Smart Lighting Market Expected to Reach USD 23 Billion by 2025

Smart Lighting Market is set to grow from its current market was valued at over USD 7.5 billion in 2018 to USD 23 billion by 2025, according to a new research report by Global Market Insights, Inc. 

Rise in smart city projects and innovations in home automation are driving smart lighting market forecast significantly. The growing urban population has triggered initiatives by the government to provide access to efficient LED lights, along with deploying AI and IoT in building automation systems for commercial, residential and industrial spaces. The Ministry of Housing and Urban Affairs in India had set up a smart cities mission with a view of developing over 100 cities in the country over a span of five years.

The luminaire market will grow at a CAGR of over 16% during the projected timeline. Regulatory restrictions on the use of inefficient lighting technologies are propelling the growth of the smart lighting market. The adoption of energy-efficiency code and smart controls also acts as a major force driving the adoption of the connected luminaire market. Furthermore, the superior properties of luminaire such as durability and energy-efficiency are also accelerating their adoption across multiple lighting applications.

Wireless technology will grow significantly with a CAGR of more than 21% during the forecast period. The growth of the smart lighting market is credited to the integration of advanced technologies, such as Bluetooth, ZigBee, and Wi-Fi, into the lighting solutions. This allows lamps to be controlled through mobile apps or a home/building automation hubs and individual bulbs can be programmed to change the output as per requirements. Furthermore, the lamp’s internet connectivity makes it possible for vendors to use edge computing and equip smart bulbs with additional features such as built-in cameras, built-in speakers, and occupancy-sensing capability.

Hardware accounts for the majority share in the market. The market growth is credited to the increasing adoption of connected or smart bulbs across the globe. The proliferation of IoT devices is also serving as a major force driving the demand for the hardware market. On the other hand, the software market will grow at a CAGR of over 22% during the forecast period. The growing adoption of smart home and home automation solutions is driving market growth. Moreover, the integration of wireless technology into lighting solutions is also developing multiple new avenues for the growth of the software market.

The outdoor lighting market will grow at a CAGR of more than 21% during the projected timeline. The outdoor lighting applications are characterized by high safety & security, low maintenance cost, and adequate lighting needs while keeping the cost low. The need to address these requirements is one of the major factors augmenting the demand for smart lighting solutions in outdoor applications. The growing trend of smart cities across the globe is also driving the growth of the market.

Indoor lighting applications are dominating the smart lighting market with more than 78% of share in the revenue. The market is driven by the growing demand for energy-efficient lighting solutions among residential, commercial, and industrial facilities. The supportive government initiatives for the promotion of energy-efficient lighting along with the ban on the use of inefficient lighting solutions is augmenting the market growth. the rising trend of connected bulb and home automation systems fosters the market growth.

Europe is expected to evolve as one of the most significant revenue pockets for smart lighting market, owing to the significant number of smart city projects and increased adoption of smart LED lighting systems. The European Union innovation partnership on smart cities and communities is a program established by the European Commission that brings together small businesses, industries and cities together. The aim of the program is to enhance the urban lifestyle through sustainable solutions and addresses specific challenges across varied policy areas such as mobility, energy and transport.

The prominent vendors in the smart lighting market are Philips Lighting, Osram, GE Lighting, Cree, Schneider Electric, Echelon Corporation, Acuity Brands, Silver Spring Networks, Deako, and Tvilight.

Source: –  https://www.gminsights.com/pressrelease/smart-lighting-market

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HD LCD video controller has MIPI-CSI2 input for parking assist

Claimed to be the first full HD 1080p LCD video controller to include a four-lane MIPI-CSI2 input, the RAA278842 LCD video controller’s four-lane (or dual two-lane) MIPI-CSI2 input supports up to 1Gbit per second per lane. This allows it to interface with the latest generation of automotive cameras, application processors and graphics processors, explains Renesas Electronics. The controller also supports a 150 MHz single-channel OpenLDI interface and a variety of video interfaces and LCD panel sizes with resolutions up to 1920 x 1080.

The RAA278842 can be used for automotive central infotainment displays (CIDs) and head units, instrument clusters, head-up displays (HUDs) and mirror replacement display applications for advanced driver assistance systems (ADAS).

“The RAA278842 LCD video controller helps automotive system manufacturers develop versatile and reliable display systems that provide superior HMI graphics for analogue and digital video content,” said Niall Lyne, senior director, automotive mixed-signal/power and video, Renesas Electronics. “Our strong heritage in video signal processing for backup cameras along with highly differentiated new technology is valued by automakers and Tier-1 suppliers worldwide,” he said.

The RAA278842 LCD video controller has 10-bit per colour processing built into the image enhancement engine to provide near-zero latency, high quality video. Integrated video diagnostics detect if the incoming video is frozen or corrupted and can provide a direct path for the rear camera video to be displayed on the LCD. This significantly improves rear camera display reliability, explains Renesas, claiming that it virtually eliminates the possibility of a software-related problem causing the rear camera video to be displayed incorrectly or not at all. The RAA278842 can display the camera image on an LCD in less than 500 milliseconds, addressing the fast boot requirement of many OEMs. The EEPROM/SPI flash fast boot allows register programming without requiring an external microcontroller

The RAA278842 with MIPI-CSI2 output and the RAA278843 with traditional BT.656 output, work with the system’s main processor to monitor the camera and the video data coming from the SoC or graphics processor unit (GPU). After vehicle ignition, while the instrument cluster boots up, the RAA27884x controller can display the carmaker’s logo or live camera video. The controller’s on-screen display feature can also simulate warning lamp checks in an instrument cluster application.

