AI from iBase is based on Nvidia Jetson TX2

Based on Nvidia’s Jetson TX2, the BoxPC EC-3200 is the latest compact embedded PC for use in industry, medical technology and smart cities. The industrial embedded PC is by iBase and available from TFT flat screen specialist, Distec.

The industrial embedded BoxPC EC-3200 is for applications with artificial intelligence (AI). It is based on the energy saving and powerful Nvidia Jetson TX2 processor. This fast and energy efficient processor has a dual core Denver 2 and a quad core Arm Cortex-A57 processor. “Compared to the Jetson TX1, the energy efficiency and performance has more than doubled,” explained Thomas Schrefel, product manager for Embedded at Distec. This is due to the Nvidia Pascal architecture with 256 processing units and up to 1.33T floating operations per second (TFLOPS). The EC-3200 is able to offer real AI computing power for edge applications with 8Gbyte memory and 59.7Gbyet per second memory bandwidth, he continued.

The robust design of the EC-3200 makes it suitable for use in industrial robots, medical devices, and smart cities and for devices that support collaboration in companies, said Distec.

For edge- and cloud-based AI products which require computing performance and video analysis to perform real time data processing and to overcome latency problems, the EC-3200 uses the Jetson TX2’s GPU-accelerated parallel processing to handle data-intensive and mission-critical workloads, such as deep learning applications.

The fanless EC-3200 is designed for uninterrupted operation and an extended temperature range from -20 to +60 degrees C. The Jetson TX2 has low power consumption, and is claimed to be 25 times more energy efficient than comparable desktop graphics processors.

The compact EC-3200 has 8Gbyte LPDDR4 memory and 32Gbyte eMMC. HDMI, Gigabit Ethernet, two USB 3.0 and two USB 2.0 ports are available as I/O interfaces.

The housing has a DB9 connection for RS232 or CAN bus, a micro USB slot and an external 10-pin GPIO connection. Two M.2 expansion sockets are available for expansion with optional SSD storage (2280 Key-M) and WAN modules (3042 Key-E). The operating system is based on a specially made Ubuntu 16.04 with Jetpack 3.2.1 and L4T 28.2.

https://www.distec.de/en

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Fanless embedded Rudi-AGX is for advanced AI applications

A thermally-optimised, fanless embedded system from Nvidia hardware partner, Connect Tech, the Rudi-AGX is based on the Nvidia AGX Xavier. This is claimed to be the most powerful system on module (SoM) in the Nvidia Jetson family and enables customers to deploy computationally heavy artificial intelligence (AI) workloads at the edge.

The Rudi-AGX unleashes the full potential of the Jetson AGX Xavier module, capable of running AI programs at maximum performance (Max-N), says Connect Tech, while maintaining a safe operating temperature. The edge device is designed to seamlessly deploy the next generation of autonomous vehicles, smart city applications, and intelligent video solutions.

It is equipped with an AGX Xavier SoM embedded, together with a Volta GPU with 512 Cuda cores, 64 Tensor cores. It is able to achieve an AI performance of 32Terra operations per second. Connect Tech explains that the Rudi-AGX‘s thermal optimisation allows access to the module’s full AI performance capabilities.

Rudi-AGX can be customised to specific I/O needs with both small and large batch manufacturing services available.

Connect Tech also provides other Jetson edge device options. There is the Rudi-NX, an embedded system designed to channel the performance power of the Jetson Xavier NX SoC. Pre-configured to support a variety of AI, vision, and sensor applications, Rudi-NX is a field-ready device.

Sentry-X is a ruggedised Jetson AGX Xavier powered edge device. It is tested to meet MIL-STD-810G as well as DO-160G for shock and vibration, and provides ingress protection of IP67. Sentry-X is designed with a quick-remove I/O dock for rapid extraction of the compute system, making it particularly well suited to aerospace and defence applications.

https://connecttech.com

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PCIe board brings AI to the edge

Combining the Flex Logix InferX X1 edge inference accelerator chip with Winbond Electronics’ LPDDR4X DRAM, the former’s half-height, half-length PCIe embedded processor board is designed for demanding artificial intelligence (AI) applications, such as object recognition delivered via edge servers and gateways.

