SMARC 2.1 industrial modules employ NXP i.MX 8M Plus processors

At Embedded World 2021 digital, congatec unveiled its latest SMARC 2.1 modules based on the NXP i.MX 8M Plus processor. The conga-SMX8-Plus modules feature four quad-core Arm Cortex-A53 based NXP i.MX 8M Plus processors and are intended for low power, embedded vision and artificial intelligence (AI) applications.

The low power SMARC 2.1 Computer-on-Modules have machine and deep learning capabilities, which allow industrial embedded systems to see and analyse their surroundings for situational awareness, visual inspection, identification, surveillance and tracking as well as gesture-based contactless machine operation and augmented reality.

The Arm Cortex-A53 based quad-core processor platform includes an integrated neural processing unit (NPU) for AI computational power and an image signal processor (ISP) for parallel real-time processing of high resolution images and video streams from the two integrated MIPI-CSI camera interfaces.

The ecosystem includes application-ready 3.5-inch carrier boards, Basler camera and AI software stack support. The credit card sized modules are intended for use in smart farming and industrial manufacturing, retail, as well as transportation, smart cities and smart buildings.

The i.MX 8M Plus processor-based SMARC modules enable responsive embedded vision and AI applications with a low power envelope. The neural processing unit (NPU) adds 2.3Toperations per second of dedicated AI computational power to the four multi-purpose Arm Cortex-A53 processor cores.

The integrated ISP processes full HD video streams with up to 3x 60 frames per second for video enhancement. There is also a DSP for local speech recognition without any cloud connection.

The module’s Cortex-M7 real-time control together with a time synchronised networking capable Ethernet port.

In addition to the encryption module (CAAM) for hardware-accelerated ECC and RSA encryption, the Arm TrustZone also integrates the resource domain controller (RDC) for isolated execution of critical software. The secure high assurance boot mode prevents the execution of unauthorised software during boot.

The SMARC 2.1 modules operate at the industrial (0°C to +60°C) or extended (-40°C to +85°C) temperature ranges. They also have in-line ECC for up to 6Gbyte LPDDR4 memory.

The modules can drive up to three independent displays and provide hardware accelerated video decoding and encoding including H.265 for high resolution camera streams delivered by two integrated MIPI-CSIs to be sent directly to the network.

For data storage, there is up to 128Gbyte eMMC, which can also operate in safe pSLC mode. Peripheral interfaces include one PCIe Gen 3, two USB 3.0, three USB 2.0, four UART as well as two CAN FD and 14 GPIO.

For real-time networking, the module offers 1x Gbit with time sensitive networking (TSN) support plus conventional GbE.

An optional M.2 WiFi and Bluetooth LE card adds wireless connectivity. Linux, Yocto 2.0 and Android operating systems are supported.

https://www.congatec.com

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Class-D amplifier adds diagnostics for audible safety alerts

The HFDA801A is a high-resolution audio amplifier that STMicroelectronics specifically designed for compact, cost-effective automotive applications.

The 2MHz switching pulse-width modulation (PWM) Class-D amplifier with a quad-bridge configuration integrates a DAC to ensure hi-fi quality sound under any load condition, with noiseless turn-on/turn-off and without creating any output artefacts. The signal-to-noise ratio is 121dB, with 120dB dynamic range and only 10μV output noise, for a high audio performance from an inexpensive small form factor component, said STMicroelectronics.

The feedback configuration with integrated L-C low-pass filter provides a wide flat frequency response up to 80kHz and minimises dependence on external components to reduce the bill of materials. The wide bandwidth allows use in high-definition (HD) audio applications, letting designers rely on excellent linearity and low distortion that are independent of the inductor and capacitor quality, the company added.

The architecture derives all required voltages internally, enabling the HFDA801A to draw its supply from the vehicle battery without the need for additional power converters. The amplifier’s load capabilities ensure stable performance even while driving high power on low impedance loads of 2Ohm on all four channels.

The integration of in-play diagnostics as well as a digital impedance meter and real-time load-current monitor, allow the HFDA801A to be used in safety-related audio applications that must demonstrate ASIL compliance, such as acoustic vehicle alerting systems (AVAS).

