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Low-latency PHY technology prepares for industry 4.0

Wed, Nov 13, 2019

Industrial Ethernet physical layer (PHY) products released by Analog Devices help manufacturers address industry 4.0 and smart factory communication challenges around data integration, synchronisation, edge connectivity, and system interoperability.

At SPS later this month, the company will be showcasing the ADIN1300 low-power, single port Ethernet transceiver. It has industry leading power and latency specifications, claims the company and is primarily designed for time-critical industrial Ethernet applications up to Gigabit speeds.

It has 10BASE-Te/100BASE-TX/1000BASE-T IEEE 802.3-compliant MII, RMII and RGMII MAC interfaces with 330mW consumption (1000BASE-T) and 290 nano second 1000BASE-T RGMII latency (receive and transmit). It complies to several EMC test standards, including IEC 61000-4-5 surge (±4kV), IEC 61000-4-2 ESD (±6kV contact discharge), IEC 61000-4-6 conducted immunity (10V) and EN55032 radiated emissions (Class A) and EN55032 conducted emissions (Class A). It is packaged in a 40-lead, 6.0 x 6.0mm LFCSP.

The ADIN1300 is designed to operate in harsh industrial conditions and over extended ambient temperature ranges, mirroring the trend for industrial automation to increasingly adopt the Ethernet and increase data rates.

ADIN1300 is the latest technology developed for the Analog Devices’ Chronous industrial Ethernet solutions. The Chronous portfolio includes the ADIN1200, a low-power single port 10/100 robust Ethernet PHY for real-time industrial Ethernet networks. Other products include a range of advanced industrial Ethernet technologies from real-time Ethernet switches, PHY transceivers and protocol processing to complete network interface products.

ADIN1300 targets industrial Ethernet applications as motion control, factory automation, building automation, test and measurement and the IIoT.

ADI will be exhibiting ADIN1300 and other ADI Chronous Ethernet portfolio solutions at SPS ( 26 to 28 November) in Nuremberg, Germany, Hall 5, 129.

http://www.analog.com

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Module combines sensors for smart building data

Wed, Nov 13, 2019

Data can be collected within 30 minutes of plugging in the AmbiMate MS4 multi-sensor module. TE Connectivity says that the module collects data for heating, lighting, air quality and other applications to cut time to market for smart building systems.

The AmbiMate MS4 multi-sensor module integrates the most popular set of sensors needed for most smart building solutions. Engineers can use the module instead of up to seven individual sensors, enabling the time required to research, source and integrate multiple sensors and frees up resources to work on other aspects of smart building system designs.

Different module options are available to meet different specifications. A basic version has the four core sensors of passive infra red, ambient light, temperature and humidity to control of heating and lighting. Customers can choose to add a microphone and / or equivalent carbon dioxide and volatile organic compound (VOC) sensors for features such as voice activation and air quality management.

“Engineers face the challenges of looming deadlines, unforeseen technical obstacles and high expectations,” explained Jonathan Catchpole, system architect at TE Connectivity’s industrial business. “We designed the AmbiMate sensor module as the best possible set of sensors for intelligent buildings so that engineers can focus their efforts on . . . cloud integration, software or meeting the WELL Building Standard.”

(The WELL Building Standard is focused on improving comfort and productivity through enhanced control of the environment in and around buildings.)

The AmbiMate sensor module is available to buy as a standalone PCB assembly (PCBA) in bulk and also as a developer kit. The developer kit includes multiple attachment options for flexibility in the mechanical fit and connection inside a product housing. Electronics developers can plug an AmbiMate module into a host controller, like a Raspberry Pi or Arduino device, and start collecting data within 30 minutes with support of code that is available on the company’s website. The module is compatible with the I2C communication protocol.

The AmbiMate sensor module is available from electronics distributors.

http://www.te.com

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ZF’s energy harvesting technology has a handle on smart homes

Thu, Nov 07, 2019

Smart home devices add security and energy efficiency as well as convenience. German door and window handle manufacturer, Hoppe, has developed the eHandle ConnectHome and uses energy harvesting technology from ZF.

The window handle joins the product range as an entry-level model to detect whether a window is open or closed. With ZF’s energy harvesting generator, the RF window handle does not need batteries and can therefore be retro-fitted. Rotating the handle to open or close the window generates enough energy to send an RF signal. The position of the window handle will then be transmitted wirelessly to a central control unit which can be programmed, for example, to automatically regulate the heating to turn down if the windows are open.

