Lynx software bundles strength mission-critical edge computing

Software bundles, based on Lynx MOSA.ic have been introduced by Lynx Software Technologies. Initial introductions are for industrial, unmanned aerial vehicles/satellites and avionics.

Lynx MOSA.ic for Industrial, Lynx MOSA.ic for UAVs/Satellites, and Lynx MOSA.ic for Avionics bundles bypass the restrictions imposed by typical embedded approaches to mission-critical systems, allowing developers to create edge computing with robust system-safety mechanisms, security and real-time determinism with sub-microsecond latency, says the company.

Lynx’ secure hypervisor technology, which has been proven in mission-critical environments including commercial aviation, healthcare, and military aircraft and helicopters, is at the heart of the bundles.

Pavan Singh, vice president, product management at Lynx, observed: “Each is designed to let developers of security and safety critical systems, including certifiable systems, take advantage of powerful workflows and techniques such as containers and sensor fusion, easily connect to cloud services, and to scale and adapt intelligently to changing market requirements.”

The bundles are tailored to handle emerging use cases, such as industrial robotics, drone aviation, and complex satellite constellations carrying payloads owned and accessed by multiple users. The Lynx MOSA.ic bundles provide the tools needed to deploy systems efficiently and manage assets securely and safely, while letting developers create, certify, and deploy robust platforms cost-effectively, said Lynx.

The three initial domain-optimised offerings contain common features of the MOSA.ic software framework, including real-time operating systems (RTOS), bare metal and third party operating systems. Lynx MOSA.ic for Avionics and Lynx MOSA.ic for UAVs/Satellites support Arm and x86 processor architectures. Both include LynxOS-178, Lynx’s DO-178 certified operating system, the LynxSecure separation kernel hypervisor, Linux, a set of tools and support for the SR-IOV extension to the PCIe specification.

The initial alpha release of MOSA.ic for Industrial removes Lynx’s RTOS and adds Azure IoT Edge and Windows 10 support for x86 platforms. It also provides Virtual PLC functionality to let manufacturers quickly scale, reconfigure and update software-driven capacity, says Lynx.

Future iterations will extend capabilities including guest operating systems, IoT connectivity, and processor architectures, confirmed Lynx.

http://www.lynx.com

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Wafer level automotive camera module boasts lowest power consumption

For driver monitoring systems in vehicles, OmniVision offers what is claimed to be the first automotive wafer level camera module. The reflowable OVM9284 CameraCubeChip is a 1Mpixel module which measures 6.5 x 6.5mm. It is claimed to provide maximum flexibility regarding placement within the cabin while remaining hidden from view. It also has, says OmniVision, the lowest power consumption among automotive camera modules; over 50 per cent lower than the nearest competitor.

The OVM9284 is built on OmniVision’s OmniPixel 3-GS global-shutter pixel architecture, which provides best quantum efficiency at the 940nm wavelength for high quality driver images in near or total darkness. The integrated OmniVision image sensor has a three micron pixel and a ¼ inch optical format, along with

1280 x 800 resolution.

Driver monitoring systems (DMS) is expected to be the next growth area for ADAS cameras to address driver distraction.

“Most existing DMS cameras use glass lenses, which are large and difficult to hide from drivers to avoid distraction, and are too expensive for most car models,” said Aaron Chiang, marketing director at OmniVision. “Our OVM9284 CameraCubeChip module is the world’s first to provide automotive designers with the small size, low power consumption and reflowable form factor of wafer-level optics,” he added.

The OVM9284’s integration of OmniVision’s image sensor, signal processor and wafer-level optics in a single compact package reduces the complexity of dealing with multiple vendors, and increases supply reliability while speeding development time. Furthermore, unlike traditional cameras, CameraCubeChip modules are reflowable. This means they can be mounted to a PCB simultaneously with other components using automated surface mount assembly equipment, which increases quality while reducing assembly costs.

OVM9284 module samples are available now, and mass production is expected in Q4 of 2020.

OmniVision Technologies develops digital imaging based on its award-winning CMOS imaging technology for consumer and commercial applications, including mobile phones, security and surveillance, automotive, tablets, notebooks, webcams and entertainment devices, medical and AR, VR, drones and robotics imaging systems.

http://www.ovt.com

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StratEdge adds ceramic packages for 5G infrastructure

RF packaging to support the demands of the 5G infrastructure has been added to the StratEdge portfolio. The packages, most often used to protect high-power laterally-diffused metal-oxide semiconductor (LDMOS), gallium arsenide (GaAs), silicon carbide (SiC), and gallium nitride (GaN) devices, match standard outlines developed to support cellular base stations. The company expects to supply run rates in excess of 100,000 packages.

