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NFC tag allows seamless mobile connectivity

Thu, Jun 27, 2019

Infineon Technologies claims to have introduced the world’s first certified NFC Type 4B tag. It is claimed to be the first product worldwide certified by the NFC Forum that supports the contactless Type B protocol.

Near field communication (NFC) allows wireless communication between two electronic devices within a distance of approximately 4 cm. NFC tags use this technology to exchange data and to enable contactless payments using smart cards or mobile handsets. NFC tags provide smartphones with reliable data exchange and reference tags for interoperability testing with all types of internationally standardised NFC protocols. This latest NFC reference tag is based on SECORA Pay security, which has been approved under the NFC Forum Certification Program. This confirms their compliance with the Type 4A Tag and the Type 4B Tag.

NFC tags have been generally limited to use cases where security is not deemed to be critical – such as sharing URLs or exchanging business cards. However, they can also be combined with security critical payment applications. Users can activate services via NFC connectivity without having to open an app, and thus instantly connect their mobile handset to, for example, smart devices like wearables or access shared services such as pavement scooters with intuitive connectivity for everyday digital transactions.

The NFC reference tags are based on Infineon’s SPA1.1 module and are pre-loaded with NFC data exchange format (NDEF) files so developers can test a wide variety of smartphones for compliance with ISO/IEC 14443 Type A and Type B.

The Type A and Type B NFC tags are available in pairs.

http://www.infineon.com

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Multi-chip package is set to advance 5G CPE modem roll out

Thu, Jun 27, 2019

Memory supplier, Winbond Electronics, supports accelerated roll-out of 5G customer premises equipment (CPE) modems as it releases a 2Gbit+2Gbit NAND+LPDDR4x multi-chip package.

The W71NW20KK1KW combines non-volatile flash/high-speed DRAM for cost and memory capacity in static 5G modem applications, says Winbond.

The 1.8V device is provided in a compact 8.0 x 9.5 x 0.8mm multi-chip package (MCP).

The W71NW20KK1KW combines robust single level cell (SLC) NAND flash and high-speed, low-power LPDDR4x memory. It provides sufficient memory capacity for 5G cellular modems that are intended for use as CPE in homes and offices.

Static 5G CPE modems can operate with memory capacities of 2Gbit NAND/2Gbit DRAM. This combination in a single package enables 5G modem manufacturers to meet the system requirements of CPE units at the lowest possible materials and production cost, says Winbond, to help accelerate consumer adoption of 5G as an alternative to fixed-line copper or optical xDSL links in the last mile of high-speed broadband networks.

According to Wilson Huang, product marketing manager at Winbond, Winbond is the only MCP chip manufacturer that produces both NAND and LPDDR4x in its own wafer fabrication plants to assure customers of supply quantities and schedules, quality and service.’

The W71NW20KK1KW is a 149-ball ball grid array (BGA) MCP consisting of a 2Gbit SLC NAND flash die and a 2Gbit LPDDR4x DRAM die. The robust SLC NAND flash offers endurance and high data integrity, adds Winbond. The SLC NAND only requires 4-bit error code correction (ECC) to achieve high data integrity, but the device’s 2kbyte+128byte page size provides enough space for the use of 8-bit ECC.

The W71NW20KK1KW has an 8-bit bus, and is organized in blocks of 64 pages. The NAND die’s performance specifications include a maximum page Read time of 25 micro seconds and a typical page program time of 250 micro seconds.

The LPDDR4x DRAM die, which operates at a high frequency of 1866MHz, provides an LVSTL_11 interface and features eight internal banks for concurrent operation. It offers a data rate of up to 4267M transfers per second, supporting the fast data-transfer rates to be offered by 5G cellular networks, according to Winbond.

The W71NW20KK1KW is available now in production volumes.

http://www.winbond.com

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Powerline communication dev tools evaluate G3-PLC chipset

Thu, Jun 27, 2019

A plug-and-play powerline communication (PLC) development toolset from STMicroelectronics provides all the hardware and software components needed to build and run a PLC application. It is designed to accelerate the development of turnkey powerline networks.

It lets developers connect smart devices using the ST8500/STLD1 chipset, used in utility-class smart-meter projects, on ST’s EVALKITST8500-1 evaluation kit for the ST8500 PLC modem system-on-chip and STLD1 dual line driver.