The eHandle ConnectHome uses a module consisting of monostable generator and RF board, produced by ZF. The generator is based on an inductive principle meaning that the required RF energy is only generated by the mechanical actuation of the handle incorporating the switch. The data transfer is made wirelessly using the EnOcean RF protocol.

Energy harvesting switches are suitable for various control solutions within different environments and a range of applications, advises ZF.

Founded in 1915, ZF has evolved from a supplier specializing in aviation technology to a global technology company.

It supplies systems for passenger cars, commercial vehicles and industrial technology. It offers integrated solutions for established vehicle manufacturers, mobility providers and start-up companies in the fields of transportation and mobility.

ZF operates in approximately 230 locations in 40 countries.

https://switches-sensors.zf.com/

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Renesas and Altair bring best-in-class solutions to the cellular IoT market

Wed, Nov 06, 2019

Renesas Electronics, and Altair Semiconductor, jointly announced a partnership aimed at bringing ultra-small and ultra-low-power cellular IoT solutions to the global IoT market. Cellular IoT device makers will be able to use this combination of best-in-class solutions to create highly differentiated IoT products and services that offer much greater efficiencies and faster time to market. These integrated solutions will be delivered through Renesas’ sales channels, enabling cellular connectivity to all of its markets.

“We are delighted to collaborate with Altair to deliver the industry’s best cellular IoT solutions to the booming IoT market,” said Sailesh Chittipeddi, Executive Vice President and General Manager of Renesas’ IoT and Infrastructure Business Unit. “Our combined technical excellence and differentiated IP will allow us to design the smallest and lowest power multi-protocol cellular chip-to-cloud solution for Industrial IoT applications desired by our customers for their next-generation products.”

With billions of devices expected to be deployed by 2024, the IoT market demands products that operate seamlessly out of the box. Sensors, cameras, metering, tracking, and smart devices all rely on ultra-low power consumption, offering the potential for a sensor to operate in the field for 10 to 20 years without requiring any hardware maintenance.

“This collaboration makes Altair’s technology accessible to the full breadth of Renesas customers and partners ecosystem,” said Oded Melamed, CEO of Altair Semiconductor. “The Integration of Altair’s differentiated cellular IoT technology with Renesas’ industry-leading MCUs will make this great technology immediately accessible to the mass market of IoT devices and service providers.”

As a first step of this collaboration, Renesas and Altair plan to develop cellular IoT solutions with CAT-M and NB-IoT dual mode chipsets and technologies. They will also design a variety of development tools and software to further streamline the adoption of cellular IoT solutions for industrial and consumer applications. This partnership aims to achieve technical leadership in size reduction, power consumption, and IoT security.

Altair Semiconductor

Altair Semiconductor, a Sony Group Company, is a leading provider of Cellular IoT chipsets. The company’s flagship ALT1250 is the smallest and most highly integrated LTE CAT-M and NB-IoT chipset, featuring ultra-low power consumption, hardware-based security, and a carrier-grade integrated SIM (iUICC), all 5G ready.

Altair partners with leading global vendors, including G+D (Giesecke+Devrient), HERE Technologies, Murata, Sierra Wireless and WNC, to provide low-power and cost-efficient modules for a range of industrial and consumer IoT applications such as trackers, smart meters, wearables, and vehicle telematics. Altair’s chipsets have been commercially deployed on the world’s most advanced LTE networks, including AT&T, China Mobile, KDDI, SoftBank Corp., Verizon, and Vodafone.

For more information, visit www.altair-semi.com. Follow Altair on Twitter: @AltairSemi and LinkedIn: Altair Semiconductor

Renesas Electronics Corporation

Renesas Electronics Corporation (TSE: 6723) delivers trusted embedded design innovation with complete semiconductor solutions that enable billions of connected, intelligent devices to enhance the way people work and live. A global leader in microcontrollers, analog, power, and SoC products, Renesas provides comprehensive solutions for a broad range of automotive, industrial, home electronics, office automation, and information communication technology applications that help shape a limitless future. Learn more at renesas.com.

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Low-latency PHY technology prepares for industry 4.0

Module combines sensors for smart building data

ZF’s energy harvesting technology has a handle on smart homes

Renesas and Altair bring best-in-class solutions to the cellular IoT market

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