OKdo, part of Electrocomponents has added the Nvidia Jetson Nano developer kit to its offering. The Jetson Nano Developer Kit has support for desktop Linux and is compatible with many peripherals and accessories as well as ready-to-use projects and tutorials to help makers get started. According to the distributor, the Jetson platform brings artificial intelligence (AI) applications within the reach of makers, inventors, designers and engineers.
The Jetson Nano is an AI development kit is built on the same architecture and software that powers the world’s fastest supercomputers.It also features Nvidia’s JetPack software development kit, which is built on Cuda-X and is a complete AI software stack with accelerated libraries for deep learning, computer vision, computer graphics and multimedia processing to support the Jetson Nano.
The compact yet powerful Jetson Nano platform delivers 472Gflops of computing performance, consuming as little as 5W, making it suitable for object detection, video search, face recognition and heat mapping. It supports high-resolution sensors, can process multiple sensors in parallel and has modern neural networks on each sensor stream. It complements many popular AI frameworks, for developers to integrate into products.
OKdo is focused solely on single board computing (SBC) and internet of things (IoT). Richard Curtin, global senior vice president of technology at OKdo, explained: “Inspiring people to create the next big thing is close to our hearts and we are hugely excited to announce this collaboration with Nvidia to make AI more accessible for engineers globally.”
The Jetson Nano Developer Kit can be used for developing AI-powered robots, drones, intelligent video analytics enabled-devices, AI IoT devices and other autonomous machines.
A key component of OKdo’s customer promise is building an accessible range around software, hardware, services and solutions.
The Jetson Nano Development Kit is available now from OKdo.The company claims to be the first to be focused on meeting the rapidly evolving needs of SBC and IoT customers, from makers and entrepreneurs to industrial designers, educators and resellers.
Smart cities bring together technology and infrastructure to improve the lives of citizens through greater safety and efficiency. However, rising populations in large urban areas intensifies the challenges that cities face in terms of managing infrastructures and actively protecting citizens. Combine this with increased mobility of urbanising populations, with more people travelling in greater distances than ever before, and it’s clear that additional technology solutions will need to be utilised and existing ones improved. Highways agencies and police forces already use video extensively to monitor traffic congestion, respond to accidents, and spot threatening behaviour in town centres. But could these systems be optimised to make roads safer?
With greater camera resolution, they could. Enhancing the ability to recognise vehicle number plates could help tighten up enforcement of traffic rules, ultimately reducing contraventions – particularly disobeying traffic lights or junction restrictions – that cause congestion as drivers come to understand they are highly likely to be prosecuted. Enhanced traffic-flow cameras and speed cameras can also help reduce congestion and encourage safer driving. Other opportunities to improve the quality of information provided by cameras include extending the typical field of view and improving night-vision performance, both of which could be achieved by combining multiple image sensors.
In addition, combined with greater intelligence in decoding human body language, high-resolution smart cameras can become better at pre-empting disturbances so that help can be dispatched.
To achieve this, improvements are needed at both the front-end and back-end of the system. Simply upgrading to high-resolution image sensors, such as 4K sensors, greatly increases the data associated with each frame that must be captured and conditioned by edge devices and transmitted to the cloud to be stored and analysed.
Field Programmable Gate Arrays (FPGAs) are known for their ability to perform massively parallel signal processing on multiple streams of high-speed data in real-time. Xilinx’s Zynq UltraScale+ MPSoC (Multi-Processor System-on-Chip) devices, which are fabricated using today’s leading 16nm process technology, enable a single-chip solution containing a 4K video encoder implemented as hard IP that eliminates the typical signal latencies associated with chip-to-chip communications. Moreover, this year Xilinx has delivered new MIPI IP with 2.5Gbps/lane, creating the fastest peripheral interface in the market today.
Xilinx is also involved in a number of projects to develop systems such as night-vision cameras, stereo traffic snap cameras, panoramic cameras, and AI boxes for smart-city use cases.
In addition, AI technology is becoming deeply integrated into front-end and back-end video equipment, enhancing the accuracy and efficiency of the whole system. A typical back-end system that connects with smart cameras comprises a smart network video recorder, smart server and video management software (VMS). AI-powered intelligent video analysis technology is the essence of these products and smart NVR/server offers real-time video analysis with metadata. In addition, smart NVR supports intelligent index by event, achieves precision recording and saves storage space.
To improve performance here, Xilinx innovations include the Alveo™ U50 adaptable accelerator card that integrates 16nm UltraScale+™ FPGAs and high-bandwidth memory (HBM2) chips with 460GB/s bandwidth for cloud acceleration. Moreover, the latest Versal™ Adaptive Compute Acceleration Platform (ACAP) – with its multi-terabit-per-second Network on Chip (NoC) interconnect and advanced AI Engine that contains hundreds of tightly integrated VLIW SIMD processors – now moves computing capacity beyond 100 tera operations per second (TOPS @ INT8). This could dramatically improve the AI capability of intelligent video systems and significantly accelerate AI applications at the edge and in the cloud.
