All this makes the application much more reliable, reduces the size and leads to more competitive costs, while enormously cutting the power drain.

Availability

The new 3D image sensor chip was developed in Graz, Dresden and Siegen and combines the know-how of Infineon’s German and Austrian locations in a single solution. With proven high volume production and a fast, in-factory enabled and lifetime valid calibration process, IRS2381C is the 3D image sensor of choice for 3D camera manufacturing in mobile device applications. More information about Infineon’s 3D image sensor family is available at www.infineon.com/real3.

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Validation app accelerates AI, graphics and processor development

Arrow Electronics extends IoT support with cellular comms

High-current photorelays achieve UL 508 for factory automation

Embedded Vision Alliance awards REAL3 image sensor as “Product of the Year”

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