The HFDA801A is sampling now and will be in production in the second half of 2021. Please contact your ST sales office for pricing options and sample requests.

http://www.st.com

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Infineon adds Wi-Fi 6/6E and Bluetooth 5.2 SoC for IoT and streaming

Infineon Technology claims that its latest AIROC devices are the industry’s first 1×1 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for the IoT, enterprise and industrial applications, and the first 2×2 Wi-Fi 6/6E and Bluetooth 5.2 combo SoC for multimedia, consumer and automotive applications.

The Wi-Fi 6/6E devices operate in the 2.4, 5.0 and the new, greenfield 6.0GHz spectrum for minimal latency. Intended uses are for high quality video and audio streaming applications like gaming consoles, augment reality/virtual reality (AR/VR), smart speakers, media-streaming devices and automotive infotainment as well as applications that require an instant response, such as security systems and industrial automation.

The Bluetooth 5.2 technology enables high quality audio with LC3 and enable new Bluetooth Low Energy audio use cases such as audio sharing and audio broadcast. The low power wake-on-Bluetooth Low Energy mode allows the host CPU to conserve power while the Bluetooth core autonomously ‘listens’ for incoming connection requests.  Infineon’s unique Smart Coex maximises Wi-Fi throughput when used concurrently with Bluetooth, and optimises the device for multimedia use cases.

The AIROC Wi-Fi 6/6E-certified devices double the wireless coverage range, compared with Wi-Fi 5 and Wi-Fi 4 and deliver 40 per cent more coverage than typical Wi-Fi 6/6E solutions, says Infineon. The robust connection enhances interference mitigation while the low latency and co-existence of Wi-Fi and Bluetooth improve multimedia streaming and gaming responsiveness in overlapping network environments, reports Infineon.

Multi-layer security protections with secured boot, firmware authentication and encryption, and lifecycle management, introduce a higher level of security for IoT applications.

The AIROC Wi-Fi 6 / 6E and Bluetooth 5.2 combo is currently sampling to select customers.

It will be on display at Infineon’s virtual Embedded Solutions Conference 2021 (1 – 5 March): www.infineon.com/embeddedworld

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SiPM array is qualified for automotive lidar use

Lidar capabilities have been added to ON Semiconductor’s intelligent sensing portfolio, with the addition of the RDM-series silicon photo-multiplier (SiPM) array. The ArrayRDM-0112A20-QFN is the first automotive-qualified SiPM product in the market, claims ON Semiconductor.

The monolithic (1 X 12) array of SiPM pixels, enables high sensitivity to near-infra red (NIR) light to achieve 18.5 per cent photon detection efficiency (PDE) at 905nm. The high internal gain of the SiPM allows sensitivity down to the single photon level, which, combined with the high PDE, detects the faintest return signals for a longer distance range, even with low reflective targets, says ON Semiconductor.

SiPM technology has become the sensor of choice for depth sensing applications. They can deliver the highest signal-to-noise performance for long distance ranging in bright sunlight conditions. They also have low supply biases and low sensitivity to temperature changes, making them suitable upgrades for systems that use legacy avalanche photodiodes (APDs). The high volume CMOS process production contributes to the low detector cost, adds ON Semiconductor.

Lidar is used in vehicles to improve safety and advanced driver assistance systems (ADAS), as well as for fully autonomous driving use cases, such as robotic transportation, to safely navigate the environment in real time.

The ArrayRDM-0112A20-QFN’s high PDE allows lidar systems supporting these functions demonstrated a distance range of over 300 meters. The greater distance gives vehicles more time to respond.

The ArrayRDM-0112A20-QFN is AEC-Q102 qualified and developed in accordance with IATF 16949.

ON Semiconductor supplies semiconductor-based solutions, offering a comprehensive portfolio of energy efficient, power management, analogue, sensors, logic, timing, connectivity, discrete, SoC and custom devices. The company’s products are used by engineers in automotive, communications, computing, consumer, industrial, medical, aerospace and defence applications.

ON Semiconductor operates a responsive supply chain and quality program, a robust compliance and ethics program, and a network of manufacturing facilities, sales offices and design centres in key markets throughout North America, Europe and the Asia Pacific regions.

http://www.onsemi.com

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