The Winbond LPDDR4X chip is paired with Flex Logix’s InferX X1 edge inference accelerator chip, which is based on an architecture that features arrays of reconfigurable Tensor processors. According to the company, this provides higher throughput and lower latency at lower cost than any other existing AI edge computing when processing complex neural networking algorithms such as YOLOv3 or Full Accuracy Winograd.

To support the InferX X1’s 7.5Terra operations per second (maximum) performance, the W66CQ2NQUAHJ 4Gbit LPDDR4X DRAM offers a maximum data rate of 4267Mbits per second at a maximum clock rate of 2133MHz. To enable use in battery-powered systems and other power-constrained applications, the W66 series device operates in active mode from 1.8V or 1.1V power rails, and from a 0.6V supply in quiescent mode. It offers power saving features including partial array self-refresh.

The 4Gbit W66CQ2NQUAHJ is comprised of two 2Gbit dies in a two-channel configuration. Each die is organised into eight internal banks which support concurrent operation.

Flex Logix’s half-height, half-length PCIe embedded processor board takes advantage of Flex Logix’s architecture which includes reconfigurable optimised data paths which reduce the traffic between the processor and DRAM, to increase throughput and reduce latency.

According to Robert Chang, technology executive of DRAM product marketing at Winbond:  “The price/performance advantage of using InferX with our LPDDR4X chip has the potential to significantly expand AI applications by finally bringing inference capabilities to the mass market.”

Dana McCarty, vice president of sales and marketing for Flex Logix’s AI inference products agreed: “The combination of the unique InferX X1 processor and Winbond’s high-bandwidth LPDDR4X chip sets a new benchmark in edge AI performance. Now for the first time, affordable edge computing systems can implement complex neural networking algorithms to achieve high accuracy in object detection and image recognition even when processing data-intensive high-definition video streams.”

https://flex-logix.com

http://www.winbond.com

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SiP integrates cellular and GNSS technology

Swiss positioning and wireless communication specialist, u-blox, has integrated low power wide area (LPWA) connectivity and a global navigation satellite system (GNSS) technology into a small system in package (SiP) form factor. The Alex-R5 is a miniature cellular module designed for size-constrained asset tracking, wearable and healthcare applications.

It features the secure u-blox UBX-R5 LTE-M / NB-IoT chipset with Secure Cloud functionality and the u-blox M8 GNSS chip for location accuracy.

Alex-R5 has a small footprint of 14 x 14mm footprint. The SiP design reduces its size by half, compared to the functionally equivalent u-blox SARA-R5 module.

Its 23dBm cellular transmission power guarantees that end devices operate effectively in all signal conditions, even at cell edges, underground, or in other challenging scenarios. A dedicated GNSS antenna interface enables fully independent, simultaneous operation of the u-blox M8 GNSS chip, matching the performance of a stand-alone u-blox M8 module. To further enhance positioning, there is the u-blox IoT Location-as-a-Service with CellLocate and AssistNow (online, offline, and autonomous).

Alex-R5 is optimised for power-sensitive and battery-dependent applications, says u-blox, including wearables and connected medical devices. The lower power modes of the u-blox UBX-R5 and UBX-M8 chipsets give users options to balance power consumption and performance using GNSS Super-E mode.

The rugged SiP construction is suitable for harsh environments, where moisture or vibration would be a concern for conventional modules, says u-blox. Alex-R5 is rated at moisture sensitivity level 3 (MSL 3), offering reduced handling and device production complexity.

u-blox guarantees long-term device availability and provides lifetime support for the entire platform, down to the chipset level. Secure Cloud functionality supporting IoT-Security-as-a-Service based on an internal, hardware-based secure element enables a pre-shared key management system specifically designed for LPWA devices.

In addition, Alex-R5 futureproofs IoT devices and networks by enabling customers to software upgrade deployed devices for compatibility with 5G networks in a seamless transition as 5G networks are rolled out by mobile operators.

Engineering samples of the Alex-R5 SiP will be available by Q1, 2021.

http://www.u-blox.com

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