“GaN-on-SiC devices are frequently used in 5G basestations, but these devices can have extremely high power densities, which generate a tremendous amount of localised heat,” said Casey Krawiec, vice president of global sales at StratEdge.  The packages use copper-molybdenum-copper (CMC) bases to dissipate this heat, increasing the power output for the device to operate at cooler temperatures to extend lifetime operation, raise reliability and increase efficiency, he continued.

“With our Leaded Laminate (LL) series of high-power amplifier packages, the device is mounted directly onto a layer of thermally-conductive copper so the heat quickly spreads away from the transistor hot spots, while the matched coefficient of thermal expansion (CTE) minimises the stress experienced by the device,” he continued.

StratEdge is develops products to meet the increasing demands for 5G equipment, as well as defence and commercial applications, including radar, communications, avionics, and customer premises equipment (CPE).

The company designs, produces and assembles high frequency, high power semiconductor packages for microwave, millimeter-wave, and high-speed digital devices. It also builds ceramic and moulded ceramic packages to support 5G infrastructure demands.

StratEdge was founded in 1992 to design, manufacture and provide assembly services for a high-frequency and high-power semiconductor packages operating from DC to 63+ GHz. StratEdge offers post-fired ceramic, low-cost moulded ceramic, and ceramic QFN packages, and specialises in packages for extremely demanding gallium arsenide (GaAs) and gallium nitride (GaN) devices. Markets served include telecomms for 5G, VSAT, broadband wireless, satellite, military, test and measurement, automotive, clean energy, and down-hole.

All packages are lead-free and most meet RoHS and WEEE standards.

StratEdge is ITAR-registered and an ISO 9001:2015 certified facility located in Santee, California, USA.

https://www.stratedge.com

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Mouser stocks vibration sensors from Analog Devices

Based on Analog Devices’ microelectromechanical system (MEMS) sensor technology, the ADcmXL1021-1 module is a sensing system that monitors for early indications of possible machine fatigue and failure. It can be used to support maintenance in industrial and transportation equipment to help reduce repair costs and maintain a high level of productivity.

The ADcmXL1021-1 vibration sensor by Analog Devices is now available from Mouser Electronics.

The single z-axis vibration monitoring subsystem is designed to simplify the development of smart sensor nodes in condition-based monitoring (CBM) systems. It incorporates a wide-bandwidth, low-noise MEMS accelerometer and an ADC, signal processing, data buffers, record storage and a user interface that easily works with most embedded processors, says Mouser. The ADcmXL1021-1’s signal processing includes high-speed data sampling (220ksamples per second), 4096 time sample record lengths, filtering, windowing, fast Fourier transform (FFT), user-configurable spectral or time statistic alarms, and error flags.

The ADcmXL1021-1 uses an ADXL1002 MEMS accelerometer with low noise density (26microg/√Hz) to support excellent resolution. The device’s wide DC bandwidth (10kHz) to enable tracking of key vibration signatures on many machine-based platforms. The ADcmXL1021-1 offers a high operating input range of ±50 g, making it suitable for vibration measurements in high-bandwidth industrial IoT (IIoT) and industry 4.0 applications such as vibration analysis systems that monitor and diagnose machine or system health, as well as safety shut off sensing.

Mouser also stocks the EVAL-ADCM-1 evaluation kit, which includes the ADcmXL1021-1 module, a breakout board, an ADcmXL interface board, a Cypress Semiconductor EZ-USB FX3 board and necessary cables. Engineers can connect the kit to a PC to access evaluation software for configuration of the module, register setup, data display, and data logging.

Mouser is an authorised distributor, focused on the rapid introduction of new products and technologies. It offers products from over 800 semiconductor and electronic component manufacturers and claims to stock the world’s widest selection of the latest semiconductors and electronic components for the newest design projects. The distributor’s website is continually updated and offers advanced search methods to help customers quickly locate inventory. It also houses data sheets, supplier-specific reference designs, application notes, technical design information, and engineering tools.

http://www.mouser.com

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