Both controllers enable compliance with FMVSS-111, requiring the blind spot area behind the vehicle is displayed in less than two seconds after the driver places the vehicle in reverse gear.

Proprietary input switching eliminates flicker when switching between sources, claims Renesas and the AEC-Q100 Grade-2 qualified devices are specified for operation from -40 to +105 degrees C

The RAA278842 and RAA278843 can be combined with Renesas’ R-Car SoC family, RH850 MCU family, and RL78 MCU family, as well as the ISL78302 dual LDO, ISL78322 dual 2A/1.7A synchronous buck regulator, and ISL78228 dual 800mA synchronous buck regulator to provide power rails for the RAA27884x and other ICs on the automotive infotainment system board.

Mass production quantities of the RAA278842 with MIPI-CSI2 output are available now in a 14 x 14mm, 128-lead LQFP package.

Mass production quantities of the RAA278843 with BT.656 output are available now in a 14mm x 14mm, 128-lead LQFP package.

http://www.renesas.com

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RS Components introduces compact IR temperature sensor for smart factories

Designed for space-sensitive factory maintenance, repair and operations (MRO) in smart manufacturing environments, the RS Pro infra red temperature sensor by RS Components is a low-cost non-contact voltage-output temperature sensor.

It has been designed to fit into tight spaces and show the measured temperature in- situ, so maintenance engineers do not have to return to the control room to check it.

The RS Pro infra red temperature sensor measures just 30mm deep and 31mm in diameter. It has a side-entry cable making it easy to mount in small spaces. The temperature is displayed on a built-in backlit OLED display, without the need for contact with the target surface. The sensor can be used where it is not possible to use contact probes, for example when the target is moving or inaccessible; it will fit between a wheel and the rim or hub of a disc brake.

The RS Pro infra red temperature sensor can measure surface temperatures from 0 to 1,000 degrees C to an accuracy of ±1.5 per cent of reading or ±1.5 degrees C, whichever is greater, and repeatability of ±0.5 per cent of reading or ±0.5 degrees C. Response time is just 250ms, allowing continuous monitoring by industrial process instrumentation via the DC voltage output.

The sensor provides simultaneous voltage and alarm outputs. The voltage output can be configured as 0 to 5V DC, 1.0 to 5V DC or 0 to 10V DC, with adjustable temperature range scaling, configured using built-in controls on the sensor. The open-collector alarm output offers adjustable temperature threshold and hysteresis.

The sensor is supplied set up to measure non-reflective surfaces such as paper, plastics, rubber, wood, tarmac, food, pharmaceuticals, organic materials and painted metal. To measure the temperature of reflective solid or liquid surfaces, the user can adjust emissivity settings between 0.20 and 1.00.

The RS PRO infra red temperature sensor is fitted with a 1m long cable, as standard. This can be extended using terminal blocks or connectors. An optional air purge collar helps keep the lens clean from smoke, fumes, dust, steam or other potential contaminants.

The device is IP65-rated.

https://uk.rs-online.com

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HBI+ PHY supports 2.5D interconnect for SoC partitioning

7nm high bandwidth interconnect (HBI+) PHY for die-to-die interconnects from eSilicon supports 2.5D applications such as silicon interposers and silicon bridges for system on chip (SoC) to chiplets and SoC partitioning.

The 7nm HBI+ physical interface (PHY) IP is available for license for customer designs. The hard IP block delivers a high-bandwidth, low-power and low-latency wide-parallel, clock-forwarded PHY interface for 2.5D applications including SoC to chiplets and SoC partitioning for complex sub-systems. Silicon interposer and silicon bridge technologies are supported, adds eSilicon.

The HBI+ PHY delivers a data rate of up to 4.0Gbits per second per pin. Flexible configurations include up to 80 receive and 80 transmit connections per channel and up to 24 channels per PHY, with one redundant lane per channel to improve production yields. The part also supports built-in self-test (BIST), internal loopback and external PHY-to-PHY link tests. It supports IEEE 1149.1 (JTAG) and 1149.6 (AC JTAG) boundary scan standards.

Hugh Durdan, vice president, strategy and products at eSilicon, said: “This new HBI+ PHY will help to enable a growing chiplet ecosystem that is supported by many new and innovative technologies.”

The earlier version of this PHY (HBI, 2.5 Gbits per second per pin) was used successfully on a customer ASIC at 14nm. eSilicon is currently in design with a major customer ASIC in 7nm using the HBI+ PHY.

eSilicon provides complex FinFET ASICs, market-specific IP platforms and advanced 2.5D packaging solutions. Its ASIC-proven, differentiating IP includes configurable 7nm 56G/112G SerDes plus networking-optimised 16, 14 or 7nm FinFET IP platforms featuring HBM2 PHY, TCAM, specialised memory compilers and I/O libraries. The company’s neuASIC platform provides AI-specific IP and a modular design methodology to create adaptable, efficient artificial intelligence (AI) ASICs. eSilicon serves the high-bandwidth networking, high-performance computing, AI and 5G infrastructure markets.

http://www.esilicon.com

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