The hardware, software and documentation tools include the certified protocol stacks for G3-PLC communication in all frequency bands up to 500kHz (CENELEC-A, CENELEC-B and FCC bands certified), a 6LowPAN adaptation layer for IPv6 that enables scalable networking, and single modem protocol engine and real-time engine firmware images for both PAN co-ordinator and device nodes.

There is also support for self-adaptive and mesh networking, allowing use in electrically noisy environments. For cyber security, there is an AES cryptography engine with up to a 256-bit key.

The toolset provides an open-source firmware framework based on the STM32 general purpose companion microcontroller for the chipset, ready for users to create and integrate application firmware.

Application examples for the STM32 include remote control of indicator LEDs, real-time clock (RTC) configuration, and ping and string data transfers between nodes. The application firmware example implements a UDP/IPv6 protocol on top of the 6LowPAN adaptation layer of the G3-PLC communication layers running on the ST8500.

The toolset also includes ST’s STSW-SGKITGUI SmartGrid LabTool, a PC-based graphical user interface (GUI) to allow users to configure and control the EVALKITST8500-1 hardware, run application commands, and apply firmware upgrades. Supporting documentation is also provided, including the STM32 Firmware User Manual and G3-PLC host interface driver application note.

According to STMicroelectronics, developers can use the toolset for smart home, smart building, smart city, smart infrastructure, and smart energy applications.

The toolset is available now and free to qualified potential customers.

http://www.st.com

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Amplifiers and comparators shrink space requirements

Wed, Jun 26, 2019

Smaller personal electronics, enterprise, industrial and communications designs can be achieved with the INA185 current-sense amplifier, and open-drain TLV4021 and push-pull TLV4041 comparators, claims Texas Instruments.

The INA185 is claimed to be the industry’s smallest current-sense amplifier in a leaded package and the TLV4021 and push-pull TLV4041, with an internal 1.2 or 0.2V reference, are claimed to be the smallest, most accurate comparators. In addition, says Texas Instruments, pairing the amplifier with one of the comparators produces the smallest, highest performing overcurrent detection solution in the industry.

The INA185 current-sense amplifier achieves more precision in less space, says the company. It is offered in a small-outline transistor (SOT)-563 package (1.6 x 1.6mm or 2.5mm²), making it 40 per cent smaller than the closest competitive leaded packages, says Texas Instruments.

It has a 55 microV input offset that enables higher precision measurements at low currents, and enables the use of lower-value shunt resistors to cut system power consumption. The 350kHz bandwidth and 2.0V/micro second slew rate enable phase-current reproduction to enhance motor efficiency and also save system power.

The matched resistive gain network enables a maximum gain error down to 0.2 per cent, which contributes to robust performance over temperature and process variations. The device’s typical response time of two micro seconds enables fast fault detection to prevent system damage.

The TLV4021 and TLV4041 comparators are available in a small die-size ball grid array (DSBGA) 0.73 x 0.73mm package. Both have an integrated voltage reference which saves board space and supports precise voltage monitoring to optimise system performance.

The comparators can monitor voltages down to 0.2V internal reference and feature a high threshold accuracy of one per cent across a full temperature range from -40 to +125 degrees C. Low 2.5 microA quiescent current delivers extended battery life for smart, connected devices, while a fast propagation delay (as low as 450 nano seconds) reduces latency and enables systems to monitor signals and respond quickly to fault conditions.

When used in combination, the INA185 and the TLV4021 or TLV4041, produce the smallest, highest-performing overcurrent detection partnership, around 15 per cent smaller and 50 times faster than competitive devices, points out Texas Instruments.

Pairing the amplifier with one of the comparators to support overcurrent detection on rails as high as 26 V delivers more headroom to better manage current spikes, adds Texas Instruments.

TINA-TI SPICE models and reference designs to simulate system designs and predict circuit behaviour when using the INA185 current-sense amplifier and TLV4021 and TLV4041 comparators are available, together with evaluation modules, the INA185EVM and TLV4021-41EVM.

http://www.ti.com

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NFC tag allows seamless mobile connectivity

Multi-chip package is set to advance 5G CPE modem roll out

Powerline communication dev tools evaluate G3-PLC chipset

Amplifiers and comparators shrink space requirements

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