Smart Video Surveillance System – Edge – Cloud
Xilinx is also building the innovative ecosystem developers need to apply these advanced devices in their projects, including tools such as Vitis™ for application development and Vitis AI™ for optimising and deploying accelerated machine-learning inference.
Vitis Unified Software Platform Overview
AI technology inspires cities as they pursue their journeys towards smart safety, smart infrastructure, and smart transportation. Various advanced technologies, including innovative FPGA, MPSoC and ACAP devices, as well as AI accelerator cards that integrate these devices to accelerate their deployment in edge and cloud applications, to enable autonomous AI platforms that are capable of handling, in real-time, the enormous quantities of data that these smart cities will generate.
Future generations of AI could move our understanding of the smart city forwards from a basically reactive concept to instead embrace predictive resource management, introducing data from potentially thousands or millions of pervasively distributed sensors such as traffic sensors, parking sensors, air-quality sensors, weather sensors, ambient-light sensors, and maybe many other types, too. The smart city of today is an embryonic version of what is to come .
Trevor Weng
Industrial, Vision, Healthcare & Sciences Marketing Manager at Xilinx
For rapid product development, Renesas has introduced the RL78/G14 Fast Prototyping Board. This inexpensive, function-rich board is designed to enable rapid product development for IoT endpoint equipment. Quicker development prototyping and lower costs allows users to respond to rapid changes in technology and market needs, and reduces the time to market window for new products, says the company. Renesas also introduced the RL78/G1D BLE Module Expansion Board, which users can combine with the new prototyping board to easily add Bluetooth Low Energy wireless communication functions.
The new prototyping board is based on the RL78/G14 microcontroller, which provides the richest set of functions in the low-power RL78 family. It is suitable for motor control in portable equipment and IoT sensors as well as a wide range of IoT endpoint equipment, such as home appliances, industrial equipment, building automation and healthcare equipment.
Previously, the RL78/G14 starter kit and target boards required an external emulator. There were additional costs associated with high performance versions. The RL78/G14 Fast Prototyping Board is priced to be affordable, says Renesas and has an on-board emulator circuit with the same functions as the E2 Emulator (E2 Lite), so the user does not have to purchase additional debugging tools. The board provides access to all of the RL78/G14 signal pins and includes Arduino and Pmod interfaces for easy functional expansion.
By combining a Semtech SX1261 or SX1262 LoRa transceiver with this prototyping board, it is possible to prototype for IoT sensor devices using wireless communication based on LoRa with extended period battery drive, advised Renesas. The company also provides circuit diagrams, parts lists and user manuals necessary to jump-start development, in addition to sample code and application notes related to these products.
The RL78/G14 is the most powerful microcontroller in the RL78 family, achieving a numerical processing performance of 51.2DMIPS at 32MHz. It includes up to 512kbyte of flash memory and up to 48kbyte of RAM. It provides functions such as timers and 8-bit DACs. In particular, it achieves the industry’s lowest levels of current drain, 66 microA/MHZ, when the CPU is operating and 240nA in standby mode. This microcontroller is optimal for battery-powered portable equipment and IoT sensor terminals, as well as a wide range of IoT endpoint equipment.
Microchip has introduced a family of serial peripheral interface (SPI) EERAM devices that it says offers system designers up to 25 per cent cost savings over the current serial non-volatile RAM (NVRAM) alternatives.
Serial EERAM is a standalone serial SRAM that includes shadow non-volatile back-up. The SPI EERAM family introduces four SPI densities to Microchip’s EERAM portfolio, ranging from 64kbit up to 1Mbit.
They can be used for applications that require repetitive task data-logging and which must be able to automatically restore content if power is disrupted during processing. Target applications range from smart meters to manufacturing lines.
Current low-density (64kbit to 1Mbit) NVRAMs used for these data logs are typically the highest price-per-bit memory in the resulting end products, notes Microchip.
The EERAM standalone non-volatile RAM uses the same SPI and I2C protocols as serial SRAM, enabling devices to retain SRAM content during power loss without using an external battery. All non-volatile parts are invisible to the user. When the device detects power going away, it automatically transfers the SRAM data to non-volatile storage, moving it back to the SRAM once power returns.
In manufacturing lines, for example, stations handle up to millions of tasks over their lifetimes and lost data during a task can require overhauling or discarding items. EERAMs automatically store SRAM content in these settings, allowing the manufacturing line to resume where the task was disrupted.
The primary reason EERAM is available at a lower price point is the use of standard CMOS and flash processes. As the highest volume and most widely used processes and can offer the best reliability and lowest cost in the industry, explains Microchip.
Alternatives such as ferroelectric RAM (FRAM) use a specialty process, which results in higher costs and unstable long-term supply, argues Microchip.
This EERAM family comes with Microchip’s customer-driven obsolescence practice, which helps ensure availability to customers for as long as needed.
The 48L640 (64kbit SPI), 48L256 (256kbit SPI), 48L512 (512kbit SPI) and 48LM01 (1Mbit SPI) devices are available in eight-pin SOIC, SOIJ and DFN packages in volume production.
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